IP Library Assignment 068324/0534
Patent Assignment
Reel/Frame 068324/0534

Assignment of Assignor's Interest

Recorded: 2024-08-01 Pages: 22
Assignor
SPHERIC INVESTORS LLC
Executed: 2023-05-01
Assignee
AKAMAI MATERIALS, INC.
232 SOUTH 1250 WEST, LINDON, UTAH, 84042
Covered Properties (43)
Utility Materials Incorporating a Microparticle Matrix
Sound Attenutation Building and Material System
Shear Panel Building Material
Wallboard Materials Incorporating a Microparticle Matrix
Low Embodied Energy Wallboards and Methods of Making Same
Utility Materials Incorporating a Microparticle Matrix Formed with a Setting System
Fire-Resistant Wood Composites, in Particular Wallboards, Process for Manufacture of Same and Use of a Bonding Agent in the Manufacture
Patent: 4,708,910 →
Application: 06/878,884 →
Low Embodied Energy Sheathing Panels with Optimal Water Vapor Permeance and Methods of Making Same
Patent: 7,914,914 →
Application: 11/772,173 →
Publication: US 2010/0077698
Low Embodied Energy Wallboards and Methods of Making Same
Patent: 8,337,993 →
Application: 12/060,196 →
Publication: US 2009/0130452
Utility materials incorporating a microparticle matrix
Application: 12/077,951 →
Publication: US 2009/0004459
Wallboard Materials Incorporating a Microparticle Matrix
Application: 12/238,367 →
Publication: US 2009/0239059
Sound Attenuation Building Material And System
Application: 12/238,379 →
Publication: US 2009/0239429
Sound Attenuation Building Material and System
Patent: 8,445,101 →
Application: 12/238,399 →
Publication: US 2009/0107059
Utility Materials Incorporating a Microparticle Matrix Formed with a Setting Agent
Patent: 8,591,677 →
Application: 12/612,675 →
Publication: US 2010/0116405
Utility Materials Incorporating a Microparticle Matrix
Patent: 8,349,444 →
Application: 13/176,688 →
Publication: US 2012/0060440
Shear Panel Building Material
Patent: 8,440,296 →
Application: 13/176,692 →
Publication: US 2012/0148812
Wallboard Materials Incorporating a Microparticle Matrix
Application: 13/206,348 →
Publication: US 2012/0148831
Low Embodied Energy Wallboards and Methods of Making Same
Patent: 8,916,277 →
Application: 13/677,225 →
Publication: US 2013/0145969
Utility Materials Incorporating a Microparticle Matrix
Patent: 8,997,924 →
Application: 13/735,910 →
Publication: US 2013/0209782
Low Embodied Energy Wallboard
Application: 13/844,077 →
Publication: US 2014/0272439
Shear Panel Building Material
Application: 13/894,080 →
Publication: US 2014/0162075
Sound Attenuation Building Material and System
Patent: 9,076,428 →
Application: 13/898,333 →
Publication: US 2014/0151152
Utility Materials Incorporating a Microparticle Matrix Formed with a Setting Agent
Patent: 9,816,266 →
Application: 14/087,575 →
Publication: US 2014/0079915
UTILITY MATERIALS INCORPORATING A Core MATRIX Including Microparticles Blended With Expanded Silicous Inorganics Particles
Application: 14/220,854 →
Publication: US 2014/0205808
Sound Attenuation Building Material and System
Patent: 9,670,665 →
Application: 14/721,852 →
Publication: US 2016/0076245
Shear Panel Building Material
Application: 15/402,672 →
Publication: US 2017/0121975
Utility Materials Incorporating a Microparticle Matrix Formed with a Setting Agent
Application: 15/659,431 →
Publication: US 2017/0321417
Shear Panel Building Material
Application: 16/133,161 →
Publication: US 2019/0017268
Utility Materials Incorporating a Microparticle Matrix Formed with a Setting Agent
Application: 16/682,752 →
Publication: US 2020/0080299
Shear Panel Building Material
Application: 16/687,221 →
Publication: US 2020/0080308
Shear Panel Building Material
Application: 17/208,609 →
Publication: US 2021/0246655
Utility Materials Incorporating a Microparticle Matrix Formed with a Setting Agent
Application: 17/230,190 →
Publication: US 2022/0010550
Shear Panel Building Material
Application: 17/984,397 →
Publication: US 2023/0212852
Shear Panel Building Material
Application: 18/387,490 →
Publication: US 2024/0218664
Utility Materials Incorporating a Microparticle Matrix Formed with a Setting Agent
Application: 18/505,544 →
Publication: US 2024/0191499
Utility materials incorporating a microparticle matrix
Application: 60/919,509 →
Wallboard building material
Application: 60/961,130 →
Low Embodied Energy Wallboards and Methods of Making Same
Application: 60/988,744 →
Utility materials incorporating microparticle matrix
Application: 61/002,367 →
Wallboard Building Material
Application: 61/081,949 →
Shear Panel Building Material
Application: 61/081,951 →
Sound Attenuation Building Material and System
Application: 61/081,953 →
Utility materials incorporating a microparticle matrix formed with a setting system
Application: 61/198,554 →
Related Assignments (25)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 30, 2007
From: TINIANOV, BRANDON D.
To: SERIOUS MATERIALS, LLC
Reel/Frame 019502/0566 →
Assignment of Assignor's Interest May 2, 2008
From: SURACE, KEVIN; WARE, MEREDITH; HOOVER, DENISE; HAN, JIAPING
To: SERIOUS MATERIALS, INC.
Reel/Frame 020895/0271 →
Assignment of Assignor's Interest Sep 11, 2008
From: KIPP, MICHAEL D.; RIDGES, MICHAEL D.; MCCARVILL, WILLIAM T.; PUGH, DILWORTH L.
