Non-volatile memory with resistive access component
View Patent ↗Some embodiments include apparatus and methods having a memory element configured to store information and an access component configured to allow conduction of current through the memory element when a first voltage difference in a first direction across the memory element and the access component exceeds a first voltage value and to prevent conduction of current through the memory element when a second voltage difference in a second direction across the memory element and the access component exceeds a second voltage value, wherein the access component includes a material excluding silicon.
1. An apparatus comprising:
a first device level including a first memory cell;
a second device level stacked over the first device level, the second device level including a second memory cell, each of the first and second memory cells including a memory element and an access component coupled to the memory element, the access component includes a material, wherein the material excludes silicon;
a first conductive line and a second conductive line coupled to the first memory cell, wherein the first conductive line is substantially perpendicular to the second conductive line; and
a third conductive line and a fourth conductive line coupled to the second memory cell, wherein the third conductive line is substantially perpendicular to the fourth conductive line.
2. The apparatus of claim 1 , wherein the material of the access component includes silver-doped germanium sulfide (GeS).
3. The apparatus of claim 1 , wherein the material of the memory element includes a phase change material.
4. The apparatus of claim 3 , wherein the material of the access component includes silver-doped germanium selenide (GeSe).
5. An apparatus comprising:
a first device level including a first memory cell;
a second device level stacked over the first device level, the second device level including a second memory cell, each of the first and second memory cells including a memory element and an access component coupled to the memory element, the access component includes a material, wherein the material excludes silicon; and a conductive line between the first and second device levels, wherein the conductive line is shared by the first and second memory cells.
6. The apparatus of claim 5 , further comprising a first electrode, a second electrode, a third electrode, and a fourth electrode, wherein the first memory cell is coupled between the first and second electrode, and the second memory cell is coupled between the third and fourth electrodes.
7. The apparatus of claim 6 , further comprising a first additional conductive line coupled to the first electrode, and a second additional conductive line coupled to the fourth electrode.
8. The apparatus of claim 7 , wherein the conductive line is substantially perpendicular to the first and second additional conductive lines.
9. The apparatus of claim 7 , wherein the first memory cell is configured to conduct current between the first and second electrodes when a voltage value of a signal on the conductive line is greater than a voltage value of a signal on the first additional conductive line, and wherein the second memory cell is configured to conduct current between the third and fourth electrodes when a voltage value of a signal on the conductive line is greater than a voltage value of a signal on the second additional conductive.
10. A method comprising:
forming memory material of a memory element; and
forming an access component coupled in series with the memory element, wherein the access component includes a material, wherein the material excludes silicon and includes a bipolar switching material, wherein forming the memory element and the access component includes:
depositing multiple layers of materials that form at least a portion of the memory cell; and
removing a portion of each layer of the multiple layers to form a pillar, wherein the memory element includes a first part of the pillar and the access component includes a second part of the pillar.
11. The method of claim 10 , wherein a third part of the pillar forms an electrode of the memory cell, and wherein the third part is between the first and second parts of the pillar.
12. The method of claim 10 , wherein the pillar includes a cross-section with a substantially circular shape.
13. The method of claim 10 , further comprising forming an electrode of the memory cell, wherein depositing the multiple layers of materials includes:
depositing a unipolar switching memory material contacting the electrode; and
depositing a bipolar switching material over the unipolar switching memory material.
14. The method of claim 10 , further comprising:
depositing multiple additional layers of materials over the pillar; and
removing a portion of each layer of the multiple additional layers to form an additional pillar, wherein the additional pillar includes a first part that forms a memory element of an additional memory cell and a second part that forms an access component of the additional memory cell.
15. The method of claim 14 , further comprising:
forming an electrode over the pillar before depositing the multiple additional layers over the pillar, wherein the electrode directly contacts the pillar and directly contacts the additional pillar.
16. The method of claim 10 , wherein the bipolar switching material includes one of ion conducting chalcogenide, binary metal oxide, and perovskite oxide.
17. The method of claim 16 , wherein the multiple layers of materials include a compound of germanium, antimony, and tellurium.