Semiconductor device and method of manufacturing semiconductor device
View Patent ↗The disclosure concerns a method of manufacturing a semiconductor device including forming a plurality of fins made of a semiconductor material on an insulating layer; forming a gate insulating film on side surfaces of the plurality of fins; and forming a gate electrode on the gate insulating film in such a manner that a compressive stress is applied to a side surface of a first fin which is used in an NMOSFET among the plurality of fins in a direction perpendicular to the side surface and a tensile stress is applied to a side surface of a second fin which is used in a PMOSFET among the plurality of fins in a direction perpendicular to the side surface.
1. A semiconductor device comprising:
an insulating layer;
a plurality of fins made of a semiconductor material on the insulating layer;
a gate insulating film provided on side surfaces of the plurality of fins;
a gate electrode on the gate insulating film; and
a stress film applying a tensile stress to a side surface of a first fin which is used in an NMOSFET among the plurality of fins in a current flow direction of the NMOSFET and applying a compressive stress to a side surface of a second fin which is used in a PMOSFET among the plurality of fins in a current flow direction of the PMOSFET, the stress film being formed on side surfaces of a source and a drain regions of the fins, wherein
the stress film is filled in a spacing between the first fins which are adjacent to each other in a plane parallel to a surface of the insulating layer,
the stress film is not filled in a spacing between the second fins which are adjacent to each other in a plane parallel to a surface of the insulating layer of the second fins and is formed to provide a gap.
2. The semiconductor device according to claim 1 ,
wherein the side surface of the first fin is a crystal plane with a (100) orientation, and the side surface of the second fin is a crystal plane with a (110) orientation.
3. The semiconductor device according to claim 1 , wherein the stress film is formed of a silicon nitride film.
4. A semiconductor device comprising:
an insulating layer;
a plurality of fins made of a semiconductor material on the insulating layer;
a gate insulating film provided on side surfaces of the plurality of fins;
a gate electrode on the gate insulating film; and
a stress film applying a tensile stress to a side surface of a first fin which is used in an NMOSFET among the plurality of fins in a current flow direction of the NMOSFET and applying a compressive stress to a side surface of a second fin which is used in a PMOSFET among the plurality of fins in a current flow direction of the PMOSFET, the stress film being formed on side surfaces of a source and a drain regions of the fins,
wherein the side surface of the first fin and the side surface of the second fin are each a crystal plane with a (100) orientation.
5. The semiconductor device according to claim 4 , wherein the stress film is formed of a silicon nitride film.
6. A semiconductor device comprising:
a plurality of fins made of a semiconductor material;
a gate insulating film formed on a side surface of each of the plurality of fins;
a gate electrode formed on the gate insulating film; and
a stress material buried between the fins and gives the same stress to the fins in the NMOSFET region and the PMOSFET region, whereby the mobility of both of the NMOSFET and the PMOSFET is enhanced by the stress from the stress material.
7. The semiconductor device according to claim 6 , wherein
the side surface of the first fin and the side surface of the second fin are each a crystal plane with a (100) orientation.
8. The semiconductor device according to claim 6 , wherein the side surface of the first fin is a crystal plane with a (100) orientation, and the side surface of the second fin is a crystal plane with a (110) orientation.
9. The semiconductor device according to claim 6 , wherein the stress film is formed of a silicon nitride film.