IP Library › Granted Patent US 8,778,841
Granted Patent B2
US 8,778,841 · App. 13/137,998 · Granted Jul 15, 2014

Precursor for a Nb

Inventors: Yoshihide Wadayama (Hitachiota, JP); Katsumi Ohata (Tsuchiura, JP); Kazuhiko Nakagawa (Tsuchiura, JP); Morio Kimura (Kasumigaura, JP)
Assignee: SH Copper Products Co., Ltd.
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Quick Facts
Patent No.
US 8,778,841
App. No.
13/137,998
Granted
Jul 15, 2014
Kind
B2
Abstract

A precursor for a Nb 3 Sn superconductor wire to be manufactured by the internal diffusion method. The precursor includes Nb-based single core wires, Sn-based single core wires, and a cylindrical diffusion barrier made of Ta or Nb. Each Nb-based single core wire includes a Nb-based core coated with a Cu-based coating made of a Cu-based matrix. Each Sn-based single core wire includes a Sn-based core coated with a Cu-based coating made of a Cu-based matrix. The Nb-based single core wires and the Sn-based single core wires are regularly disposed in the diffusion barrier. The Nb-based single core wires includes at least two kinds of Nb-based single core wires having different Cu/Nb ratios and the Cu/Nb ratio is a cross sectional area ratio of the Cu-based coating to the Nb-based core.

Claims (26)

1. A method for manufacturing a precursor for a Nb 3 Sn superconductor wire, said method comprising:

coating a Nb-based core with a Cu-based matrix to provide a plurality of Nb-based single core wires;

coating a Sn-based core with a Cu-based matrix to provide a plurality of Sn-based single core wires;

inserting the plurality of Nb-based single core wires and the plurality of Sn-based single core wires that are bundled regularly into a cylindrical diffusion barrier comprising Ta or Nb; and

inserting a bulk comprising the plurality of Nb-based single core wires, the plurality of Sn-based single core wires and the diffusion barrier into a Cu-tube,

wherein the plurality of Nb-based single core wires comprises Nb-based single core wires having a Cu/Nb ratio of 0.4 or more and Nb-based single core wires having a Cu/Nb ratio of less than 0.4,

wherein the Cu/Nb ratio is a cross sectional area ratio of the Cu-based coating to the Nb-based core, and

wherein a diameter of a region, in which the Nb-based single core wires having the Cu/Nb ratio of less than 0.4 are adjacent to each other, is 300 μm or less.

2. A method for manufacturing a precursor for a Nb 3 Sn superconductor wire, said method comprising:

coating a Nb-based core with a Cu-based matrix to provide a plurality of Nb-based single core wires;

coating a Sn-based core with a Cu-based matrix to provide a plurality of Sn-based single core wires;

inserting the plurality of Nb-based single core wires and the plurality of Sn-based single core wires that are bundled regularly into a cylindrical diffusion barrier comprising Ta or Nb; and

inserting a bulk comprising the plurality of Nb-based single core wires, the plurality of Sn-based single core wires, and the diffusion barrier into a Cu-tube;

wherein the plurality of Nb-based single core wires comprises Nb-based single core wires having a Cu/Nb ratio of 0.4 or more and Nb-based single core wires having a Cu/Nb ratio of less than 0.4, wherein the Cu/Nb ratio is a cross sectional area ratio of the Cu-based coating to the Nb-based core,

wherein the Nb-based single core wires having the Cu/Nb ratio of less than 0.4 are arranged to be adjacent to each other around one Sn-based single core wire in each of a plurality of segments, and

wherein the plurality of segments are sectioned by the Nb-based single core wires having the Cu/Nb ratio of 0.4 or more and the Sn-based single core wires.

3. The method according to claim 1 , wherein the cylindrical diffusion barrier comprises Ta.

4. The method according to claim 1 , wherein the region, in which the Nb-based single core wires having the Cu/Nb ratio of less than 0.4 are adjacent to each other, comprises a Sn-based single core wire.

5. The method according to claim 4 , wherein the Nb-based single core wires having the Cu/Nb ratio of less than 0.4 are arranged adjacent to each other around the Sn-based single core wire in each of a plurality of segments.

6. The method according to claim 5 , wherein the plurality of segments are sectioned by the Nb-based single core wires having the Cu/Nb ratio of 0.4 or more and the Sn-based single core wires.

7. The method according to claim 1 , further comprising:

arranging radially the Nb-based single core wires having the Cu/Nb ratio of 0.4 or more in a cross section of the precursor.

8. The method according to claim 2 , wherein the cylindrical diffusion barrier comprises Ta.

9. The method according to claim 2 , wherein a diameter of a region, in which the Nb-based single core wires having the Cu/Nb ratio of less than 0.4 are adjacent to each other around said one Sn-based single core wire, is 300 μm or less.

10. The method according to claim 2 , further comprising:

arranging radially the Nb-based single core wires having the Cu/Nb ratio of 0.4 or more in a cross section of the precursor.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 21, 2013
From: HITACHI CABLE, LTD.
To: SH COPPER PRODUCTS CO., LTD.
Reel/Frame 030716/0615 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 23, 2011
From: WADAYAMA, YOSHIHIDE; OHATA, KATSUMI; NAKAGAWA, KAZUHIKO; KIMURA, MORIO
To: HITACHI CABLE, LTD.
Reel/Frame 027105/0562 →
Priority Claims (1)
JP 2010-277878 · Dec 14, 2010 · national
Continuity (1)
Related Publication 20120149579A1 · Jun 14, 2012