Granted Patent B2

US 8,245,391 · App. 12/588,060 · Granted Aug 21, 2012

Abstract

Claims (51)

1. A method of manufacturing a hysteretic micromechanical device on a surface of a substrate comprising:

forming a first beam segment configured to move in a direction having a component perpendicular to the substrate surface;

forming a second beam segment configured to move in a direction having a component parallel to the substrate surface;

forming a flexure joining the first beam segment to the second beam segment, wherein a distal end of the second beam segment is driven in a first trajectory during activation and a second trajectory during relaxation of the first beam segment and the second beam segment.

2. The method of claim 1 , wherein forming the first beam segment and the second beam segment further comprises:

forming the first beam segment coupled at a proximal end to the substrate at an anchor point, and to the flexure at a distal end;

forming the second beam segment coupled at a proximal end to the flexure, and coupled to a contact at the distal end.

3. The method of claim 2 , wherein forming the first beam segment and the second beam segment comprises:

forming a driving beam segment which expands when current is driven through the driving beam segment; and

forming a passive beam segment;

coupling to the driving beam segment to the passive beam segment with at least one dielectric tether, so that the driving beam segment transmits motion to the passive beam segment by the dielectric tether.

4. The method of claim 3 , wherein coupling the driving beam segment to the passive beam segment comprises:

applying a photo-patternable polymer over the driving beam segment and the passive beam segment;

exposing and developing the photo-patternable polymer to form the dielectric tether between the driving beam segment and the passive beam segment; and

baking the photo-patternable polymer to form the dielectric tether.

5. The method of claim 3 , further comprising:

releasing the first beam segment and the second beam segment by removing a sacrificial layer beneath the first beam segment and the second beam segment, except in the vicinity of the anchor point.

6. The method of claim 3 , wherein the at least one dielectric tether comprises a photo-patternable polymer.

7. The method of claim 2 , wherein forming the first beam segment and the second beam segment comprises:

forming the first beam segment and the second beam segment by plating at least one of nickel and a nickel alloy onto a seed layer through a photoresist stencil.

8. The method of claim 2 , further comprising:

plating a contact material on a sacrificial layer;

forming the second beam segment over the sacrificial layer such that a distal end of the second beam segment is coupled to the contact material.

9. The method of claim 2 , wherein the first beam segment and the second beam segment comprise at least one of nickel and a nickel alloy.

10. The method of claim 1 , wherein forming the first beam segment comprises:

forming a first driving beam segment which expands when current is driven through the driving beam segment; and

forming a first passive beam segment coupled to the first driving beam segment and moved by the expansion of the first driving beam segment.

11. The method of claim 10 , wherein the first driving beam segment is disposed at an average elevation different from an average elevation defined by the first passive beam segment.

12. The method of claim 11 , wherein the flexure provides a conductive path between the first driving beam segment of the first beam segment and the second driving beam segment of the second beam segment, and wherein the first passive beam segment of the first beam segment has at least one of a rectangular box shape and a triangular shape.

13. The method of claim 1 , wherein forming the second beam segment comprises:

forming a second driving beam segment which expands when current is driven through the driving beam segment; and

forming a second passive beam segment coupled to the second driving beam segment and moved by the expansion of the driving beam segment.

14. The method of claim 13 , wherein the second driving beam portion disposed adjacent to and at substantially the same average elevation as the passive beam portion.

15. The method of claim 13 , further comprising:

forming at least one stationary electrode affixed to the substrate surface, wherein the contact material is configured to make contact with the stationary electrode after the current is applied to the first and the second driving beam segments, wherein the stationary electrode comprises at least one of palladium, gold, a gold-cobalt alloy, ruthenium, platinum, gold-platinum alloy, and gold-nickel alloy.

16. The method of claim 1 , further comprising:

coupling the first beam segment to the substrate at an anchor point disposed at a proximal end of the first beam segment; and

coupling the second beam segment to the first beam segment at the flexure, wherein the flexure defines a proximal end of the second beam segment.

17. A method of manufacturing a hysteretic micromechanical device on a surface of a substrate comprising:

forming a first beam segment coupled to the substrate at an anchor point at a proximal end and configured to move in a direction having a component perpendicular to the substrate surface;

forming a second beam segment coupled to a contact a distal end, and configured to move in a direction having a component parallel to the substrate surface;

forming a flexure joining the first beam segment at a distal end and a the second beam segment at a proximal end, wherein the first beam segment and the second beam segment are driven in a first trajectory during activation and a second trajectory during relaxation

plating a contact material on a sacrificial layer;

forming the second beam segment over the sacrificial layer such that a distal end of the second beam segment is coupled to the contact material;

forming a stationary contact on the substrate surface by plating at least one of gold, palladium, a gold-cobalt alloy, ruthenium, platinum, a gold-platinum alloy, and gold-nickel alloy over the substrate surface, wherein the stationary contact interacts with the contact material on the distal end of the second beam segment to form terminals of an electrical switch.

18. The method of claim 17 , further comprising:

forming the contact material at a distal end of the second beam segment, and wherein the flexure is located at about ⅔ of a distance from the anchor point to the distal end of the second beam segment.

19. An apparatus for forming a hysteretic micromechanical device on a surface of a substrate, comprising:

means for forming a first beam segment configured to move in a direction having a component perpendicular to the substrate surface;

means for forming a second beam segment configured to move in a direction having a component parallel to the substrate surface;

means for forming a flexure joining the first beam segment to the second beam segment, wherein a distal end of the second beam segment is driven in a first trajectory during activation and a second trajectory during relaxation of the first beam segment and the second beam segment.

Assignments (9)