IP Library Granted Patent US 8,816,287
Granted Patent B2
US 8,816,287 · App. 13/179,681 · Granted Aug 26, 2014

Structures for radiation detection and energy conversion using quantum dots

Inventors: Irving N. Weinberg (Bethesda, MD); Pavel Stepanov (North Potomac, MD); Mario G. Urdaneta (Berwyn Heights, MD)
Assignee: Weinberg Medical Physics LLC
G01T1/16G01T3/08G21H1/04G01T1/24G01T1/242
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Quick Facts
Patent No.
US 8,816,287
App. No.
13/179,681
Granted
Aug 26, 2014
Kind
B2
Abstract

Inorganic semiconducting materials such as silicon are used as a host matrix in which quantum dots reside to provide a radiation detector or energy converter. The quantum dot material may be disposed by incorporating materials sensitive to neutron detection such as boron-containing compounds, or the use of methods such as chemical vapor deposition or atomic layer deposition to insert the quantum dot material. Electrodes may be extended deep into the host matrix material to improve efficiency. Likewise, the host matrix may be machined to create pores in the matrix material. Further, amplification and signal-processing structures may be used in close proximity to the radiation-sensitive region of the device.

Claims (49)

1. An assembly for converting radiation to electrical energy, comprising:

a host matrix of inorganic semiconducting material defining a first surface and a second surface and a thickness disposed between the first and second surfaces;

a plurality of nanoparticles interspersed within the thickness of the host matrix, the plurality of nanoparticles in combination with the host matrix generating at least one charge carrier upon interaction with the radiation;

a first electrode disposed adjacent to the first surface of the host matrix; and

a second electrode disposed adjacent to the second surface of the host matrix,

wherein, the generated electrical energy is output from the pair of the first and second electrodes.

2. The assembly of claim 1 , wherein the assembly is configured to convert at least one of the following types of radiation to electrical energy: infrared, visible, ultraviolet, x-ray, gamma, beta, cosmic rays, neutrons, and geothermal.

3. The assembly of claim 1 , wherein the thickness between the first and second surfaces is in the range of 1 micrometer and 10 centimeters.

4. The assembly of claim 1 , wherein at least a portion of host matrix is made of porous silicon.

5. The assembly of claim 4 , wherein the thickness of porous silicon is in the range of 1 micrometer and 10 centimeters.

6. The assembly of claim 1 wherein at least one of a resistor, a capacitor, and a transistor is formed using the same substrate as was used to form the host matrix or a suitable material added to the same substrate as was used to form the host matrix.

7. The assembly as of claim 6 , wherein thickness between first and second surface is in the range of 1 micrometer and 10 centimeters.

8. An assembly for converting radiation to electrical energy, comprising:

a host matrix defining a first surface and a second surface and a thickness disposed between the first and second surfaces;

a plurality of nanoparticles interspersed within the thickness of the host matrix, the plurality of nanoparticles in combination with the host matrix generating at least one charge carrier upon interaction with the radiation;

a first electrode disposed adjacent to the first surface of the host matrix; and

a second electrode disposed adjacent to the second surface of the host matrix,

wherein, the generated electrical energy is output from the pair of the first and second electrodes, and

wherein the plurality of nanoparticles enables charge transport from particle to particle in at least one particle network within the host matrix.

9. The assembly of claim 8 , wherein the assembly is configured to convert at least one of the following types of radiation to electrical energy: infrared, visible, ultraviolet, x-ray, gamma, beta, cosmic rays, neutrons, and geothermal.

10. The assembly of claim 8 , wherein the thickness between first and second surface is in the range of 1 micrometer and 10 centimeters.

11. The assembly of claim 8 , wherein at least a portion of host matrix is of porous silicon.

12. The assembly of claim 11 , wherein the thickness of porous silicon is in the range of 1 micrometer and 10 centimeters.

13. The assembly of claim 8 , wherein at least one of a resistor, a capacitor, and a transistor is formed using the same substrate as was used to form the in the host matrix or a suitable material added to the same substrate as was used to form the host matrix.

14. A radiation detector, comprising:

a plurality of assemblies for converting radiation to electrical energy, disposed adjacent to one another in a stacked fashion, each of the assemblies comprising:

a host matrix of inorganic semiconducting material defining a first surface and a second surface and a thickness disposed between the first and second surfaces,

a plurality of nanoparticles interspersed within the thickness of the host matrix, the plurality of nanoparticles in combination with the host matrix generating at least one charge carrier upon interaction with the radiation,

a first electrode disposed adjacent to the first surface of the host matrix, and

a second electrode disposed adjacent to the second surface of the host matrix,

wherein, the generated electrical energy is output from the pair of the first and second electrodes.

15. The radiation detector of claim 14 , wherein the detector is configured to detect at least one of the following types of radiation: infrared, visible, ultraviolet, x-ray, gamma, beta, cosmic rays, neutrons, and geothermal.

16. The detector of claim 14 , wherein at least a portion of host matrix is made of porous silicon.

17. The detector of claim 16 , wherein the thickness of porous silicon is in the range of 1 micrometer and 10 centimeters.

18. The detector of claim 14 , wherein at least one of a resistor, a capacitor, and a transistor is formed using the same substrate as was used to form the host matrix or a suitable material added to the same substrate as was used to form the host matrix.

19. A radiation detector; comprising:

a plurality of assemblies for converting radiation to electrical energy, disposed adjacent to one another in a stacked fashion, each of the assemblies comprising:

a host matrix defining a first surface and a second surface and a thickness disposed between the first and second surfaces,

a plurality of nanoparticles interspersed within the thickness of the host matrix, the plurality of nanoparticles in combination with the host matrix generating at least one charge carrier upon interaction with the radiation,

a first electrode disposed adjacent to the first surface of the host matrix, and

a second electrode disposed adjacent to the second surface of the host matrix,

wherein, the generated electrical energy is output from the pair of the first and second electrodes, and

wherein at least one outer coating encapsulating at least one of the plurality of nanoparticles, the coating changing the electrical behavior of the at least one nanoparticle.

20. The detector of claim 19 wherein, the detector is configured to detect at least one of the following types of radiation: infrared, visible, ultraviolet, x-ray, gamma, beta, cosmic rays, and neutrons, geothermal.

21. The detector of claim 19 , wherein the detector is configured to detect neutrons, wherein at least one of the host matrix and the nanoparticles contained therein contain at least one atom of Hydrogen, Helium, Lithium, and/or Boron.

22. The detector of claim 19 , wherein the detector is configured to detect neutrons, wherein at least one of the host matrix, the nanoparticles and the at least one outer coating contain at least one atom of Hydrogen, Helium, Lithium, and/or Boron.

23. The detector of claim 19 , wherein at least a portion of host matrix is made of porous silicon.

24. The detector of claim 23 , wherein at least one of a resistor, a capacitor, and a transistor is formed using the same substrate as was used to form the host matrix.

25. The detector of claim 24 , wherein the thickness of porous silicon is in the range of 1 micrometer and 10 centimeters.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 30, 2016
From: WEINBERG MEDICAL PHYSICS LLC
To: KONINKLIJKE PHILIPS N.V.
Reel/Frame 039217/0050 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 7, 2011
From: WEINBERG, IRVING N.; STEPANOV, PAVEL; URDANETA, MARIO G.
To: WEINBERG MEDICAL PHYSICS LLC
Reel/Frame 026864/0987 →
Continuity (3)
Continuation In Part 12123412 · May 19, 2008
Provisional Application 61010929 · Jan 14, 2008
Related Publication 20120175584A1 · Jul 12, 2012