IP Library Granted Patent US 7,057,245
Granted Patent B2
US 7,057,245 · App. 10/866,123 · Granted Jun 6, 2006

Method and apparatus for assembling an array of micro-devices

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Quick Facts
Patent No.
US 7,057,245
App. No.
10/866,123
Granted
Jun 6, 2006
Kind
B2
Abstract

The invention describes a method and apparatus for deploying micromachined actuators in a plane which is orthogonal to the original fabrication plane of the devices. Using batch-processing, photolithographic procedures known in the micromachined electro-mechanical system (MEMS) art, a plurality of devices is constructed on a suitable substrate. The devices are then separated one from another by sawing and dicing the original fabrication wafer. The devices are rotated into an orthogonal orientation and affixed to a second wafer. The second wafer also contains circuitry for addressing and manipulating each of the devices independently of the others. With this method and apparatus, arrays of actuators are constructed whose plane of actuation is perpendicular to the plane of the array. This invention is useful for constructing N×M fiber optic switches, which direct light from N input fibers into M output fibers.

Claims (17)

1. An array of lithographically fabricated MEMS devices comprising:

a plurality of individual dies including at least one MEMS device, each die having been separated from adjacent dies on an original fabrication wafer, with each die of the plurality positioned on a second wafer, and affixed mechanically to said second wafer.

2. The array of lithographically fabricated MEMS devices according to claim 1 , wherein each individual die in the array is connected electrically to supporting circuiting in said second wafer.

3. The array of lithographically fabricated MEMS devices according to claim 1 , wherein said second wafer comprises electronic circuitry to manipulate said at least one MEMS devices.

4. The array of lithographically fabricated MEMS devices according to claim 1 , wherein each individual die has been rotated out of an original plane of fabrication.

5. The array of lithographically fabricated MEMS devices according to claim 1 , wherein the dies in the array are not all alike.

6. The array of lithographically fabricated MEMS devices according to claim 1 , wherein the at least one MEMS device comprises a utilitarian feature affixed to a MEMS microactuator.

7. The array of lithographically fabricated MEMS devices according to claim 1 , wherein the at least one MEMS device comprises a fluid flow diverter affixed to a MEMS microactuator.

8. The array of lithographically fabricated MEMS devices according to claim 1 , wherein the at least one MEMS device comprises an electrical relay affixed to a MEMS microactuator.

9. The array of lithographically fabricated MEMS devices according to claim 6 , wherein the utilitarian feature of at least one of the MEMS devices differs from the utilitarian feature of at least one other of the MEMS devices.

10. The array of lithographically fabricated MEMS devices according to claim 6 , wherein the utilitarian feature is the same for each of the at least one MEMS device.

11. The array of lithographically fabricated MEMS devices according to claim 1 , wherein the at least one MEMS device comprises an optical element affixed to a MEMS microactuator.

12. The array of lithographically fabricated MEMS devices according to claim 11 , wherein said optical element comprises a mirror.

13. The array of lithographically fabricated MEMS devices according to claim 12 , wherein the array is coupled with a block of N input optical fibers and a block of M exit optical fibers, forming an N×M fiber optic switch.

14. The array of lithographically fabricated MEMS devices of claim 1 , wherein the plurality of individual dies are detached from adjacent dies on the original fabrication wafer, before being affixed to the second wafer.

15. The array of lithographically fabricated MEMS devices according to claim 1 , wherein each individual die has been rotated out of an original plane of fabrication into a rotated orientation, and affixed in the rotated orientation to the second wafer.

16. The array of lithographically fabricated MEMS devices of claim 1 , wherein the plurality of individual dies includes at least one unencapsulated MEMS device.

Assignments (11)
RELEASE OF SECURITY INTEREST Recorded Mar 12, 2025
From: ST. CLOUD CAPITAL PARTNERS IV SBIC, L.P.
To: ATOMICA CORP.
Reel/Frame 070485/0737 →
SECURITY INTEREST Recorded Feb 23, 2023
From: ATOMICA CORP.
To: ST. CLOUD CAPITAL PARTNERS IV SBIC, L.P.
Reel/Frame 062841/0341 →
CORRECTIVE ASSIGNMENT TO CORRECT THE CITY OF THE ASSIGNEE PREVIOUSLY RECORDED ON REEL 062253 FRAME 0077. ASSIGNOR(S) HEREBY CONFIRMS THE CHANGE OF NAME. Recorded Jan 9, 2023
From: INNOVATIVE MICRO TECHNOLOGY, INC.
To: ATOMICA CORP.
Reel/Frame 062320/0509 →
CHANGE OF NAME Recorded Dec 30, 2022
From: INNOVATIVE MICRO TECHNOLOGY, INC.
To: ATOMICA CORP.
Reel/Frame 062253/0077 →
RELEASE OF SECURITY INTEREST Recorded Jan 30, 2019
From: PACIFIC WESTERN BANK
To: INNOVATIVE MICRO TECHNOLOGY, INC.
Reel/Frame 048195/0441 →
RELEASE OF SECURITY INTEREST Recorded Oct 15, 2018
From: AGILITY CAPITAL II, LLC
To: INNOVATIVE MICRO TECHNOLOGY, INC.
Reel/Frame 047237/0141 →
SECURITY INTEREST Recorded Nov 30, 2017
From: INNOVATIVE MICRO TECHNOLOGY, INC.
To: PACIFIC WESTERN BANK
Reel/Frame 044553/0257 →
SECURITY INTEREST Recorded Nov 30, 2017
From: INNOVATIVE MICRO TECHNOLOGY, INC.
To: AGILITY CAPITAL II, LLC
Reel/Frame 044635/0492 →
RELEASE Recorded Oct 6, 2017
From: SILICON VALLEY BANK
To: INNOVATIVE MICRO TECHNOLOGY INC.
Reel/Frame 044567/0379 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Jan 17, 2007
From: INNOVATIVE MICRO TECHNOLOGY
To: SILICON VALLEY BANK
Reel/Frame 018767/0055 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 15, 2005
From: FEIERABEND, PATRICK E.; FOSTER, JOHN S.; MARTIN, RICHARD T.; RUBEL, PAUL J.; STOCKER, JOHN W.; SUMMERS, JEFFREY F.; WALLIS, ANDREW D.
To: INNOVATIVE MICRO TECHNOLOGY
Reel/Frame 017234/0488 →