Three dimensional semiconductor memory device and method of manufacturing the same
Provided is a three dimensional semiconductor device. The device may include mold layers vertically and sequentially stacked, a conductive pattern between the stacked mold layers, a plugging pattern vertically penetrating the stacked mold layers, an intermediate pattern between the conductive pattern and the plugging pattern, and protective layer patterns between the mold layers and the plugging pattern, wherein the protective layer patterns are separated by the intermediate pattern.
1. A method of manufacturing a three dimensional semiconductor device comprising:
forming a first opening vertically penetrating mold layers and a sacrificial layer between the mold layers;
sequentially forming a protective layer and a plugging layer on an inner wall of the first opening;
forming a second opening vertically penetrating the mold layers and the sacrificial layer, the second opening being spaced apart from the first opening;
forming a recess region exposing the protective layer by removing the sacrificial layer exposed by the second opening; and
exposing the plugging layer by removing the protective layer exposed by the recess region.
2. The method of claim 1 , wherein the sacrificial layer is formed of a material having an etch selectivity to the mold layers, and the protective layer is formed of a material having an etch selectivity to the sacrificial layer.
3. The method of claim 1 , further comprising forming an intermediate pattern and a conductive pattern sequentially covering an exposed surface of the plugging layer.
4. A three dimensional semiconductor device manufactured by the method of claim 1 , wherein a difference between a thickness of the plugging layer measured on a sidewall of the protective layer and a thickness of the plugging layer measured on a sidewall of the intermediate pattern is smaller than one tenth of an average thickness of the plugging layer.
5. The three dimensional semiconductor device of claim 4 , wherein the protective layer and the mold layer are formed using different forming processes from each other, and wherein a discontinuous interface is formed between sidewalls of the protective layer and the mold layer.
6. A method of manufacturing a three dimensional semiconductor device comprising:
forming a first opening in mold layers and sacrificial layers that are alternately arranged;
sequentially forming a protective layer and a plugging layer on an inner wall of the first opening;
forming a second opening in the mold layers and the sacrificial layer, wherein the second opening is spaced apart from the first opening;
selectively removing the sacrificial layers to expose the protective layer; and
selectively removing the protective layer to expose the plugging layer.
7. The method of claim 6 , wherein selectively removing the sacrificial layers includes isotropically etching the sacrificial layers using an etch recipe having an etch selectivity to the mold layers and the protective layer.
8. The method of claim 7 , wherein selectively removing the protective layer includes etching using an etch recipe having an etch selectivity to the plugging layer.
9. The method of claim 8 , wherein the etch recipe has an etch selectivity to the mold layers.
10. The method of claim 7 , wherein each of the mold layers includes a silicon oxide layer, and each of the sacrificial layers includes a silicon nitride layer, wherein the etching is performed using an etching solution including a phosphoric acid.