IP Library Granted Patent US 9,051,661
Granted Patent B2
US 9,051,661 · App. 13/189,645 · Granted Jun 9, 2015

Silicon single crystal production method

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Quick Facts
Patent No.
US 9,051,661
App. No.
13/189,645
Granted
Jun 9, 2015
Kind
B2
Abstract

Silicon single crystals having suppressed deformation and dislocations and the successful omission of the tail section are produced by growing the straight-body section of the silicon single crystal under the influence of a horizontal magnetic field with a magnetic flux density at its magnetic center being ≧1000 Gauss, and ≦2000 Gauss, reducing the lifting speed of the silicon single crystal relative to the surface of the melt to 0 mm/minute, maintaining a static state until there is a decrease in the apparent weight of the silicon single crystal, then further maintaining the static state so that the entire growth front of the silicon single crystal forms a convex shape protruding in a direction opposite to the lifting direction of the silicon single crystal, and separating the silicon single crystal from the melt.

Claims (6)

1. A method for producing a silicon single crystal by the Czochralski method, comprising the steps of:

(1) growing a straight body section of the silicon single crystal by pulling up the silicon single crystal under the influence of a horizontal magnetic field applied to a raw material melt contained in a crucible, the horizontal magnetic field having a magnetic flux density at its magnetic center of greater than or equal to 1000 Gauss, and less than or equal to 2000 Gauss;

(2) reducing the pulling speed of the silicon single crystal relative to the surface of said melt to 0 mm/minute after step (1);

(3) measuring the apparent weight of the silicon single crystal and maintaining a static state where the relative lifting speed of the silicon single crystal is kept at 0 mm/minute until there is a decrease in the apparent weight of the silicon single crystal, after the step (2);

(4) further maintaining the static state so that the entire growth front of the silicon single crystal in contact with the melt forms a convex shape protruding in a direction opposite to the pulling direction of the silicon single crystal, after step (3); and

(5) separating the silicon single crystal from said melt, after step (4).

Assignments (3)
CORRECTIVE ASSIGNMENT TO CORRECT THE DATE OF THE CHANGE OF ADDRESS FROM 03/12/2020 TO 12/03/2020 PREVIOUSLY RECORDED AT REEL: 056719 FRAME: 0881. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT. Recorded Jul 1, 2021
From: SILTRONIC AG
To: SILTRONIC AG
Reel/Frame 057561/0451 →
CHANGE OF ADDRESS Recorded Jun 30, 2021
From: SILTRONIC AG
To: SILTRONIC AG
Reel/Frame 056719/0881 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 25, 2011
From: KYUFU, SHINICHI
To: SILTRONIC AG
Reel/Frame 026640/0941 →