Semiconductor device incorporating charge balancing
View Patent ↗A semiconductor device includes a semiconductor layer of a first conductivity type and a semiconductor layer of a second conductivity type formed thereon. The semiconductor layer of the second conductivity type is characterized by a first thickness. The semiconductor device includes a set of trenches having a predetermined depth and extending into the semiconductor layer of the second conductivity type, thereby defining interfacial regions disposed between the semiconductor layer of the second conductivity type and each of the trenches. The trenches comprises a distal portion consisting essentially of a dielectric material disposed therein and a proximal portion comprising the dielectric material and a gate material disposed interior to the dielectric material in the proximal portion of the trench. The semiconductor device further includes a source region coupled to the semiconductor layer of the second conductivity type.
1. A semiconductor device comprising:
a semiconductor layer of a first conductivity type;
a semiconductor layer of a second conductivity type formed on the semiconductor layer of the first conductivity type, wherein the semiconductor layer of the second conductivity type is characterized by a first thickness;
a body layer of the second conductivity type extending a first predetermined distance into the semiconductor layer of the second conductivity type;
a plurality of trenches extending a second predetermined distance into the semiconductor layer of the second conductivity type, wherein each of the plurality of trenches comprises a first dielectric material disposed therein, the first dielectric material including an intentionally introduced charge;
a plurality of control gates coupled to the semiconductor layer of the second conductivity type; and
a plurality of source regions of the first conductivity type coupled to the semiconductor layer of the second conductivity type; and wherein the intentionally introduced charge comprises a spatially fixed charge; the intentionally introduced charge comprises a net positive charge associated with cesium ions; the dielectric material comprises a silicon oxide material; wherein a pair of termination trenches extending through the body layer of the second conductivity type and the semiconductor layer of the second conductivity type.
2. The semiconductor device of claim 1 wherein the intentionally introduced charge comprises a net negative charge associated with at least iodine, bromine, chromium, aluminum, or chlorine ions.
3. The semiconductor device of claim 1 wherein the second predetermined distance is greater than the first thickness.
4. The semiconductor device of claim 1 further comprising a third dielectric material disposed on the plurality of trenches and the plurality of control gates.
5. The semiconductor device of claim 1 wherein the second predetermined distance is less than the first thickness.
6. The semiconductor device of claim 1 wherein each of the plurality of control gates comprises a control gate trench extends a third predetermined distance through the body layer of the second conductivity type into the semiconductor layer of the second conductivity type.
7. The semiconductor device of claim 6 wherein the second predetermined distance and the third predetermined distance are substantially equal.
8. The semiconductor device of claim 6 wherein the control gate trench comprises a second dielectric material and a control gate material disposed interior to the second dielectric material.
9. The semiconductor device of claim 8 further comprising a third dielectric material disposed on the plurality of trenches and the plurality of control gates.
10. The semiconductor device of claim 8 wherein the control gate material comprises polysilicon.
11. A semiconductor device comprising:
an N-type semiconductor layer;
a P-type semiconductor layer formed on the N-type semiconductor layer, wherein the P-type semiconductor layer is characterized by a first thickness;
a P-type body layer extending a first predetermined distance into the P-type semiconductor layer;
a plurality of trenches extending a second predetermined distance into the P-type semiconductor layer, wherein each of the plurality of trenches comprises a first dielectric material disposed therein, the first dielectric material including an intentionally introduced charge; wherein the intentionally introduced charge is sufficient to invert at least a portion of the P-type semiconductor layer;
a plurality of control gates coupled to the P-type semiconductor layer; and
a plurality of N-type source regions coupled to the P-type semiconductor layer; and wherein the intentionally introduced charge comprises a net positive charge associated with cesium ions.
12. The semiconductor device of claim 11 wherein each of the plurality of control gates comprises a control gate trench extends a third predetermined distance through the P-type body layer into the P-type semiconductor layer.
13. The semiconductor device of claim 12 wherein the control gate trench comprises a second dielectric material and a control gate material disposed interior to the second dielectric material.
14. The semiconductor device of claim 13 further comprising a third dielectric material disposed on the plurality of trenches and the plurality of control gates.
15. The semiconductor device of claim 13 wherein the control gate material comprises polysilicon.