To: AMERICAN CONSULTING TECHNOLOGY AND RESEARCH
Reel/Frame 021517/0202 →
Assignment of Assignor's Interest Nov 25, 2008
From: AMERICAN CONSULTING TECHNOLOGY AND RESEARCH
To: ASHTECH INDUSTRIES, LLC
Reel/Frame 021886/0858 →
Assignment of Assignor's Interest Nov 25, 2008
From: PUGH, DILWORTH L; RIDGES, MICHAEL D; KIPP, MICHAEL D; MCCARVILL, WILLIAM T
To: ASHTECH INDUSTRIES, LLC
Reel/Frame 021886/0787 →
Assignment of Assignor's Interest Jan 13, 2009
From: KIPP, MICHAEL D.; PUGH, DILWORTH L.; RIDGES, MICHAEL D.; MCCARVILL, WILLIAM T.
To: AMERICAN CONSULTING TECHNOLOGY AND RESEARCH, INC.
Reel/Frame 022101/0052 →
Assignment of Assignor's Interest Jan 20, 2010
From: KIPP, MICHAEL D.; PUGH, DILWORTH L.; RIDGES, MICHAEL D.; MCCARVILL, WILLIAM T.
To: ASHTECH INDUSTRIES, LLC
Reel/Frame 023819/0506 →
Assignment of Assignor's Interest Apr 5, 2010
From: AMERICAN CONSULTING TECHNOLOGY AND RESEARCH, INC.
To: ASHTECH INDUSTRIES, LLC
Reel/Frame 024187/0289 →
Merger Jan 11, 2011
From: SERIOUS MATERIALS, LLC
To: SERIOUS MATERIALS, INC.
Reel/Frame 025769/0532 →
Assignment of Assignor's Interest Dec 5, 2011
From: PUGH, DILWORTH L.; RIDGES, MICHAEL D.; KIPP, MICHAEL D.; MCCARVILL, WILLIAM T.
To: ASHTECH INDUSTRIES, LLC
Reel/Frame 027325/0471 →
Assignment of Assignor's Interest Dec 6, 2011
From: KIPP, MICHAEL D.; PUGH, DILWORTH L.; RIDGES, MICHAEL D.; MCCARVILL, WILLIAM T.
To: AMERICAN CONSULTING TECHNOLOGY AND RESEARCH
Reel/Frame 027341/0716 →
Assignment of Assignor's Interest Dec 6, 2011
From: AMERICAN CONSULTING TECHNOLOGY AND RESEARCH
To: ASHTECH INDUSTRIES, LLC
Reel/Frame 027340/0906 →
Assignment of Assignor's Interest Dec 6, 2011
From: PUGH, DILWORTH L.; RIDGES, MICHAEL D.; KIPP, MICHAEL D.; MCCARVILL, WILLIAM T.
To: ASHTECH INDUSTRIES, LLC
Reel/Frame 027333/0924 →
Merger Dec 14, 2011
From: SERIOUS MATERIALS, INC.
To: SERIOUS ENERGY, INC.
Reel/Frame 027379/0410 →
Assignment of Assignor's Interest Jun 24, 2013
From: RAM, SUNDER; LAMPERT, RUSS; OLMSTED, NICK
To: SERIOUS ENERGY, INC.
Reel/Frame 030670/0262 →
Security Interest Aug 6, 2014
From: ASHTECH INNOVATION AND RESEARCH INC.; ASHTECH INDUSTRIES LLC
To: KDL INVESTMENTS, LLC
Reel/Frame 033481/0710 →
Security Interest Sep 18, 2017
From: ASHTECH INNOVATION AND RESEARCH INC.; ASHTECH INDUSTRIES LLC
To: KDL INVESTMENTS, LLC
Reel/Frame 043894/0282 →
Security Interest May 9, 2018
From: ASHTECH INNOVATION AND RESEARCH INC.; ASHTECH INDUSTRIES LLC
To: KDL INVESTMENTS, LLC
Reel/Frame 045753/0654 →
Assignment of Assignor's Interest Oct 18, 2022
From: KIPP, MICHAEL D.; PUGH, DILWORTH L.; RIDGES, MICHAEL D.; MCCARVILL, WILLIAM T.
To: ASHTECH INDUSTRIES, LLC
Reel/Frame 061700/0587 →
Assignment of Assignor's Interest Oct 18, 2022
From: ASHTECH INDUSTRIES, LLC
To: MICROSPHERE LABS LLC
Reel/Frame 061455/0531 →
Assignment of Assignor's Interest Oct 18, 2022
From: KIPP, MICHAEL D.; PUGH, DILWORTH L.; RIDGES, MICHAEL D.; MCCARVILL, WILLIAM T.
To: AMERICAN CONSULTING TECHNOLOGY AND RESEARCH
Reel/Frame 061454/0261 →
Assignment of Assignor's Interest Oct 18, 2022
From: SERIOUS ENERGY, INC.
To: ASHTECH INDUSTRIES, LLC
Reel/Frame 061453/0571 →
Assignment of Assignor's Interest Oct 18, 2022
From: SERIOUS ENERGY, INC.
To: ASHTECH INDUSTRIES, LLC
Reel/Frame 061453/0177 →
Assignment of Assignor's Interest Oct 18, 2022
From: SERIOUS ENERGY, INC.
To: ASHTECH INDUSTRIES, LLC
Reel/Frame 061453/0169 →
Assignment of Assignor's Interest Oct 18, 2022
From: PUGH, DILWORTH L.; RIDGES, MICHAEL D.; KIPP, MICHAEL D.; MCCARVILL, WILLIAM T.
To: ASHTECH INDUSTRIES, LLC
Reel/Frame 061701/0257 →