Method of manufacturing semiconductor device
View Patent ↗Extension regions 7 are formed through implantation using offset sidewalls 6 a of a footing profile as a mask, and sidewalls 9 are formed on the offset sidewalls 6 a so that source and drain regions 10 are formed into the sidewall through implantation, so that the extension regions 7 are made separated away from both edges of the gate, contributing to enlargement in an effective gate length, and dealing with the narrowed gate pitch, without increasing the number of processes.
1. A method of manufacturing a semiconductor device comprising:
forming a gate electrode on a semiconductor substrate of a first conductive type;
forming a first insulating film on the semiconductor substrate including the gate electrode;
etching the first insulating film to form first sidewall spacers on both sides of the gate electrode;
doping second conductive type impurities with a low concentration on the surface of the semiconductor substrate using the first sidewall spacers as a mask;
forming a second insulating film on the semiconductor substrate including the first sidewall spacers;
etching the second insulating film to form second sidewall spacers on the first sidewall spacers; and
doping second conductive type impurities with a high concentration on the surface of the semiconductor substrate using the second sidewall spacers as a mask,
wherein each of the first sidewall spacers has a footing portion including a slope, an angle between a tangent line at a point of the slope and the surface of the semiconductor substrate becomes gradually small when the point becomes closer to the surface of the semiconductor substrate, and
wherein the first sidewall spacers are formed by terminating the etching of the first insulating film at the same time when detecting the exposure of the surface of the semiconductor substrate by monitoring a wavelength of plasma when etching the first insulating film, or after over-etching for a certain time.
2. The method of claim 1 , further comprising doping first conductive type impurities on the surface of the semiconductor substrate using the first sidewall spacers as a mask, after doping the second conductive type impurities with the low concentration on the surface of the semiconductor substrate using the first sidewall spacers as a mask.
3. The method of claim 1 , wherein the gate electrode comprises a metal material.
4. The method of claim 1 , wherein the gate electrode has the gate length of not more than 150 nm.
5. A method of manufacturing a semiconductor device comprising:
forming a gate electrode on a semiconductor substrate of a first conductive type;
forming a first insulating film on the semiconductor substrate including the gate electrode;
etching the first insulating film to form first sidewall spacers on both sides of the gate electrode such that each of the first sidewall spacers has a footing portion including a slope, wherein an angle between a tangent line at a point of the slope and the surface of the semiconductor substrate becomes gradually small when the point becomes closer to the surface of the semiconductor substrate; and
doping second conductive type impurities on the surface of the semiconductor substrate using the first sidewall spacers as a mask,
wherein the footing portion forms by stopping the etching of the first sidewall spacers at the same time as an exposure of the surface of the semiconductor substrate, and
wherein the exposure of the surface of the semiconductor substrate detects by monitoring a wavelength of plasma during the etching.
6. The method of claim 5 , further comprising:
forming a second insulating film on the semiconductor substrate including the first sidewall spacers;
etching the second insulating film to form second sidewall spacers on the first sidewall spacers; and
doping second conductive type impurities on a surface of the semiconductor substrate using the second sidewall spacers as a mask.
7. The method of claim 6 , wherein the doping using the second sidewall spacers as a mask forms second impurity diffusion regions.
8. The method of claim 7 , wherein the second impurity diffusion regions have higher impurity concentration than the first impurity diffusion regions.
9. The method of claim 5 , wherein the gate electrode comprises a metal material.