CUTTING FLUID COMPOSITION FOR WIRESAWING
The present invention provides an aqueous wiresaw cutting fluid composition that reduces the amount of hydrogen produced during a wiresaw cutting process. The composition is comprised of an aqueous carrier, a particulate abrasive, a thickening agent, and a hydrogen suppression agent.
1 . An aqueous wiresaw cutting fluid composition comprising:
a particulate abrasive;
an aqueous carrier containing a thickening agent; and
at least one hydrogen suppressing agent selected from the group consisting of a hydrophilic polymer, a surfactant having a hydrophobic portion comprising at least 6 carbon atoms in a chain, a silicone, and a hydrogen scavenger;
wherein the abrasive, the thickening agent and the hydrogen suppressing agent are separate and distinct components of the composition.
2 . The composition of claim 1 , wherein the at least one hydrogen suppressing agent is the surfactant having a hydrophobic portion comprising at least 6 carbon atoms in a chain, wherein the surfactant has an HLB of 18 or less.
3 . The composition of claim 1 , wherein the at least one hydrogen suppressing agent is the hydrophilic polymer, wherein the polymer has an HLB of 18 or less.
4 . The composition of claim 1 wherein the thickening agent comprises a cellulose compound.
5 . The composition of claim 1 wherein the thickening agent provides a viscosity of at least 40 cP to the carrier.
6 . The composition of claim 1 wherein the thickening agent is present at a concentration in the range of about 0.2 to about 10 percent by weight.
7 . The composition of claim 1 wherein the abrasive comprises silicon carbide, diamond or boron carbide.
8 . The composition of claim 1 comprising at least two hydrogen suppressing agents.
9 . The composition of claim 1 wherein the abrasive is present at a concentration in the range of about 30 to about 60 percent by weight.
10 . The composition of claim 1 wherein the surfactant is selected from the group consisting of an aryl alkoxylate, an alkyl alkoxylate, an alkoxylated silicone, an acetylenic alcohol, an ethoxylated acetylenic diol, a C 8 to C 22 alkyl sulfate ester, C 8 to C 22 alkyl phosphate ester, C 8 to C 22 alcohol, and an alkyl ester.
11 . The composition of claim 1 wherein the composition comprises about 0.01 to about 4 percent by weight of a silicone.
12 . The composition of claim 1 further comprising about 0.01 to about 4 percent by weight of an oxidizing agent.
13 . The composition of claim 1 wherein the composition comprises about 0.01 to about 4 percent by weight of the hydrogen scavenger.
14 . The composition of claim 13 wherein the hydrogen scavenger is selected from the group consisting of a hydrogen reactive metal compound, a hydrosilylation catalyst, an organic electron-transfer agent, and a silicon reactive metal compound.
15 . An aqueous wiresaw cutting fluid composition comprising:
a particulate abrasive;
an aqueous carrier;
a thickening agent; and
at least one hydrogen suppressing agent selected from the group consisting of a surfactant, a hydrogen-reactive metal compound, a silicon-reactive metal compound, a hydrosilylation catalyst, and an organic electron transfer agent;
wherein the surfactant comprises a hydrophobic portion and a hydrophilic portion;
the hydrophobic portion of the surfactant comprising one or more of a substituted hydrocarbon group, a non-substituted hydrocarbon group, and a silicone group; and the hydrophilic portion of the surfactant comprises one or more of a polyoxyalkylene group, an ether group, an alcohol group, an amino group, a salt of an amino group, an acidic group, and a salt of an acidic group, and wherein the abrasive, the thickening agent and the hydrogen suppressing agent are separate and distinct components of the composition.
16 . The composition of claim 15 wherein the abrasive comprises silicon carbide, diamond or boron carbide.
17 . The composition of claim 15 wherein the hydrophilic portion of the surfactant comprises one or more ether groups.
18 . The composition of claim 15 wherein the abrasive is present at a concentration in the range of about 30 to about 60 percent by weight.
19 . A method of ameliorating hydrogen generation in a wiresaw cutting process utilizing an aqueous wiresaw cutting fluid, the method comprising cutting a workpiece with the wiresaw and an aqueous cutting fluid composition of claim 1 .
20 . The method of claim 19 wherein the workpiece comprises silicon.