Polyamide moulding compound for producing moulded articles with a soft-touch surface and also corresponding moulded articles

1. A polyamide moulding compound for producing moulded articles with a soft-touch surface comprising

(a) 55 to 85% by weight of a blend of at least one polyamide (PA) with at least one styrene block copolymer as plasticiser,

(a1) the polyamide being an amorphous polyamide which is amine-terminated, and

(a2) the at least one plasticiser comprising at least one styrene-ethylene/butylene-styrene copolymer (SEBS) and at least one (SEBS) grafted with maleic anhydride (SEBS-MAH), and

(a3) the weight ratio of polyamide to plasticiser being in the range of 1.25:0.75 to 0.75:1.25,

(b) 15 to 45% by weight of a reinforcing material and

(c) 0.1 to 10% by weight of an additive,

the sum of the components (a)+(b)+(c) producing 100% by weight;

wherein the weight ratio (a2) of SEBS to SEBS-MAH is 1:2 to 2:1.

2. The polyamide moulding compound according to claim 1 , wherein the weight ratio (a3) of polyamide to plasticiser is 1.2:0.8 to 0.8:1.25.

3. The polyamide moulding compound according to claim 1 , wherein the reinforcing material is contained in a quantity of 20 to 40% by weight.

4. The polyamide moulding compound according to claim 1 , wherein the amorphous polyamide is amine-terminated and has a content of amino end-groups of at least 150 meq/kg.

5. The polyamide moulding compound according to claim 1 , wherein the amorphous polyamide is selected from the group consisting of PA 6I/6T, PA 6I/10T, PA MACM14, PA MACM18 and mixtures or copolyamides thereof,wherein PA 6I/6T denotes a copolyamide made of hexamethylene diamine, isophthalic acid, and terephthalic acid; PA 6I/10T denotes a copolyamide made of hexamethylene diamine, decamethylene diamine, isophthalic acid, and terephthalic acid; PA MACM14 denotes a copolyamide made of bis-(4-amino-3-methyl-cyclohexyl)methane and tetradecanedioic acid; and PA MACM18 denotes a copolyamide made of bis-(4-amino-3-methyl-cyclohexyl)methane and octadecanedioic acid.

6. The polyamide moulding compound according to claim 1 , wherein the reinforcing material is glass fiber.

7. The polyamide moulding compound according to claim 6 , wherein the glass fiber has a round and/or a non-circular cross-section.

8. The polyamide moulding compound according to claim 1 , wherein the additive is selected from inorganic stabilisers, organic stabilisers, lubricants, colourants, marking materials, inorganic pigments, organic pigments, IR-absorbers, antistatic agents, antiblocking agents, nucleation agents, crystallisation accelerators, crystallisation inhibitors, condensation catalysts, chain controllers, defoamers, chain-lengthening additives, conductivity additives, carbon black, graphite, carbon nanotubes, mould-release agents, parting agents, optical brighteners, adhesives, metal pigments, metal flakes, metal-coated particles, particle fillers, nanoscale fillers, natural phyllosilicates, synthetic phyllosilicates and mixtures thereof.

9. The polyamide moulding compound according to claim 8 , wherein the colourant is carbon black.

10. A moulded article with a soft-touch surface produced or producible from a PA moulding compound according to claim 1 .

11. The moulded article according to claim 10 , wherein the moulded article is selected from housings, keys, grips and/or gripping surfaces for hand tools, household equipment, sports equipment, furniture components, electrical or electronic components and electrical and electronic devices.

12. A method for producing moulded articles with a soft touch surface comprising moulding the polyamide moulding compound according to claim 1 .

13. The moulded article produced according to claim 10 , wherein moulded article has a modulus of elasticity in tension, measured according to ISO 527, of greater than 2,500 MPa and at the same time a breaking elongation according to ISO 527, of greater than 6%.

14. The polyamide moulding compound according to claim 1 , wherein the weight ratio (a3) of polyamide to plasticiser is 1.15:0.85 to 0.85:1.15.

15. The polyamide moulding compound according to claim 1 , wherein the weight ratio (a2) of SEBS to SEBS-MAH is 1:1.5 to 1.5:1.

16. The polyamide moulding compound according to claim 1 , wherein the reinforcing material is contained in a quantity of 25 to 35% by weight.

17. The polyamide moulding compound according to claim 2 , wherein the reinforcing material is contained in a quantity of 20 to 40% by weight.

18. The polyamide moulding compound according to claim 2 , wherein the amorphous polyamide is amine-terminated and has a content of amino end-groups of at least 150 meq/kg.