Flexible hybrid plasma-semiconductor transistors and arrays
Preferred embodiment flexible and on wafer hybrid plasma semiconductor devices have at least one active solid state semiconductor region; and a plasma generated in proximity to the active solid state semiconductor region(s). Doped solid state semiconductor regions are in a thin flexible solid state substrate, and a flexible non conducting material defining a microcavity adjacent the semiconductor regions. The flexible non conducting material is bonded to the thin flexible solid state substrate, and at least one electrode is arranged with respect to said flexible substrate to generate a plasma in said microcavity, where the plasma will influence or perform a semiconducting function in cooperation with said solid state semiconductor regions. A preferred on-wafer device is formed on a single side of a silicon on insulator wafer and defines the collector (plasma cavity), emitter and base regions on a common side, which provides a simplified and easy to manufacture structure. A preferred embodiment array of flexible hybrid plasma transistors of the invention is an n+pn PBJT fabricated between two flexible sheets. One or both of the flexible sheets is transparent. The overall array structure is planar, and the planarized structure is sealed between the two flexible sheets. Visible or ultraviolet light is emitted during operation by plasma collectors in the array. In preferred embodiments, individual PBJTs in the array serve as sub-pixels of a full-color display.
1. A flexible hybrid plasma semiconductor device, comprising doped solid state semiconductor regions in a thin flexible solid state substrate, a flexible non conducting material defining a microcavity adjacent the semiconductor regions, the flexible non conducting material being bonded to the thin flexible solid state substrate, and at least one electrode arranged with respect to said flexible substrate to generate a plasma in said microcavity, where the plasma will influence or perform a semiconducting function in cooperation with said solid state semiconductor regions.
2. An array of devices according to claim 1 .
3. The device of claim 1 , wherein at least one of the thin flexible substrate and the flexible non conducting material is transparent.
4. The device of claim 1 , wherein the flexible non conducting material comprises plastic.
5. The device of claim 1 , wherein the thin flexible substrate comprises silicon.
6. The device of claim 5 , wherein the thin flexible substrate is ˜15 μm thick.
7. The device of claim 1 , wherein the device is planar.
8. The device of claim 1 , wherein the doped solid state semiconductor regions and the thin flexible substrate comprises a p-type semiconductor base with an n-type emitter region diffused therein, the device further comprising contacts to the base and emitter regions and dielectric material to isolate the base and emitter contacts from each other.
9. The device of claim 8 , wherein the dielectric material comprises one of SiO 2 , Y 2 O 3 and Si 3 N 4 .
10. The device of claim 1 , further comprising a flexible window sealing a plasma medium in the microcavity.
11. The device of claim 1 , wherein the doped solid state semiconductor regions in a thin flexible solid state substrate comprise Group III-V materials.