Patent Assignment
Reel/Frame 062253/0077
Change of Name
Recorded: 2022-12-30
Pages: 5
Assignor
INNOVATIVE MICRO TECHNOLOGY, INC.
Executed: 2021-03-31
Assignee
ATOMICA CORP.
75 ROBIN HILL ROAD, SANTA BARBARA, CALIFORNIA, 93117
Covered Properties
(45)
Method and Apparatus for Assembling an Array of Micro-Devices
Patent:
6,812,061 →
Application:
09/764,913 →
Method and Apparatus for Sorting Biological Cells with a Mems Device
Method and Apparatus for Assembling an Array of Micro-Devices
Method and Apparatus for Sorting Biological Cells with a Mems Device
Method and Apparatus for Sorting Particles with a Mems Device
Dual Substrate Electrostatic Mems Switch with Hermetic Seal and Method of Manufacture
Trench Plating Process and Apparatus for Through Hole Vias
Hermetic Interconnect Structure and Method of Manufacture
Multiple Switch Mems Structure and Method of Manufacture
Mems Actuator and Method of Manufacture for Mems Particle Sorting Device
Method and Apparatus for Assembling an Array of Micro-Devices
Wafer Level Hermetic Bond Using Metal Alloy with Raised Feature
Hysteretic Mems Thermal Device and Method of Manufacture
Elastic Interface for Wafer Bonding Apparatus
System and Method for Forming Moveable Features on a Composite Substrate
Mems Thermal Device with Slideably Engaged Tether and Method of Manufacture
Mems Device Using Nimn Alloy and Method of Manufacture
Wafer Bonding Material with Embedded Rigid Particles
Indented Structure for Encapsulated Devices and Method of Manufacture
System and Method for Providing Access to an Encapsulated Device
Interconnect Structure Using Through Wafer Vias and Method of Fabrication
Contact Electrode for Microdevices and Etch Method of Manufacture
Lid Structure for Microdevice and Method of Manufacture
Dual Substrate Mems Plate Switch and Method of Manufacture
Wafer Bonding Material with Embedded Conductive Particles
Mems Plate Switch and Method of Manufacture
System and Method for Providing Access to an Encapsulated Device
Indented Lid for Encapsulated Devices and Method of Manufacture
Hysteretic Mems Thermal Device and Method of Manufacture
Wafer Level Hermetic Bond Using Metal Alloy with Raised Feature
Method of Manufacturing a Hysteretic Mems Two-Dimensional Thermal Device
Inlaid optical material and method of manufacture
In-Plane Electromagnetic Mems Pump
Plating Process and Apparatus for Through Wafer Features
Configurable Power Supply Using Mems Switch
Dual Substrate Mems Plate Switch and Method of Manufacture
Method and Apparatus for Applying Thin Liquid Coatings
Patent:
8,338,283 →
Application:
13/373,969 →
Cartridge for MEMS particle sorting system
Wafer Level Hermetic Bond Using Metal Alloy with Keeper Layer
Exothermic Activation for High Vacuum Packaging
Patent:
8,847,373 →
Application:
13/986,467 →
Microfabricated magnetic field transducer with flux guide
Mems Particle Sorting Actuator and Method of Manufacture
Method Using Glass Substrate Anodic Bonding
Device Using Glass Substrate Anodic Bonding
Method and Device Using Silicon Substrate to Glass Substrate Anodic Bonding
Patent:
9,156,679 →
Application:
14/326,406 →
Related Assignments
(12)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 23, 2006
From: CARLSON, GREGORY A.; FOSTER, JOHN S.; LIU, DONALD C.; THOMPSON, DOUGLAS L.
To: INNOVATIVE MICRO TECHNOLOGY
Reel/Frame 017812/0392 →
Assignment of Assignor's Interest
Aug 29, 2013
From: INNOVATIVE MICRO TECHNOLOGY
To: OWL BIOMEDICAL, INC.
Reel/Frame 031237/0030 →
Release
Oct 6, 2017
From: SILICON VALLEY BANK
To: INNOVATIVE MICRO TECHNOLOGY INC.
Reel/Frame 044567/0379 →
Security Interest
Nov 30, 2017
From: INNOVATIVE MICRO TECHNOLOGY, INC.
To: PACIFIC WESTERN BANK
Reel/Frame 044553/0257 →
Security Interest
Nov 30, 2017
From: INNOVATIVE MICRO TECHNOLOGY, INC.
To: AGILITY CAPITAL II, LLC
Reel/Frame 044635/0492 →
Release of Security Interest
Oct 15, 2018
From: AGILITY CAPITAL II, LLC
To: INNOVATIVE MICRO TECHNOLOGY, INC.
Reel/Frame 047237/0141 →
Release of Security Interest
Jan 30, 2019
From: PACIFIC WESTERN BANK
To: INNOVATIVE MICRO TECHNOLOGY, INC.
Reel/Frame 048195/0441 →
Corrective Assignment to Correct the City of the Assignee Previously Recorded on Reel 062253 Frame 0077. Assignor(S) Hereby Confirms the Change of Name.
Jan 9, 2023
From: INNOVATIVE MICRO TECHNOLOGY, INC.
To: ATOMICA CORP.
Reel/Frame 062320/0509 →
Security Interest
Feb 23, 2023
From: ATOMICA CORP.
To: ST. CLOUD CAPITAL PARTNERS IV SBIC, L.P.
Reel/Frame 062841/0341 →
Release of Security Interest
Mar 12, 2025
From: ATOMICA CORP.
To: CENFIRE CORP
Reel/Frame 070485/0105 →
Release of Security Interest
Mar 12, 2025
From: ST. CLOUD CAPITAL PARTNERS IV SBIC, L.P.
To: ATOMICA CORP.
Reel/Frame 070485/0737 →
Corrective Assignment to Correct the Nature of Conveyance Previously Recorded on Reel 70485 Frame 105. Assignor(S) Hereby Confirms the Nature of Conveyance Should Be "Assignment".
Mar 13, 2025
From: ATOMICA CORP.
To: CENFIRE CORP
Reel/Frame 070909/0446 →