IP Library › Granted Patent US 8,564,009
Granted Patent B2
US 8,564,009 · App. 13/188,791 · Granted Oct 22, 2013

Vertical light emitting device

Inventors: Bok-ki Min (Suwon-si, KR); Young-soo Park (Yongin-si, KR); Su-hee Chae (Suwon-si, KR); Jun-youn Kim (Hwaseong-si, KR); Hyun-gi Hong (Suwon-si, KR); Young-jo Tak (Hwaseong-si, KR)
Assignee: Samsung Electronics Co., Ltd.
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Quick Facts
Patent No.
US 8,564,009
App. No.
13/188,791
Granted
Oct 22, 2013
Kind
B2
Abstract

According to an example embodiment, a vertical light emitting device (LED) includes a semiconductor layer including an active layer configured to emitting light, a first electrode on a first side of the semiconductor layer, and a second electrode on a second side of the semiconductor layer opposite to the first electrode. At least one of the first and second electrodes includes a metal electrode pattern and a transparent electrode pattern. The transparent electrode pattern is in a region between segment electrodes of the metal electrode pattern. The transparent electrode pattern is electrically connected to the metal electrode pattern.

Claims (17)

1. A vertical light emitting device (LED), comprising: a semiconductor layer including an active layer configured to emitting light; a first electrode on a first side of the semiconductor layer; and a second electrode on a second side of the semiconductor layer opposite to the first electrode, at least one of the first and second electrodes including a metal electrode pattern and a transparent electrode pattern, the metal electrode pattern directly contacting the semiconductor layer, the transparent electrode pattern being in a region between segment electrodes of the metal electrode pattern, and being electrically connected to the metal electrode pattern; and an embossed exit pattern configured to pass light generated in the active layer, the embossed exit pattern filling spaces between the metal electrode pattern and the transparent electrode pattern.

2. The LED of claim 1 , wherein the metal electrode pattern includes at least one of titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), and an alloy containing at least one of Ti, Al, Cr and Au.

3. The LED of claim 2 , wherein the metal electrode pattern has at least one gap from about 100 μm to about 500 μm.

4. The LED of claim 2 , wherein the transparent electrode pattern includes at least one of a transparent conducting oxide, carbon nanotube (CNT), and graphene.

5. The LED of claim 4 , wherein the transparent electrode pattern includes at least one of indium-tin oxide (ITO) and zinc oxide (ZnO).

6. The LED of claim 1 , wherein the transparent electrode pattern includes at least one of a transparent conducting oxide, carbon nanotube (CNT), and graphene.

7. The LED of claim 6 , wherein the transparent electrode pattern includes at least one of indium-tin oxide (ITO) and zinc oxide (ZnO).

8. The LED of claim 1 , wherein another one of the first and second electrodes is a reflective electrode layer.

9. The LED of claim 8 , wherein the reflective electrode layer includes at least one of silver (Ag), aluminum (Al), rhodium (Rh), and an alloy containing at least one of Ag, Al and Rh.

10. The LED of claim 8 , further comprising:

an exit pattern layer on an exit portion of the semiconductor layer, the exit pattern layer including the at least one of the first and second electrodes, and the exit pattern layer configured to pass light generated in the active layer.

11. The LED of claim 8 , wherein the exit pattern layer includes an embossed pattern.

12. The LED of claim 1 , further comprising:

an exit pattern layer on an exit portion of the semiconductor layer, the exit pattern layer including the at least one of the first and second electrodes, and the exit pattern layer configured to pass light generated in the active layer.

13. The LED of claim 12 , wherein the exit pattern layer includes an embossed pattern.

14. The LED of claim 1 , further comprising:

a supporting layer, wherein one of the first and second electrodes is between the supporting layer and the semiconductor layer.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 22, 2011
From: MIN, BOK-KI; PARK, YOUNG-SOO; CHAE, SU-HEE; KIM, JUN-YOUN; HONG, HYUN-GI; TAK, YOUNG-JO
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 026639/0401 →
Priority Claims (1)
KR 10-2011-0002870 · Jan 11, 2011 · national
Continuity (1)
Related Publication 20120175662A1 · Jul 12, 2012