IP Library Granted Patent US 8,592,905
Granted Patent B2
US 8,592,905 · App. 13/169,008 · Granted Nov 26, 2013

High-voltage semiconductor device

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Quick Facts
Patent No.
US 8,592,905
App. No.
13/169,008
Granted
Nov 26, 2013
Kind
B2
Abstract

A high-voltage semiconductor device is disclosed. The HV semiconductor device includes: a substrate; a well of first conductive type disposed in the substrate; a first doping region of second conductive type disposed in the p-well; a first isolation structure disposed in the well of first conductive type and surrounding the first doping region of second conductive type; and a first drift ring of second conductive type disposed between the first doping region of second conductive type and the first isolation structure.

Claims (30)

1. A high-voltage semiconductor device, comprising:

a substrate;

a well of first conductive type disposed in the substrate;

a first doping region of second conductive type disposed in the well of first conductive type;

a first isolation structure disposed in the well of first conductive type and surrounding the first doping region of second conductive type; and

a first drift ring of second conductive type disposed between the first doping region of second conductive type and the first isolation structure.

2. The high-voltage semiconductor device of claim 1 , wherein the first isolation structure comprises a field oxide layer.

3. The high-voltage semiconductor device of claim 1 , further comprising a second doping region of second conductive type directly under the first doping region of second conductive type.

4. The high-voltage semiconductor device of claim 1 , further comprising a second isolation structure surrounding the first isolation structure.

5. The high-voltage semiconductor device of claim 4 , further comprising a first doping region of first conductive type disposed between the first isolation structure and the second isolation structure.

6. The high-voltage semiconductor device of claim 5 , further comprising a second doping region of first conductive type directly under the first doping region of first conductive type.

7. The high-voltage semiconductor device of claim 5 , further comprising a first drift ring of first conductive type disposed between the first doping region of first conductive type and the first isolation structure.

8. The high-voltage semiconductor device of claim 5 , further comprising a second drift ring of first conductive type disposed between the first doping region of first conductive type and the second isolation structure.

9. The high-voltage semiconductor device of claim 1 , further comprising a second drift ring of second conductive type directly under the first isolation structure.

10. The high-voltage semiconductor device of claim 1 , wherein the first conductive type comprises p-type and the second conductive type comprises n-type.

11. A high-voltage semiconductor device, comprising:

a substrate;

a well of first conductive type disposed in the substrate;

a first doping region of second conductive type disposed in the well of first conductive type;

a first isolation structure disposed in the well of first conductive type and surrounding the first doping region of second conductive type; and

a first drift ring of second conductive type disposed directly under the first isolation structure.

12. The high-voltage semiconductor device of claim 11 , wherein the first isolation structure comprises a field oxide layer.

13. The high-voltage semiconductor device of claim 11 , further comprising a second doping region of second conductive type directly under the first doping region of second conductive type.

14. The high-voltage semiconductor device of claim 11 , further comprising a second isolation structure surrounding the first isolation structure.

15. The high-voltage semiconductor device of claim 14 , further comprising a first doping region of first conductive type disposed between the first isolation structure and the second isolation structure.

16. The high-voltage semiconductor device of claim 15 , further comprising a second doping region of first conductive type directly under the first doping region of first conductive type.

17. The high-voltage semiconductor device of claim 15 , further comprising a first drift ring of first conductive type disposed between the first doping region of first conductive type and the first isolation structure.

18. The high-voltage semiconductor device of claim 15 , further comprising a second drift ring of first conductive type disposed between the first doping region of first conductive type and the second isolation structure.

19. The high-voltage semiconductor device of claim 11 , further comprising a second drift ring of second conductive type disposed between the first doping region of second conductive type and the first isolation structure.

20. The high-voltage semiconductor device of claim 11 , wherein the first conductive type comprises p-type and the second conductive type comprises n-type.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 26, 2021
From: UNITED MICROELECTRONICS CORPORATION
To: MARLIN SEMICONDUCTOR LIMITED
Reel/Frame 056991/0292 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 26, 2011
From: PU, SHIH-CHIEH; LEE, CHING-MING; HSU, WEI-LUN; WANG, CHIH-CHUNG; LIN, KE-FENG
To: UNITED MICROELECTRONICS CORP.
Reel/Frame 026500/0519 →