Patent Assignment
Reel/Frame 047237/0141
Release of Security Interest
Recorded: 2018-10-15
Pages: 8
Assignor
AGILITY CAPITAL II, LLC
Executed: 2018-10-15
Assignee
INNOVATIVE MICRO TECHNOLOGY, INC.
75 ROBIN HILL ROAD, GOLETA, CALIFORNIA, 93117
Covered Properties
(85)
Method and Apparatus for Assembling an Array of Micro-Devices
Patent:
6,812,061 →
Application:
09/764,913 →
Low Inertia Latching Microactuator
Optical Switch with Low-Inertia Micromirror
Microelectromechanical switch with braking algorithm
Patent:
6,351,201 →
Application:
09/825,760 →
Wafer Level Method for Probing Micromechanical Devices
Method and Apparatus for Assembling an Array of Micro-Devices
Microfabricated cross flow filter and method of manufacture
Application:
11/136,552 →
Publication:
US 2006/0266692
Antistiction MEMS substrate and method of manufacture
Application:
11/151,415 →
Publication:
US 2006/0278942
Mems Teeter-Totter Apparatus with Curved Beam and Method of Manufacture
Wafer level hermetic bond using metal alloy
Application:
11/211,622 →
Publication:
US 2007/0048887
Dual Substrate Electrostatic Mems Switch with Hermetic Seal and Method of Manufacture
Trench Plating Process and Apparatus for Through Hole Vias
Hermetic Interconnect Structure and Method of Manufacture
Multiple Switch Mems Structure and Method of Manufacture
Compact MEMS thermal device and method of manufacture
Application:
11/263,912 →
Publication:
US 2007/0096860
Method and Apparatus for Assembling an Array of Micro-Devices
Wafer Level Hermetic Bond Using Metal Alloy with Raised Feature
Hysteretic Mems Thermal Device and Method of Manufacture
Elastic Interface for Wafer Bonding Apparatus
System and Method for Forming Moveable Features on a Composite Substrate
Method and apparatus for curing epoxy-based photoresist using a continuously varying temperature profile
Application:
11/364,334 →
Publication:
US 2007/0207584
Mems Thermal Device with Slideably Engaged Tether and Method of Manufacture
Mems Device Using Nimn Alloy and Method of Manufacture
Wafer Bonding Material with Embedded Rigid Particles
Indented Structure for Encapsulated Devices and Method of Manufacture
System and Method for Providing Access to an Encapsulated Device
System and method for forming through wafer vias using reverse pulse plating
Application:
11/482,944 →
Publication:
US 2008/0006850
Singly Attached Mems Thermal Device and Method of Manufacture
Interconnect Structure Using Through Wafer Vias and Method of Fabrication
Contact Electrode for Microdevices and Etch Method of Manufacture
Current-Driven Device Using Nimn Alloy and Method of Manufacture
Hysteretic Mems Two-Dimensional Thermal Device and Method of Manufacture
Mems Thermal Actuator and Method of Manufacture
Micromechanical device with gold alloy contacts and method of manufacture
Application:
11/785,119 →
Publication:
US 2008/0250785
Lid Structure for Microdevice and Method of Manufacture
Dual Substrate Mems Plate Switch and Method of Manufacture
Gettering material for encapsulated microdevices and method of manufacture
Application:
11/819,338 →
Publication:
US 2009/0001537
Etching/Bonding Chamber for Encapsulated Devices and Method of Use
Wafer Bonding Material with Embedded Conductive Particles
Deposition/bonding chamber for encapsulated microdevices and method of use
Application:
12/007,485 →
Publication:
US 2012/0132522
Mems Plate Switch and Method of Manufacture
Removable/disposable apparatus for MEMS particle sorting device
Application:
12/149,637 →
Publication:
US 2012/0164718
Wafer level hermetic bond using metal alloy
Application:
12/222,845 →
Publication:
US 2008/0318349
System and Method for Providing Access to an Encapsulated Device
Indented Lid for Encapsulated Devices and Method of Manufacture
Hysteretic Mems Thermal Device and Method of Manufacture
Mems Thermal Actuator and Method of Manufacture
Wafer Level Hermetic Bond Using Metal Alloy with Raised Feature
Method of Manufacturing a Hysteretic Mems Two-Dimensional Thermal Device
Inlaid optical material and method of manufacture
