Semiconductor with through-substrate interconnect

1. A method of fabricating a semiconductor device comprising:

forming a conductive interconnect in a via that extends from a first side toward a second side of silicon substrate, the conductive interconnect having a first end proximate the first side of the silicon substrate and a second end proximate the second side of the silicon substrate;

forming a first dielectric structure proximate the first side of the silicon substrate;

forming a first metal routing structure at the first dielectric structure, the first metal routing structure being at least partially in the first dielectric structure;

forming a second dielectric structure having at least a first opening generally corresponding to the first metal routing structure, a second opening generally corresponding to the conductive interconnect, and a third opening; and

forming a first conductive portion in the first opening, a second conductive portion in the second opening, and a second metal routing structure in the third opening.

2. The method of claim 1 wherein:

the method further includes:

fabricating a transistor having a gate and source/drain implant regions in the silicon substrate;

forming an insulating material on the silicon substrate with the fabricated transistor;

forming a contact extending through the insulating material to the transistor, the contact having a first end proximate the gate and source/drain implant regions of the transistor and a second end opposite the first end;

etching the via includes etching a via through the dielectric material and into the silicon substrate laterally adjacent to the transistor, the via extending deeper into the silicon substrate than the source/drain implant regions of the transistor; and

forming the metal routing structure includes:

forming an opening in the dielectric material, the opening exposing the second end of the contact and being laterally spaced apart from the via; and

filling the opening with a conductive material.

3. The method of claim 1 wherein the second opening includes a plurality of openings generally corresponding to the conductive interconnect.

4. The method of claim 1 wherein the first metal routing structure is laterally spaced apart from the conductive interconnect.

5. The method of claim 1 wherein forming a conductive interconnect includes

depositing a photo resist material at the first dielectric structure;

patterning the photo resist material;

selectively removing the photo resist material to create an opening that extends into the first dielectric structure; and

wherein a cross-section of the opening is one of a circle, oval, square, diamond or rectangle.

6. The method of claim 1 wherein the first dielectric structure comprises at least a first layer, a second layer and a third layer, where the first layer is proximate the first side of the silicon substrate, the third layer is proximate the second side of the silicon substrate and the second layer is located between the first layer and the third layer.

7. The method of claim 1 wherein the first dielectric structure comprises at least a first layer, a second layer and a third layer, where the first layer is proximate the first side of the silicon substrate, the third layer is proximate the second side of the silicon substrate and the second layer is located between the first layer and the third layer;

wherein forming a conductive interconnect further includes

depositing a photo resist material at the first dielectric structure;

patterning the photo resist material;

selectively removing the photo resist material to create an opening that extends into the first dielectric structure; and

selectively removing a portion of the first, second or third layers.

8. The method of claim 7 wherein selectively removing a portion of the first, second and third layers includes performing an etching operation that is one of a dry etching process, a steady state style process, a cryogenic silicon etch process, a laser ablation process, a particle blasting process, a wet etching process and a micro electro discharge machining process.

9. The method of claim 1 wherein the first dielectric structure comprises at least a first layer, a second layer and a third layer, where the first layer is proximate the first side of the silicon substrate, the third layer is proximate the second side of the silicon substrate and the second layer is located between the first layer and the third layer;

wherein forming a conductive interconnect further includes

depositing a photo resist material at the first dielectric structure;

patterning the photo resist material;

selectively removing the photo resist material to create an opening that extends into the first dielectric structure;

selectively removing a portion of the first, second or third layers; and

selectively removing a portion of the silicon substrate.

10. The method of claim 9 wherein either step of selectively removing a portion of the first, second and third layers or selectively removing a portion of the silicon substrate includes performing an etching operation that is one of a dry etching process, a steady state style process, a cryogenic silicon etch process, a laser ablation process, a particle blasting process, a wet etching process and a micro electro discharge machining process.

11. The method of claim 1 which further includes

depositing a first barrier layer at a top surface of the silicon substrate and at an exposed surface of the via;

depositing an oxide layer at the first barrier layer;

depositing a second barrier layer at the oxide layer; and

depositing a metal seed layer at the second barrier layer.

12. The method of claim 1 which further includes

depositing a first barrier layer at a top surface of the silicon substrate and at an exposed surface of the via;

depositing an oxide layer at the first barrier layer;

depositing a second barrier layer at the oxide layer;

depositing a metal seed layer at the second barrier layer; and

depositing a plating mask layer at the metal seed layer.

13. The method of claim 1 which further includes

depositing a first barrier layer at a top surface of the silicon substrate and at an exposed surface of the via;

depositing an oxide layer at the first barrier layer;

depositing a second barrier layer at the oxide layer;

depositing a metal seed layer at the second barrier layer;

depositing a plating mask layer at the metal seed layer; and

filling the via with a solid metal.

14. The method of claim 1 which further includes

depositing a first barrier layer at a top surface of the silicon substrate and at an exposed surface of the via;

depositing an oxide layer at the first barrier layer;

depositing a second barrier layer at the oxide layer;

depositing a metal seed layer at the second barrier layer;

depositing a plating mask layer at the metal seed layer;

filling the via with a solid metal; and

wherein filling the via with a solid metal includes a plating process that is one of an electrochemical deposition process, a CVD process, a PVD process, a chemical process, an auto-catalytic process, a nano-particle process and a conductive polymer process.

15. The method of claim 1 which further includes

depositing a first barrier layer at a top surface of the silicon substrate and at an exposed surface of the via;

depositing an oxide layer at the first barrier layer;

depositing a second barrier layer at the oxide layer;

depositing a metal seed layer at the second barrier layer;

depositing a plating mask layer at the metal seed layer;

filling the via with a solid metal;

removing the metal seed layer extending vertically above the first dielectric structure;

removing the solid metal extending vertically above the first dielectric structure; and

wherein removing the metal seed layer and removing the solid metal is accomplished through use of a planarizing process.