Reflective pockets in LED mounting
An LED device with improved LED efficiency is presented. An LED die is positioned within a pocket formed by a substrate and an opening in a supporting layer arranged thereon. The increase in the LED efficiency is achieved by providing a device where at least a portion of the pocket surface is reflective. This portion of the pocket surface is reflective because it is covered by either a reflective layer of foil or film, or a reflective coating, or it is polished.
1. A method of forming an LED device comprising
providing a substrate having a top surface;
providing a supporting layer having a supporting layer top surface, a supporting layer bottom surface and walls substantially perpendicular to the supporting layer top surface and the supporting layer bottom surface, the walls defining an opening in the supporting layer;
arranging the supporting layer on the substrate top surface wherein the walls and the substrate top surface form a pocket having pocket walls and a pocket bottom that form a pocket surface;
forming a reflective layer by shaping a reflective layer material to form an insert fitting the pocket;
arranging the reflective layer in the pocket so that it covers at least a portion of the pocket surface;
depositing a dielectric layer on the top surface of the supporting layer so that the dielectric layer does not block access to the pocket.
2. The method of claim 1 wherein multiple LED devices are formed on the substrate.
3. The method of claim 1 wherein the reflective layer material is foil.
4. The method of claim 1 wherein the reflective layer material is film.
5. The method of claim 1 where the forming step further comprises depositing a reflective material on an upper surface of the reflective layer.
6. The method of claim 1 further comprising
forming electrode pads over the dielectric layer;
arranging an LED die in the pocket;
connecting the LED die to the electrode pads by wires.
7. The method of claim 6 further comprising
filling the pocket with phosphor.
8. A method of forming an LED device comprising
providing a substrate having a top surface;
providing a supporting layer having a supporting layer top surface, a supporting layer bottom surface and walls substantially perpendicular to the supporting layer top surface and the supporting layer bottom surface, the walls defining an opening in the supporting layer;
arranging the supporting layer on the substrate top surface wherein the walls and the substrate top surface form a pocket having pocket walls and a pocket bottom that form a pocket surface;
forming a reflective layer by depositing a reflective coating over at least a portion of the pocket surface;
depositing a dielectric layer on the supporting layer top surface so that the dielectric layer does not block access to the pocket.
9. A method of forming an LED device comprising
providing a substrate having a substrate top surface;
polishing at least a portion of the substrate top surface;
providing a supporting layer having a supporting layer top surface, a supporting layer bottom surface and walls substantially perpendicular to the supporting layer top surface and the supporting layer bottom surface, the walls defining an opening in the supporting layer;
polishing at least a portion of the walls;
arranging the supporting layer on the substrate top surface wherein the walls and the substrate top surface form a pocket having pocket walls and a pocket bottom that form a pocket surface;
depositing a dielectric layer on the top surface of the supporting layer so that the dielectric layer does not block access to the pocket.
10. The method of claim 9 where the polishing of the at least a portion of the substrate top surface and the polishing of the walls occurs after the supporting layer is arranged on the substrate top surface.