IP Library Granted Patent US 8,466,760
Granted Patent B2
US 8,466,760 · App. 12/929,257 · Granted Jun 18, 2013

Configurable power supply using MEMS switch

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Quick Facts
Patent No.
US 8,466,760
App. No.
12/929,257
Granted
Jun 18, 2013
Kind
B2
Abstract

Systems and methods for forming a configurable power supply uses a plurality of dual substrate MEMS switches to couple a plurality of power cells to provide a selectable, or variable, output voltage. The same circuit may output two different voltages to power two different circuits of the device, or may distribute the load evenly amongst the cells. Thus, the configurable power supply may extend the lifetime and improve the reliability of the device, or decrease its weight, size and cost.

Claims (67)

1. A method for manufacturing a configurable power supply, comprising:

providing at least one MEMS switch;

providing a plurality of power cells, each supplying a portion of an output; and

coupling the at least one MEMS switch to at least one of the plurality of cells, such that the portion from at least one of the plurality of cells is combined with another portion from others of the plurality, to form a power supply circuit with an output that depends on a configuration of power cells coupled together

wherein the at least one MEMS switch comprises

a deformable plate formed in the device layer of a silicon-on-insulator switch substrate and coupled to the device layer by a plurality of spring beams;

a plurality of electrical contacts formed on a via substrate; and

the device layer of the silicon-on-insulator substrate bonded to the via substrate to form the plurality of MEMS switches.

2. The method of claim 1 , wherein providing the plurality of MEMS switches comprises:

forming a plurality of MEMS switches on a substrate;

singulating the MEMS switches;

coupling the plurality of MEMS switches to a printed circuit board; and

coupling the printed circuit board to the plurality of power cells.

3. The method of claim 2 , wherein forming the plurality of MEMS switches further comprises:

forming the deformable plate adjacent to and suspended from the switch substrate and coupled to the switch substrate by a plurality of spring beams;

forming a plurality of electrical contacts on a via substrate; and

bonding the device layer of the silicon-on-insulator substrate to the via substrate to form the plurality of MEMS switches.

4. The method of claim 2 , further comprising:

forming electrical connections between the at least one MEMS switch and the plurality of power cells; and

forming the at least one MEMS switch and the plurality of power cells on a single substrate.

5. The method of claim 1 , further comprising:

providing at least one capacitor which is coupled to at least one of the MEMS switch and one of the plurality of power cells.

6. The method of claim 5 , wherein forming the at least one electrical via comprises:

forming at least one blind hole with a dead end wall on a front side of the second substrate;

forming a seed layer in the at least one blind hole;

depositing a conductive material onto the seed layer; and

removing material from a rear side of the second substrate to remove the dead-end wall of the at least one blind hole.

7. The method of claim 1 , further comprising coupling the configurable power supply to at least one of a subcircuit of a laptop computer, a circuit in a transport vehicle, and a circuit in a computer.

8. The method of claim 3 , wherein the configuration of power cells has at least one of the following features:

excludes a non-functioning power cell from the power supply circuit;

excludes a failing power cell from the power supply circuit;

distributes a duty amongst the power cells in combination with other configurations;

provides a different output voltage from the power supply circuit compared to another configuration; and

provides a different output current from the power supply circuit compared to another configuration.

9. The method of claim 3 , wherein forming the deformable plate adjacent to and suspended from the switch substrate comprises:

etching a plurality of holes into a device layer of the silicon-on-insulator substrate;

etching a dielectric layer beneath the device layer of the silicon-on-insulator substrate through the plurality of holes; and

etching an outline of the plate in the device layer of the silicon-on-insulator substrate.

10. A configurable power supply providing an output, comprising:

a plurality of power cells, each power cell supplying a portion of the output; and

at least one MEMS switch, wherein the at least one MEMS switch is coupled to at least one of the plurality of power cells, wherein the MEMS switch couples the portion from the at least one of the plurality of power cells to another portion from others of the plurality, to form a power supply circuit which provides an output that depends on a configuration of power cells coupled together;

wherein the at least one MEMS switch comprises

a deformable plate formed in a device layer of a silicon-on-insulator switch substrate and coupled to the device layer by a plurality of spring beams;

a plurality of electrical contacts formed on a via substrate; and

wherein the device layer of the silicon-on-insulator substrate is bonded to the via substrate to form the plurality of MEMS switches.