In-Plane Electromagnetic Mems Pump
Plating Process and Apparatus for Through Wafer Features
Wafer Level Hermetic Bond Using Metal Alloy with Keeper Layer
Configurable Power Supply Using Mems Switch
Dual Substrate Mems Plate Switch and Method of Manufacture
Microfabricated electromagnetic actuator with push-pull motion
Inductive Getter Activation for High Vacuum Packaging
Method and Apparatus for Applying Thin Liquid Coatings
Patent:
8,338,283 →
Application:
13/373,969 →
Mems Particle Sorting Actuator and Method of Manufacturing
Cartridge for MEMS particle sorting system
Wafer bonding chamber with dissimilar wafer temperatures
Application:
13/385,214 →
Publication:
US 2013/0199730
Multistage cartridge for MEMS particle storing system
Wafer Level Hermetic Bond Using Metal Alloy with Keeper Layer
Exothermic Activation for High Vacuum Packaging
Patent:
8,847,373 →
Application:
13/986,467 →
Microfabricated magnetic field transducer with flux guide
Mems Particle Sorting Actuator and Method of Manufacture
Method for forming through wafer vias
Application:
13/987,871 →
Publication:
US 2015/0069618
Method Using Glass Substrate Anodic Bonding
Device Using Glass Substrate Anodic Bonding
Wafer Level Hermetic Bond Using Metal Alloy with Raised Feature and Wetting Layer
Method and Device Using Silicon Substrate to Glass Substrate Anodic Bonding
Patent:
9,156,679 →
Application:
14/326,406 →
Solder Bump Sealing Method and Device
Method for Forming Through Substrate Vias with Tethers
Method for Forming a Microfabricated Structure
Patent:
9,302,905 →
Application:
14/738,980 →
Microfabricated Optical Apparatus
Dual Substrate Electrostatic Mems Switch with Multiple Hinges and Method of Manufacture
Anodic Bonding of Dielectric Substrates
Etching Technique for Microfabrication Substrates
Patent:
9,493,877 →
Application:
15/144,735 →
Thermocompression Bonding with Raised Feature
Application:
15/149,217 →
Publication:
US 2016/0343684
Device with Separation Limiting Standoff
Application:
15/232,871 →
Publication:
US 2017/0062165
Mems Reed Switch Device
Application:
15/237,120 →
Publication:
US 2017/0062159
Microfabricated Optical Apparatus
Application:
15/272,481 →
Publication:
US 2017/0237228
Microfabricated Optical Apparatus with Integrated Turning Surface
Application:
15/355,461 →
Publication:
US 2017/0146793
Microfabricated Optical Apparatus
Application:
15/408,956 →
Publication:
US 2017/0126323
Through Substrate Vias Using Solder Bumps
Application:
15/415,919 →
Publication:
US 2017/0217767
Related Assignments
(10)
Other recorded transfers of the patents in this record — the chain of ownership.
Release
Oct 6, 2017
From: SILICON VALLEY BANK
To: INNOVATIVE MICRO TECHNOLOGY INC.
Reel/Frame 044567/0379 →
Security Interest
Nov 30, 2017
From: INNOVATIVE MICRO TECHNOLOGY, INC.
To: AGILITY CAPITAL II, LLC
Reel/Frame 044635/0492 →
Security Interest
Nov 30, 2017
From: INNOVATIVE MICRO TECHNOLOGY, INC.
To: PACIFIC WESTERN BANK
Reel/Frame 044553/0257 →
Release of Security Interest
Jan 30, 2019
From: PACIFIC WESTERN BANK
To: INNOVATIVE MICRO TECHNOLOGY, INC.
Reel/Frame 048195/0441 →
Change of Name
Dec 30, 2022
From: INNOVATIVE MICRO TECHNOLOGY, INC.
To: ATOMICA CORP.
Reel/Frame 062253/0077 →
Corrective Assignment to Correct the City of the Assignee Previously Recorded on Reel 062253 Frame 0077. Assignor(S) Hereby Confirms the Change of Name.
Jan 9, 2023
From: INNOVATIVE MICRO TECHNOLOGY, INC.
To: ATOMICA CORP.
Reel/Frame 062320/0509 →
Security Interest
Feb 23, 2023
From: ATOMICA CORP.
To: ST. CLOUD CAPITAL PARTNERS IV SBIC, L.P.
Reel/Frame 062841/0341 →
Release of Security Interest
Mar 12, 2025
From: ATOMICA CORP.
To: CENFIRE CORP
Reel/Frame 070485/0105 →
Release of Security Interest
Mar 12, 2025
From: ST. CLOUD CAPITAL PARTNERS IV SBIC, L.P.
To: ATOMICA CORP.
Reel/Frame 070485/0737 →
Corrective Assignment to Correct the Nature of Conveyance Previously Recorded on Reel 70485 Frame 105. Assignor(S) Hereby Confirms the Nature of Conveyance Should Be "Assignment".
Mar 13, 2025
From: ATOMICA CORP.
To: CENFIRE CORP
Reel/Frame 070909/0446 →