Thin-film semiconductor device, lateral bipolar thin-film transistor, hybrid thin-film transistor, MOS thin-film transistor, and method of fabricating thin-film transistor

1. A method of fabricating a thin-film transistor, the method comprising:

forming a semiconductor thin film including a non-single-crystal region on an insulating substrate, the semiconductor thin film having a T shaped pattern formed by a lateral portion and a width portion extended from the lateral portion;

radiating a pulse laser beam with an inverted peak pattern shape on the non-single-crystal region, thereby forming at least one crystallized region, the at least one crystallized region including at least one single-crystal grain which is crystallized in a lateral direction; and

forming an MOS-bipolar hybrid thin film transistor including a lateral bipolar thin-film transistor and a MOS thin-film transistor in the at least one crystallized region, wherein the MOS thin-film transistor and the lateral bipolar thin-film transistor are formed in the lateral portion, the MOS thin-film transistor includes a source region, a channel region and a drain region, which are formed in the semiconductor thin film,

the lateral bipolar thin-film transistor includes an emitter, a base and a collector, which are formed in the semiconductor thin film, and the lateral bipolar thin-film transistor includes a base contact portion which is formed in the width portion and electrically connected to the base.

2. The method according to claim 1 , wherein the base contact portion has an impurity concentration higher than the collector.

3. The method according to claim 2 , wherein the lateral bipolar thin-film transistor includes a collector contact portion which is formed in the width portion and electrically connected to the collector and which has an impurity concentration higher than the collector.

4. The method according to claim 1 , wherein radiating the pulse laser beam forms substantially rectangular single-crystal regions, which are arranged with a pitch.

5. The method according to claim 1 , wherein the base has a width of at least 5 μm, the width being normal to the lateral direction.

6. A method of fabricating a thin-film transistor, the method comprising:

forming a semiconductor thin film including a non-single-crystal region on an insulating substrate, wherein the semiconductor thin film has a T shaped pattern formed by a lateral portion and a width portion extended from the lateral portion;

radiating a pulse laser beam with an inverted peak pattern shape on the non-single-crystal region, thereby forming at least one crystallized region, the at least one crystallized region including at least one single-crystal grain which is crystallized in a lateral direction; and

forming an MOS-bipolar hybrid thin film transistor including a lateral bipolar thin-film transistor and a MOS thin-film transistor in the at least one crystallized region, wherein the MOS thin-film transistor and the lateral bipolar thin-film transistor are formed in the lateral portion, the MOS thin-film transistor includes a source region, a channel region and a drain region, which are formed in the semiconductor thin film,

the lateral bipolar thin-film transistor includes an emitter, a base and a collector, which are formed in the semiconductor thin film, and the lateral bipolar thin-film transistor includes a collector contact portion which is formed in the width portion and electrically connected to the collector.

7. The method according to claim 6 , wherein the collector contact portion has an impurity concentration higher than the collector.

8. The method according to claim 6 , wherein radiating the pulse laser beam forms substantially rectangular single-crystal regions, which are arranged with a pitch.

9. The method according to claim 6 , wherein the base has a width of at least 5 μm, the width being normal to the lateral direction.