IP Library Granted Patent US 8,349,444
Granted Patent B2
US 8,349,444 · App. 13/176,688 · Granted Jan 8, 2013

Utility materials incorporating a microparticle matrix

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Quick Facts
Patent No.
US 8,349,444
App. No.
13/176,688
Granted
Jan 8, 2013
Kind
B2
Abstract

A utility material can include microparticles, an organic binder and an inorganic binder. The microparticles can be present in an amount from about 25 wt % to about 60 wt %, based on wet formulation. The inorganic binder can optionally include sodium silicate. The organic binder can optionally include a vinyl acetate. The utility material can be formed into a variety of different products or building materials, such as wallboard, shear panels. In addition, the building material may be particularly used to attenuate sound.

Claims (31)

1. A wallboard building material comprising:

a first facing membrane and a second facing membrane, wherein the first facing membrane and the second facing membrane are independently selected from the group consisting of paper, metal, and metal alloys; and

a core matrix sandwiched between the first facing membrane and the second facing membrane, wherein the core matrix includes:

from about 25 wt % to about 60 wt % of microspheres based on wet formulation, the microspheres having a size of from about 100 to about 1500 microns, wherein the microspheres are all cenospheres, each cenosphere comprising an outer shell and a hollow interior filled with a gas; and

from about 20 wt % to about 36 wt % sodium silicate binder; and

from about 5 wt % to about 15 wt % organic binder, wherein the microspheres are bonded together by the sodium silicate binder to create a plurality of voids between the microspheres,

wherein a cured core matrix material formed therefrom is resistant to substantially all mold growth.

2. The wallboard building material of claim 1 , wherein the microspheres are present in an amount from about 30 wt % to about 40 wt % of the wet mixture.

3. The wallboard building material of claim 1 , wherein the wallboard has an R value, when installed on a stud wall, of at least 15.

4. The wallboard building material of claim 1 , wherein the wallboard having ½ inch thickness has a noise attenuation of greater than about 40 db.

5. The wallboard building material of claim 1 , wherein the wallboard has a flexural strength of greater than 50% of that of gypsum wallboard of the same size and shape.

6. The wallboard building material of claim 1 , further comprising a coupling system integrally formed in said core matrix, said coupling system operating to facilitate coupling of a first wallboard panel to a second wallboard panel, and to at least partially seal said first and second wallboard panels.

7. The wallboard building material of claim 1 , wherein the core matrix includes cross-linking.

8. The wallboard building material of claim 1 , wherein the core matrix further includes at least one additive selected from the group consisting of water soluble polymers, setting agents, foaming agents, and combinations thereof.

9. The wallboard building material of claim 1 , further comprising a reinforcing member disposed within said core matrix, said reinforcing member being configured to reinforce said building material in one or more ways selected from the group consisting of reinforcing against sound transmission, reinforcing against heat transfer, enhancing strength, and any combination of these.

10. The wallboard building material of claim 1 , wherein said building material comprises a Sound Transmission Class (STC) rating between 35 and 65.

11. The wallboard building material of claim 1 , wherein said building material comprises a decibel noise reduction value between 55 and 65 dB at 3000 Hz, for a ½ inch thick wallboard.

12. The wallboard building material of claim 1 , further comprising a plurality of cavities strategically formed throughout said core matrix.

13. The wallboard utility material of claim 1 , wherein the microspheres contain an insulating gas.

14. The wallboard building material of claim 1 , wherein the organic binder is vinyl acetate.

15. A method for manufacturing a wallboard building material of claim 1 , comprising:

forming the core matrix of claim 1 by mixing together the microspheres, the organic binder, and the sodium silicate;

sandwiching the core matrix between the first facing membrane and the second facing membrane; and

heat curing the formable composition sufficient to form the core matrix, the first and second facing membranes being configured to adhere to the core matrix.

16. A method for manufacturing a wallboard building material comprising:

combining from about 25 wt % to about 60 wt % of a plurality of microspheres based on wet formulation with from about 20 wt % to about 36 wt % of a sodium silicate binder and from about 5 wt % to about 15 wt % of an organic binder organic binder to produce a formable composition, wherein the microspheres are all cenospheres having an outer shell and a hollow interior filled with gas and have a size of from about 100 to about 1500 microns;

disposing the formable composition onto a surface;

sandwiching the formable composition between a first facing membrane and a second facing membrane;

heat curing the formable composition sufficient to form a core matrix such that the microspheres are bonded together by the sodium silicate binder to create a plurality of voids between the microspheres, the first facing membranes and the second facing membrane adhering to the core matrix; and

wherein the first facing membrane and the second membrane are independently selected from the group consisting of paper, metal and metal alloys.

17. The method of claim 16 , further forming cross linking in at least a part of the core matrix material.

Assignments (8)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2024
From: MICROSPHERE LABS LLC
To: SPHERIC INVESTORS LLC
Reel/Frame 068152/0941 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 1, 2024
From: SPHERIC INVESTORS LLC
To: AKAMAI MATERIALS, INC.
Reel/Frame 068324/0534 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2022
From: ASHTECH INDUSTRIES, LLC
To: MICROSPHERE LABS LLC
Reel/Frame 061455/0531 →
SECURITY INTEREST Recorded May 9, 2018
From: ASHTECH INNOVATION AND RESEARCH INC.; ASHTECH INDUSTRIES LLC
To: KDL INVESTMENTS, LLC
Reel/Frame 045753/0654 →
SECURITY INTEREST Recorded Sep 18, 2017
From: ASHTECH INNOVATION AND RESEARCH INC.; ASHTECH INDUSTRIES LLC
To: KDL INVESTMENTS, LLC
Reel/Frame 043894/0282 →
SECURITY INTEREST Recorded Aug 6, 2014
From: ASHTECH INNOVATION AND RESEARCH INC.; ASHTECH INDUSTRIES LLC
To: KDL INVESTMENTS, LLC
Reel/Frame 033481/0710 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2011
From: AMERICAN CONSULTING TECHNOLOGY AND RESEARCH
To: ASHTECH INDUSTRIES, LLC
Reel/Frame 027340/0906 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 6, 2011
From: KIPP, MICHAEL D.; PUGH, DILWORTH L.; RIDGES, MICHAEL D.; MCCARVILL, WILLIAM T.
To: AMERICAN CONSULTING TECHNOLOGY AND RESEARCH
Reel/Frame 027341/0716 →