HEATER BLOCK FOR WIRE BONDING SYSTEM
A heater block for a wire bonding system includes a mounting base configured to receive a lead frame and a semiconductor die mounted on the lead frame. A heating structure is removably coupled to a top surface of the mounting base. The heating structure includes a central heating surface and side heating panels surrounding the central heating surface. The heating structure selectively heats wire bonding areas of the lead frame.
1 . A heater block for a wire bonding system, comprising:
a mounting base configured to receive a lead frame and a semiconductor die mounted on the lead frame; and
a heating structure removably coupled to a top surface of the mounting base, the heating structure comprising a central heating surface and side heating panels surrounding the central heating surface, wherein the heating structure selectively heats wire bonding areas of the lead frame.
2 . The heater block of claim 1 , wherein the mounting base comprises an insulating material.
3 . The heater block of claim 2 , wherein the mounting base comprises ceramic, or plastic, or combinations thereof.
4 . The heater block of claim 1 , wherein the central heating surface is configured to heat a die flag of the lead frame and the side heating panels are configured to heat bond areas of the lead frame.
5 . The heater block of claim 1 , wherein the heating structure comprises integrated heating elements.
6 . The heater block of claim 1 , wherein the heating structure is coupled to the mounting base using an adhesive or a fastener.
7 . The heater block of claim 1 , wherein the heating structure comprises a thermally conductive material.
8 . The heater block of claim 7 , wherein the heating structure comprises a metal.
9 . The heater block of claim 1 , wherein the mounting base is attached to the wire bonding system.
10 . A heating structure for a heater block of a wire bonding system, comprising:
a central heating surface configured to heat a die flag of a lead frame; and
side heating panels disposed about the central heating surface, wherein the central heating surface and the side heating panels are configured to selectively heat wire bonding areas of the lead frame for wire bonding die bonding pads of a semiconductor die to leads of the lead frame.
11 . The heating structure of claim 10 , wherein the heating structure is removably coupled to the heater block.
12 . The heating structure of claim 11 , wherein the heating structure is coupled to an insulative mounting base of the heater block.
13 . The heating structure of claim 11 , wherein the central heating surface and the side heating panels comprise a thermally conductive material.
14 . The heating structure of claim 11 , wherein a thickness of the central heating surface and the side heating panels is in a range of about 5 mm to about 15 mm.
15 . The heating structure of claim 11 , wherein the heating structure is generally rectangular and comprises four side heating panels.
16 . A method of wire bonding a semiconductor die to a lead frame, the method comprising:
mounting the semiconductor die to the lead frame;
placing the lead frame and the mounted semiconductor die on a mounting base of a heater block of a wire bonding system;
selectively heating wire bonding areas of the lead frame with a heating structure of the heater block; and
wire bonding die pads of the semiconductor die to leads of the lead frame using bond wires.
17 . The method of wire bonding of claim 16 , further comprising isolating selective areas of the heater block from the heating structure.
18 . The method of wire bonding of claim 16 , wherein the mounting base comprises an insulating material.
19 . The method of wire bonding of claim 16 , wherein the heating structure comprises a thermally conductive material.
20 . The method of wire bonding of claim 16 , wherein the heating structure comprises a central heating surface and side heating panels that heat the wire bonding areas of the lead frame.