IP Library Granted Patent US 8,614,190
Granted Patent B2
US 8,614,190 · App. 13/172,776 · Granted Dec 24, 2013

Thermal responsive composition for treating bone diseases

Inventors: Shen-Hua Peng (Taoyuan County, TW); Hsin-Hsin Shen (Hsinchu County, TW); Liang-Yo Yang (Taipei, TW); Meng-Yow Hsieh (Taipei, TW); Pei-Shan Li (Taipei, TW); Wei-Lin Yu (Zhubei, TW); Tsai-Yu Lin (Changhua, TW); Po-Liang Lai (Changhua, TW); Jui-Sheng Sun (Taipei, TW); Chih-Hung Chang (Taipei, TW); Yi-Hung Lin (Jhubei, TW)
Assignee: Industrial Technology Research Institute
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Quick Facts
Patent No.
US 8,614,190
App. No.
13/172,776
Granted
Dec 24, 2013
Kind
B2
Abstract

Thermal responsive compositions for treating bone diseases are provided. The thermal responsive composition for treating bone diseases includes a bone growth factor and a biodegradable copolymer. The biodegradable copolymer has a structure of Formula (I) or Formula (II): A-B-BOX-B-A  Formula (I) B-A-B-(BOX-B-A-B) n -BOX-B-A-B  Formula (II) wherein, A includes a hydrophilic polyethylene glycol polymer, B includes a hydrophobic polyester polymer, BOX is a bifunctional group monomer of 2, 2′-Bis(2-oxazoline) and used for coupling the blocks A-B or B-A-B, and n is an integer and the same or more than 0.

Claims (25)

1. A thermal responsive composition for treating bone diseases, comprising:

a biological activity factor, wherein the biological activity factor is a bone growth factor, hydroxyapatite (HAp), tri-calcium phosphate (TCP), demineralized bone matrix (DBM), or combinations thereof; and

a biodegradable copolymer, wherein the biodegradable copolymer has a structure represented by Formula (I):

A-B-BOX-B-A  Formula (I)

wherein, A comprises a hydrophilic polyethylene glycol polymer, B comprises a hydrophobic polyester polymer, and BOX is a bifunctional group monomer of 2, 2′-Bis(2-oxazoline) and used for coupling the blocks A-B.

2. The thermal responsive composition for treating bone diseases as claimed in claim 1 , wherein an end of the hydrophobic polyester polymer (B) which is not bonded with the hydrophilic polyethylene glycol polymer (A) has an end capping/coupling functional group.

3. The thermal responsive composition for treating bone diseases as claimed in claim 2 , wherein the hydrophobic polyester polymer (B) is bonded with the BOX via the end capping/coupling functional group.

4. The thermal responsive composition for treating bone diseases as claimed in claim 2 , wherein the end capping/coupling functional group is derived from an end capping/coupling agent, and the end capping/coupling agent comprises an anhydride.

5. The thermal responsive composition for treating bone diseases as claimed in claim 4 , wherein the end capping/coupling agent comprises succinic anhydride, maleic anhydride, phthalic anhydride, or sebacic anhydride.

6. The thermal responsive composition for treating bone diseases as claimed in claim 1 , wherein the hydrophilic polyethylene glycol polymer (A) comprises methoxy-poly(ethylene glycol) (mPEG).

7. The thermal responsive composition for treating bone diseases as claimed in claim 1 , wherein the hydrophobic polyester polymer (B) comprises polymers or copolymers derived from D,L-Lactide, D-Lactide, L-Lactide, D,L-Lactic acid, D-Lactic acid, L-Lactic acid, glycolide, β-propiolactone, δ-valerolactone, or ε-caprolactone.

8. The thermal responsive composition for treating bone diseases as claimed in claim 1 , wherein the hydrophobic polyester polymer (B) comprises poly(lactide-co-glycolide) (PLGA), poly(propionic-co-lactic) (PPLA), poly(valeric-co-lactic) (PVLA), or poly(caproic-co-lactic) (PCLA).

9. The thermal responsive composition for treating bone diseases as claimed in claim 1 , wherein the bone growth factor comprises bone morphogenetic protein, transforming growth factor β, fibroblast growth factor, insulin-like growth factor, vascular endothelial growth factor, or combinations thereof.

10. The thermal responsive composition for treating bone diseases as claimed in claim 9 , wherein the bone morphogenetic protein comprises BMP-2, BMP-3, BMP-4, BMP-5, BMP-6, BMP-7, BMP-8, or combinations thereof.

11. The thermal responsive composition for treating bone diseases as claimed in claim 1 , wherein the ratio of hydroxyapatite (HAp) and tri-calcium phosphate (TCP) is 7:3 to 5:5.

12. The thermal responsive composition for treating bone diseases as claimed in claim 1 , wherein the thermal responsive composition for treating bone diseases is formulated as an injectable form, pastille, powder, gel or oral liquid.

13. A method for the treatment of bone diseases, comprising:

locally administering the thermal responsive composition of claim 1 to a subject suffering from bone diseases.

14. The method as claimed in claim 13 , wherein an end of the hydrophobic polyester polymer (B) which is not bonded with the hydrophilic polyethylene glycol polymer (A) has an end capping/coupling functional group.

15. The method as claimed in claim 13 , wherein the hydrophilic polyethylene glycol polymer (A) comprises methoxy-poly(ethylene glycol) (mPEG).

16. The method as claimed in claim 13 , wherein the hydrophobic polyester polymer (B) comprises polymers or copolymers derived from D,L-Lactide, D-Lactide, L-Lactide, D,L-Lactic acid, D-Lactic acid, L-Lactic acid, glycolide, β-propiolactone, δ-valerolactone, or ε-caprolactone.

17. The method as claimed in claim 13 , wherein the bone growth factor comprises bone morphogenetic protein, transforming growth factor β, fibroblast growth factor, insulin-like growth factor, vascular endothelial growth factor, or combinations thereof.

18. The method as claimed in claim 17 , wherein the bone morphogenetic protein comprises BMP-2, BMP-3, BMP-4, BMP-5, BMP-6, BMP-7, BMP-8, or combinations thereof.

19. The method as claimed in claim 13 , wherein the ratio of hydroxyapatite (HAp) and tri-calcium phosphate (TCP) is 7:3 to 5:5.

20. The method as claimed in claim 13 , wherein the thermal responsive composition for treating bone diseases is formulated as an injectable form, pastille, powder, gel or oral liquid.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 29, 2011
From: PENG, SHEN-HUA; SHEN, HSIN-HSIN; YANG, LIANG-YO; HSIEH, MENG-YOW; LI, PEI-SHAN; YU, WEI-LIN; LIN, TSAI-YU; LAI, PO-LIANG; SUN, JUI-SHENG; CHANG, CHIH-HUNG; LIN, YI-HUNG
To: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Reel/Frame 026524/0604 →
Continuity (2)
Provisional Application 61360284 · Jun 30, 2010
Related Publication 20120010139A1 · Jan 12, 2012