IP Library › Granted Patent US 9,493,877
Granted Patent B1
US 9,493,877 · App. 15/144,735 · Granted Nov 15, 2016

Etching technique for microfabrication substrates

Inventors: John Harley (Santa Barbara, CA); Jeffery F. Summers (Santa Barbara, CA); Tao Gilbert (Goleta, CA)
Assignee: Innovative Micro Technology
C23F1/02C23F1/12C23F4/00H01J37/32009B81C1/00531B81C1/00539C23F1/16C23F1/38C23F1/44G03F7/0041H01J2237/334
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Quick Facts
Patent No.
US 9,493,877
App. No.
15/144,735
Granted
Nov 15, 2016
Kind
B1
Abstract

A method for creating small features in an Al/Ag/Ti multilayer stack is disclosed. The method uses a combination of wet and dry etching techniques to anisotropically etch the layers.

Claims (4)

1. An etching method for an alumina/silver/titanium multilayer stack, comprising:

applying a buffered oxide etch to etch through alumina;

applying an oxygen plasma to the exposed silver to form silver oxide; and

etching the silver oxide with ammonia.

Assignments (4)
RELEASE OF SECURITY INTEREST Recorded Jan 30, 2019
From: PACIFIC WESTERN BANK
To: INNOVATIVE MICRO TECHNOLOGY, INC.
Reel/Frame 048195/0441 →
RELEASE OF SECURITY INTEREST Recorded Oct 15, 2018
From: AGILITY CAPITAL II, LLC
To: INNOVATIVE MICRO TECHNOLOGY, INC.
Reel/Frame 047237/0141 →
SECURITY INTEREST Recorded Nov 30, 2017
From: INNOVATIVE MICRO TECHNOLOGY, INC.
To: PACIFIC WESTERN BANK
Reel/Frame 044553/0257 →
SECURITY INTEREST Recorded Nov 30, 2017
From: INNOVATIVE MICRO TECHNOLOGY, INC.
To: AGILITY CAPITAL II, LLC
Reel/Frame 044635/0492 →