11. The configurable power supply of claim 10 , wherein the configuration of power cells has at least one of the following features:

omits a non-functioning power cell from operation in the power supply circuit;

omits a failing power cell from operation in the power supply circuit.

12. The configurable power supply of claim 10 , wherein the configuration of power cells comprises:

a first configuration with one subset of power cells coupled together;

a second configuration with another subset of power cells coupled together,

wherein the first configuration and the second configuration have at least one of the following features:

they distribute duty evenly amongst the power cells;

they provide a variable output voltage;

they provide a variable output current.

13. The configurable power supply of claim 10 , further comprising at least one of:

an inductor;

a diode;

a capacitor;

a resistor; and

a transistor.

14. The configurable power supply of claim 10 , wherein the MEMS switches are configured in open and shut arrangements so as to provide a predetermined, variable output at a predetermined time.

15. The configurable power supply of claim 10 , wherein the MEMS switches change their open and shut arrangements under the control of a microprocessor.

16. The configurable power supply of claim 10 , wherein the MEMS switches are configured in open and shut arrangements in response to a demand of a load.

17. At least one of a laptop computer, a portable communication device, a medical device and a transport vehicle comprising the configurable power supply of claim 10 .

18. The configurable power supply of claim 10 , wherein the plurality of cells comprises a plurality of battery cells, wherein at least one battery cell comprises at least one of nickel cadmium, nickel-metal hydride, lead-acid, lithium ion, and lithium-ion polymer.

19. The medical device of claim 17 , wherein the medical device comprises at least one of a hearing aid batteries, a drug delivery pump, a pacemaker, and an implantable device.

Assignments (9)
RELEASE OF SECURITY INTEREST Recorded Mar 12, 2025
From: ST. CLOUD CAPITAL PARTNERS IV SBIC, L.P.
To: ATOMICA CORP.
Reel/Frame 070485/0737 →
SECURITY INTEREST Recorded Feb 23, 2023
From: ATOMICA CORP.
To: ST. CLOUD CAPITAL PARTNERS IV SBIC, L.P.
Reel/Frame 062841/0341 →
CORRECTIVE ASSIGNMENT TO CORRECT THE CITY OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 062253 FRAME 0077. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded Jan 9, 2023
From: INNOVATIVE MICRO TECHNOLOGY, INC.
To: ATOMICA CORP.
Reel/Frame 062320/0509 →
CHANGE OF NAME Recorded Dec 30, 2022
From: INNOVATIVE MICRO TECHNOLOGY, INC.
To: ATOMICA CORP.
Reel/Frame 062253/0077 →
RELEASE OF SECURITY INTEREST Recorded Jan 30, 2019
From: PACIFIC WESTERN BANK
To: INNOVATIVE MICRO TECHNOLOGY, INC.
Reel/Frame 048195/0441 →
RELEASE OF SECURITY INTEREST Recorded Oct 15, 2018
From: AGILITY CAPITAL II, LLC
To: INNOVATIVE MICRO TECHNOLOGY, INC.
Reel/Frame 047237/0141 →
SECURITY INTEREST Recorded Nov 30, 2017
From: INNOVATIVE MICRO TECHNOLOGY, INC.
To: PACIFIC WESTERN BANK
Reel/Frame 044553/0257 →
SECURITY INTEREST Recorded Nov 30, 2017
From: INNOVATIVE MICRO TECHNOLOGY, INC.
To: AGILITY CAPITAL II, LLC
Reel/Frame 044635/0492 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 8, 2011
From: FOSTER, JOHN S.; GUDEMAN, CHRISTOPHER S.
To: INNOVATIVE MICRO TECHNOLOGY
Reel/Frame 026147/0043 →