Microfabricated optical apparatus

1. A method for fabricating an optical apparatus on a substrate, comprising:

forming a device cavity in a lid wafer;

forming a through silicon via through the substrate;

disposing a light source driven by a waveform which generates optical radiation on the substrate, and coupling the light source electrically to the through silicon via;

disposing a beam shaping element on the substrate;

disposing a turning surface which redirects the beam of light;

bonding the substrate to the lid wafer to encapsulate the optical apparatus in a substantially hermetic device cavity, wherein forming the through silicon via comprises:

etching a blind trench into a front side of the substrate leaving residual substrate material;

coating the trench with an insulating material;

depositing a conductive material in the blind trench; and

removing the residual substrate material from a backside of the substrate to form the via.

2. The method of claim 1 , wherein bonding the substrate to the lid wafer comprises bonding the substrate to the lid wafer with a low temperature metal alloy bond.

3. The method of claim 1 , further comprising: forming a lens in a roof of the device cavity, on an outside surface.

4. The method of claim 1 , further comprising:

forming a lens in a roof of the device cavity, on an inside surface.

5. The method of claim 1 , wherein forming the device cavity comprises forming the device cavity with anisotropic etching, leaving inclined sidewalls in the device cavity inclined at angles of about 50 to 60 degrees with respect to a surface of the lid wafer.

6. The method of claim 5 , further comprising:

depositing a reflective surface onto at least one inclined sidewall of the device cavity.