IP Library Granted Patent US 8,441,073
Granted Patent B2
US 8,441,073 · App. 13/137,381 · Granted May 14, 2013

Semiconductor device and manufacturing method for the same

Inventors: Kazuaki Nakajima (Kanagawa, JP); Kyoichi Suguro (Kanagawa, JP)
Assignee: Kabushiki Kaisha Toshiba
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Quick Facts
Patent No.
US 8,441,073
App. No.
13/137,381
Granted
May 14, 2013
Kind
B2
Abstract

In a semiconductor substrate on which are formed an N-type MOS transistor and a P-type MOS transistor, the gate electrode of the N-type MOS transistor comprises a tungsten film, which makes contact with a gate insulation film, and the gate electrode of the P-type MOS transistor comprises a tungsten film, which makes contact with a gate insulation film, and the concentration of carbon contained in the former tungsten film is less than the concentration of carbon contained in the latter tungsten film.

Claims (8)

1. A semiconductor device, comprising:

an N-type MOS transistor having a first gate electrode comprising a first conductor film, which comes in contact with a gate insulation film, at least a part of the first gate electrode is covered by an insulation film containing 1E21cm −3 or more of hydrogen; and

a P-type MOS transistor having a second gate electrode comprising a second conductor film, which comes in contact with the gate insulation film, and which contains carbon in a higher concentration than a concentration of carbon contained in the first conductor film, the P-type MOS transistor not being covered by the insulation film.

2. The semiconductor device according to claim 1 , wherein the work function of the second conductor film is not less than 4.8eV but less than 5.1eV.

3. The semiconductor device according to claim 2 , wherein the first conductor film and the second conductor film are made from the same metal material or the same alloy material.

4. The semiconductor device according to claim 1 , wherein the insulation film is a silicon nitride film.

5. The semiconductor device according to claim 1 , wherein the first gate electrode and the second gate electrode, respectively, comprise a polysilicon film having a metal silicide layer on the surface thereof, on the first conductor film and the second conductor film.

6. The semiconductor device according to claim 1 , wherein the insulation film is disposed on an interlayer insulation film formed to the same height as the first gate electrode and the second gate electrode, which are formed on a substrate.

Assignments (4)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 27, 2020
From: KIOXIA CORPORATION
To: KATANA SILICON TECHNOLOGIES LLC
Reel/Frame 052243/0355 →
CHANGE OF NAME Recorded Feb 3, 2020
From: TOSHIBA MEMORY CORPORATION
To: KIOXIA CORPORATION
Reel/Frame 051777/0705 →
MERGER AND CHANGE OF NAME Recorded Jan 31, 2020
From: TOSHIBA MEMORY CORPORATION; K.K. PANGEA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 051765/0117 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 24, 2017
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA MEMORY CORPORATION
Reel/Frame 043709/0035 →
Priority Claims (1)
JP 2005-107937 · Apr 4, 2005 · national
Continuity (3)
Division 12591162 · Nov 10, 2009
Division 11395278 · Apr 3, 2006
Related Publication 20110298055A1 · Dec 8, 2011