IP Library Granted Patent US 8,558,364
Granted Patent B2
US 8,558,364 · App. 13/137,883 · Granted Oct 15, 2013

Inductive getter activation for high vacuum packaging

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Quick Facts
Patent No.
US 8,558,364
App. No.
13/137,883
Granted
Oct 15, 2013
Kind
B2
Abstract

An approach to activating a getter within a sealed vacuum cavity is disclosed. The approach uses inductive coupling from an external coil to a magnetically permeable material deposited in the vacuum cavity. The getter material is formed over this magnetically permeable material, and heated specifically thereby, leaving the rest of the device cavity and microdevice relatively cool. Using this inductive coupling technique, the getter material can be activated after encapsulation, and delicate structures and low temperature wafer bonding mechanisms may be used.

Claims (38)

1. A method for activating a getter, comprising:

forming a magnetically permeable material on a first substrate;

forming a cavity disposed in the first substrate under the magnetically permeable material, wherein the cavity is devoid of solid material under a substantial portion of a surface of the magnetically permeable material;

forming a first layer of getter material over the magnetically permeable material;

forming a microdevice on a surface of either the first substrate or a second substrate;

providing a coil which is not mechanically or electrically coupled to the first substrate;

applying an RF signal to the coil;

heating the magnetically permeable material by inductive coupling to the coil; and

heating the getter material by thermal conduction from the magnetically permeable material, to a temperature sufficient to activate a surface of the getter material for gettering.

2. The method of claim 1 , further comprising:

encapsulating the microdevice in a device cavity defined between the first and second substrates, wherein the device cavity is in fluid communication with the surface of the getter material.

3. The method of claim 2 , wherein the device cavity is formed by bonding the first substrate to the second substrate with a low temperature bond, which adheres surfaces of the substrates with a hermetic seal at temperatures less than about 250 degrees centigrade.

4. The method of claim 2 , further comprising:

forming a second layer of the getter material on the first substrate, between the magnetically permeable material and the first substrate.

5. The method of claim 4 , wherein the cavity is under a substantial portion of a surface of the second layer of the getter material, and wherein the cavity is in fluid communication with the device cavity.

6. The method of claim 1 , wherein heating the getter material comprises heating the getter material to a temperature of at least about 400 degrees centigrade.

7. The method of claim 1 , further comprising:

driving the coil with the RF signal at between about 1 kHz and about 100 kHz, with between about 1 watt and 100 watts of RF power.

8. The method of claim 1 , further comprising:

providing a magnetic core around which the coil is wound.

9. The method of claim 1 , further comprising:

energizing the coil with the RF signal of between about 1 watt and 100 watts of RF power, while holding the coil at a distance of about 1 cm from the magnetically permeable material.

10. A device, comprising:

a magnetically permeable layer material formed on a first substrate;

a first getter material formed over the magnetically permeable layer material;

a microdevice formed on the first substrate or a second substrate, the microdevice being encapsulated in a first cavity defined by the first substrate and the second substrate;

a second cavity disposed in the first substrate under the magnetically permeable layer material, wherein the second cavity is devoid of solid material under a substantial portion of a surface of the magnetically permeable layer material: and

a coil which is inductively coupled to the magnetically permeable layer material, but not mechanically or electrically coupled to the first substrate or the second substrate.

11. The device of claim 10 , further comprising:

a power supply that provides an RF signal to the coil.

12. The device of claim 10 , further comprising:

a magnetic core around which the coil is wound.

13. The device of claim 11 , wherein the RF signal has a frequency between about 1 kHz and 100 kHz, and a power level between about 1 watt and 100 watts.

14. The device of claim 10 , further comprising:

a second getter material disposed between the first substrate and the magnetically permeable layer material.

15. The device of claim 14 , wherein the second cavity disposed under a substantial portion of a surface of the second getter material, and wherein the second cavity is in fluid communication with the first cavity.

16. The device of claim 10 , wherein the magnetically permeable layer material comprises at least one of a Ni/Fe alloy, a cobalt alloy and a manganese alloy, and has a permeability of between about 10 and 20 T.

17. The device of claim 10 , wherein the first getter material comprises at least one of vanadium, zirconium and iron, and readily absorbs contaminant gases and humidity.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Jan 30, 2019
From: PACIFIC WESTERN BANK
To: INNOVATIVE MICRO TECHNOLOGY, INC.
Reel/Frame 048195/0441 →
RELEASE OF SECURITY INTEREST Recorded Oct 15, 2018
From: AGILITY CAPITAL II, LLC
To: INNOVATIVE MICRO TECHNOLOGY, INC.
Reel/Frame 047237/0141 →
SECURITY INTEREST Recorded Nov 30, 2017
From: INNOVATIVE MICRO TECHNOLOGY, INC.
To: PACIFIC WESTERN BANK
Reel/Frame 044553/0257 →
SECURITY INTEREST Recorded Nov 30, 2017
From: INNOVATIVE MICRO TECHNOLOGY, INC.
To: AGILITY CAPITAL II, LLC
Reel/Frame 044635/0492 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 20, 2011
From: SUMMERS, JEFFERY F.
To: INNOVATIVE MICRO TECHNOLOGY
Reel/Frame 027094/0225 →