Thermal chamber for IC chip testing
View Patent ↗A thermal chamber and system for influencing the temperature of an IC chip under test including a thermal block that receives a chip socket, the thermal block adapted to be disposed between a docking interface plate and a workpress. The thermal block receives a flow of heated or cooled gas, and causes an IC chip to become heated or cooled prior to and during a test of the chip. The thermal chamber and system allows an IC chip to be testing under specific temperature conditions without using an expensive handler costing hundreds of thousands of dollars.
1. A device for controlling a temperature of an integrated circuit chip under test, comprising:
a thermal block having a top wall, a left wall, a right wall, and front wall, and a rear wall, the front wall having a first port for introducing a temperature controlled fluid into the thermal block and a second port for the temperature controlled fluid to exit the thermal block;
a centrally disposed aperture in the thermal block forming an enclosure for capturing an IC chip socket;
a first fluid channel defining a path around the centrally disposed aperture;
a second fluid channel extending across the centrally disposed aperture; and
a fluid control mechanism for selectively diverting fluid through said first and second fluid channels.
2. The device of claim 1 wherein the fluid control mechanism is a ball valve.
3. The device of claim 2 wherein the ball valve has a pin protruding through the top wall of the thermal block to actuate the ball valve.
4. The device of claim 1 wherein the thermal block is substantially rectangular and the aperture is substantially rectangular.
5. The device of claim 1 wherein the first port includes a nozzle for introducing the thermally controlled fluid through the first port.
6. The device of claim 1 further comprising an exhaust control valve for controlling the fluid exiting the first fluid channel.