Method for producing an RFID transponder product, and RFID transponder product produced using the method

1. A method for production of an RFID transponder product, comprising the steps of:

a. creating a non-intersecting coil-shaped antenna structure with a chip terminal and a bridge terminal as well as a connecting structure with a chip terminal and a bridge terminal on a non-conductive carrier layer with a continuous surface,

b. contacting a naked chip to the chip terminals of the antenna structure and the chip terminal of the connecting structure in flip-chip technology,

c. creating an embedding opening matching size and location of the naked chip as well as two contacting openings matching location of the bridge terminals in at least one non-conducting compensation layer,

d. creating a bridge structure with at least two connecting terminals on a non-conducting cover layer,

e. positioning the compensation layer over the carrier layer such that the naked chip is arranged in the embedding opening of the compensation layer and the contacting openings are arranged over the bridge terminals of the antenna structure and the connecting structure and positioning the cover layer over the compensation layer such that the connecting terminals are arranged over the contacting openings of the compensation layer, and

f. connecting the carrier layer, the compensation layer, and the cover layer with each other by laminating or adhering.

2. A method according to claim 1 , wherein the antenna structure, the connecting structure, and the bridge structure are produced by printing methods.

3. A method according to claim 1 , wherein the contacting terminals of the bridge structure are produced with a greater thickness than a remainder of the bridge structure.

4. A method according to claim 1 , wherein the bridge terminals of the antenna structure and the connecting structure are produced with a greater thickness than a remainder of the antenna structure and/or the connecting structure.

5. A method according to claim 1 , wherein two compensation layers are arranged one over a top of an other, with the embedding opening and the contact openings being created in a lower of the compensation layers and only contacting openings being created in an upper of the compensation layers.

6. A method according to claim 1 , wherein the naked chip contacts the chip terminals via an adhesive.

7. A method according to claim 1 , wherein a multitude of connected RFID transponder products are produced in a roll-to-roll process, and subsequently separated.

8. A method according to claim 1 , wherein the RFID transponder product is connected at least at one side with another layer.

9. A method according to claim 8 , wherein the RFID transponder product is adhered to at least one other layer made from a fibrous material.

10. A method according to claim 8 , wherein the RFID transponder product is inserted between two additional layers made from a plastic material.

11. An RFID transponder product comprising a non-conducting carrier layer, a non-conducting compensation layer, and a non-conducting cover layer, laminated together, with

g. a non-intersecting coil-shaped antenna structure with a chip terminal and a bridge terminal, a connecting structure with a chip terminal and a bridge terminal, as well as a naked chip, contacting, in flip-chip technology, the chip terminals of the antenna structure and the connecting structure being arranged on the carrier layer,

h. an embedding opening being arranged in at least one compensation layer, matching size and location of the naked chip as well as at least two contacting openings matching location of the bridge terminals,

i. a bridge structure with two connecting terminals being arranged on the cover layer, and

j. a carrier layer, a compensation layer, and a cover layer being arranged in reference to each other such that the naked chip is arranged in the embedding opening of the compensation layer, with the contacting openings being arranged over the bridge terminals of the antenna structure and the connecting structure, the connecting terminals being arranged over the contacting openings of the compensation layer, and the contact terminals of the bridge structure being connected to the bridge terminals of the antenna structure and the connecting structure in an electrically conducting fashion.

12. An RFID transponder product according to claim 11 , wherein the antenna structure, the connecting structure, and the bridge structure are printed.

13. An RFID transponder product according to claim 11 , wherein the connecting terminals of the bridge structure show a greater thickness than remainder of the bridge structure.

14. An RFID transponder product according to claim 11 , wherein the bridge terminals of the antenna structure and the connecting structure show a greater thickness than remainder of the antenna structure and/or the connecting structure.

15. An RFID transponder product according to claim 11 , wherein two compensation layers are arranged one over a top of an other, with a lower of the compensation layers comprising the embedding opening and the contacting openings and an upper of the compensation layers comprising only the contacting openings.

16. An RFID transponder product according to claim 11 , wherein the naked chip is contacting the chip terminals via an adhesive.

17. An RFID transponder product according to claim 11 , wherein the RFID transponder product is connected at least at one side with another layer.

18. An RFID transponder product according to claim 17 , adhered to at least one other layer made from a fibrous material.

19. An RFID transponder product according to claim 17 , embedded between two additional layers made from a plastic material.