Coated electronic devices and associated methods
The present disclosure provides an electronic device and related method, wherein the device has a polymeric coating with low toxicity. The polymeric coating formed by exposing the electronic device to continuous plasma comprising a compound of CH 2 ═C(R 1 )—COO—R 2 , where R 1 includes —H or —CH 3 ; and where R 2 includes —(CH 2 ) 2 —(CF 2 ) m —CF 3 and m is 3 or 5.
1. A method of coating a surface of an electronic device, comprising:
exposing the surface of the electronic device to a plasma comprising a compound with the following chemical formula:
CH 2 ═C(R 1 )—COO—R 2
where R 1 includes —H or CH 3 , R 2 includes —(CH 2 ) 2 —(CF 2 ) m —CF 3 , and m is 3 or 5, so as to form a polymeric coating on the surface, the polymeric coating having an oleophobicity level of at least 5, and
placing the electronic device in one of a plurality of trays in a plasma chamber wherein each tray is proximate to a proximate electrode wherein each electrode is connected to a power source, and generates plasma to encompass the contents of each tray,
introducing the compound into the plasma chamber through a control mechanism,
wherein the polymeric coating has a low toxicity level with perfluorooctane sulfonate (PFOS) level of less than 0.1 parts per billion (ppb) and a perfluorooctanoic acid (PFOA) level of less than 0.2 parts per billion (ppb) and wherein the plasma is formed at a continuous power setting.
2. The method of claim 1 , wherein the polymeric coating has an oleophobicity level of 5 or 6.
3. The method of claim 1 , wherein the polymeric coating comprises a polymer selected from a group consisting of:
and
mixtures thereof, where n is from 2 to 100,000.
4. The method of claim 1 , further comprising introducing the compound in a plasma chamber at a flow rate from about 30 cm 3 /min to about 50 cm 3 /min, prior to exposing the surface of the electronic device to the plasma comprising the compound.
5. The method of claim 1 , wherein the plasma is a low pressure plasma of less than 1000 mTorr.
6. The method of claim 1 , wherein at least a portion of the device is opened prior to exposing the surface to the plasma.
7. The method of claim 1 , further comprising cleaning, etching, or activating the electronic device prior to exposing the surface to the plasma.
8. The method of claim 1 , further comprising degassing the electronic device prior to exposing the surface to the plasma.
9. The method of claim 1 , wherein the plasma is formed at a pressure between about 10 mTorr and about 1000 mTorr, at a temperature of about 5° C. to about 200° C., and at a frequency of about 20 kHz to about 2.45 GHz, and at a power setting from about 5 W and about 5000 W.
10. The method of claim 1 , wherein the plasma is formed at a pressure between about 20 mTorr and about 60 mTorr.
11. The method of claim 1 , wherein the plasma is formed at a temperature of about 40° C. to about 50° C.
12. The method of claim 1 , wherein the plasma is formed at a frequency of about 12 MHz to about 15 MHz.
13. The method of claim 1 , wherein the plasma is formed using a proximate electrode at a power setting ranging from about 0.017 to 0.023 W per cm 2 .
14. The method of claim 1 , wherein the polymeric coating is formed at a rate of about 25 to 75 nm of thickness on the electronic device per minute.
15. The method of claim 1 , wherein the electronic device is selected from a group consisting of a cellular phone, a personal digital assistants (PDA), a computer, a tablet computer, a music player, a camera, a video recorder, a battery, an e reader, a radio device, and a gaming device.
16. The method of claim 1 , wherein the step of exposing comprises:
placing the electronic device in a plasma chamber;
forming a continuous plasma in the plasma chamber in the presence of the compound to form a vaporized compound; and
contacting the vaporized compound with the surface of the electronic device, thereby forming the polymeric coating thereon.
17. A method of coating a surface of an electronic device, comprising:
exposing the surface of the electronic device to a plasma to form a polymeric coating comprising a polymer selected from a group consisting of:
and
mixtures thereof, where n is from 2 to 100,000 and wherein the polymeric coating has a low toxicity level with a perfluorooctane sulfonate (PFOS) level of less than 0.1 parts per billion (ppb) and a perfluorooctanoic acid (PFOA) level of less than 0.2 parts per billion (ppb),
wherein the plasma comprising a compound with the following chemical formula:
CH 2 ═C(R 1 )—COO—R 2
where R 1 includes —H or CH 3 , R 2 includes —(CH 2 ) 2 —(CF 2 ) m —CF 3 , and m is 3 or 5, so as to form a polymeric coating on the surface
placing the electronic device in one of a plurality of trays in a plasma chamber wherein each tray is proximate to a proximate electrode wherein each proximate electrode is connected to a power source, and generates plasma to encompass the contents of each tray,
introducing the compound into the plasma chamber through a control mechanism;
wherein the plasma is formed at a continuous power setting.
18. The method of claim 17 , wherein the polymeric coating has an oleophobicity level of at least 5.
19. The method of claim 17 , wherein the polymeric coating has an oleophobicity level of 5 or 6.
20. The method of claim 17 , wherein the polymeric coating is formed at a rate of about 25 to 75 nm of thickness on the electronic device per minute.
21. The method of claim 17 , wherein the electronic device is selected from a group consisting of a cellular phone, a personal digital assistants (PDA), a computer, a tablet computer, a music player, a camera, a video recorder, a battery, an e reader, a radio device, and a gaming device.
22. The method of claim 17 , wherein the plasma is formed at a power setting ranging from about 0.017 to 0.023 W per cm 2 of the proximate electrode.
23. The method of claim 1 wherein the polymeric coating has a final thickness between 250 nm and 500 nm.
24. The method of claim 1 , wherein the tray has a length and a thickness and the proximate electrode has a length and a thickness and wherein the length tray is equal to the length of the proximate electrode.
25. The method of claim 17 wherein the polymeric coating has a final thickness between 250 nm and 500 nm.
26. The method of claim 17 , wherein the tray has a length and a thickness and the proximate electrode has a length and a thickness and wherein the length tray is equal to the length of the proximate electrode.