IP Library Granted Patent US 9,270,227
Granted Patent B2
US 9,270,227 · App. 13/194,714 · Granted Feb 23, 2016

Oscillator systems having annular resonant circuitry

Inventor: Tiefeng Shi (Gilbert, AZ)
Assignee: FREESCALE SEMICONDUCTOR, INC.
H03B1/02H03B5/1847H05B6/66H03B2200/0076Y10T29/49155
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Quick Facts
Patent No.
US 9,270,227
App. No.
13/194,714
Granted
Feb 23, 2016
Kind
B2
Abstract

Systems and apparatus are provided for solid-state oscillators and related resonant circuitry. An exemplary oscillator system includes an amplifier having an amplifier input and an amplifier output and resonant circuitry coupled between the amplifier output and the amplifier input. In exemplary embodiments, the resonant circuitry includes an annular resonance structure that is substantially symmetrical and includes a pair of arcuate inductive elements. In accordance with one or more embodiments, the resonant circuitry includes an additional inductive element that is capacitively coupled to the annular resonance structure via an air gap to improve the quality factor of the resonant circuitry.

Claims (31)

1. An oscillator system comprising:

a first amplifier having a first amplifier input and a first amplifier output; and

an annular resonance structure formed on a substrate, wherein the annular resonance structure includes a first inductive element coupled to the first amplifier output and a second inductive element coupled to the first amplifier input, wherein the first and second inductive elements have substantially identical electrical characteristics, the first and second inductive elements curve towards one another so that the annular resonance structure encompasses a voided interior region, a first longitudinal end of the first inductive element faces a first longitudinal element of the second inductive elements across a first air gap, and a second longitudinal end of the first inductive element faces a second longitudinal element of the second inductive element across a second air gap.

2. The oscillator system of claim 1 , further comprising a third inductive element coupled between the first amplifier and the annular resonance structure, wherein the third inductive element is disposed proximate the annular resonance structure and separated from the annular resonance structure by a third air gap, the third inductive element being coupled to the annular resonance structure via a capacitance provided by the third air gap.

3. The oscillator system of claim 1 , wherein: the first inductive element is a first arcuate inductive element; the second inductive element is a second arcuate inductive element; and wherein the oscillator system includes a first capacitive element coupled between the first longitudinal ends of the first and second arcuate inductive elements; and a second capacitive element coupled between the second longitudinal ends of the first and second arcuate inductive elements.

4. The oscillator system of claim 3 , further comprising a third inductive element coupled between the first amplifier and the first arcuate inductive element, wherein:

the third inductive element is disposed proximate the first arcuate inductive element and separated from the first arcuate inductive element by a third air gap to provide a capacitance between the third inductive element and the first arcuate inductive element; and

the third inductive element is capacitively coupled to the first arcuate inductive element via the capacitance.

5. The oscillator system of claim 3 , wherein the first arcuate inductive element and the second arcuate inductive element are complementary in shape.

6. The oscillator system of claim 3 , wherein the annular resonance structure is symmetrical.

7. The oscillator system of claim 3 , wherein:

the first arcuate inductive element comprises a first substantially C-shaped conductive material; and

the second arcuate inductive element comprises a second substantially C-shaped conductive material.

8. The oscillator system of claim 3 , wherein:

the first arcuate inductive element comprises a first substantially U-shaped conductive material; and

the second arcuate inductive element comprises a second substantially U-shaped conductive material.

9. The oscillator system of claim 1 , wherein the annular resonance structure is symmetrical.

10. The oscillator system of claim 1 , further comprising

a second amplifier having a second amplifier input coupled to the first amplifier input and second amplifier output; and

a power combiner having a first input coupled to the first amplifier output and a second input coupled to the second amplifier output.

11. The oscillator system of claim 10 , wherein the first amplifier is configured to operate in Class AB mode and the second amplifier is configured to operate in Class C mode.

12. The oscillator system of claim 10 , further comprising:

a third amplifier having a third amplifier input and a third amplifier output coupled to a third input of the power combiner; and

a power splitter having a first output coupled to the first amplifier input, a second output coupled to the second amplifier input, and a third output coupled to the third amplifier input.

13. The oscillator system of claim 1 , wherein further comprising: a first capacitive element coupled between the first longitudinal ends of the first and second inductive elements; and a second capacitive elements coupled between the second longitudinal ends of the first and second inductive elements.

14. The oscillator system of claim 13 , further comprising a third inductive element disposed proximate the first inductive element and separated from the first inductive element by a third air gap to provide a capacitance between the third inductive element and the first inductive element, wherein the third inductive element is capacitively coupled to the first inductive element via the capacitance.

15. The oscillator system of claim 14 , further comprising a fourth inductive element disposed proximate the second inductive element and separated from the second inductive element by a fourth air gap to provide a second capacitance between the fourth inductive element and the second inductive element, wherein the fourth inductive element is capacitively coupled to the second inductive element via the second capacitance.

16. The oscillator system of claim 13 , wherein the first inductive element and the second inductive element are complementary in shape and substantially oppose one another.

17. The oscillator system of claim 13 , wherein:

the first capacitive element has a first terminal coupled to the first longitudinal end of the first inductive element and a second terminal coupled to the first longitudinal end of the second inductive element; and

the second capacitive element has a third terminal coupled to the second longitudinal end of the first inductive element and a fourth terminal coupled to the second longitudinal end of the second inductive element.

Assignments (31)
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040925 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Feb 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V. F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 052917/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 040928 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE RELEASE OF SECURITY INTEREST. Recorded Jan 17, 2020
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 052915/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 11759915 AND REPLACE IT WITH APPLICATION 11759935 PREVIOUSLY RECORDED ON REEL 037486 FRAME 0517. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Dec 10, 2019
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 053547/0421 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042985 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 042762 FRAME 0145. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051145/0184 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051030/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12298143 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Oct 22, 2019
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 051029/0387 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050745/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE TO CORRECT THE APPLICATION NO. FROM 13,883,290 TO 13,833,290 PREVIOUSLY RECORDED ON REEL 041703 FRAME 0536. ASSIGNOR(S) HEREBY CONFIRMS THE THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS.. Recorded Feb 20, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: SHENZHEN XINGUODU TECHNOLOGY CO., LTD.
Reel/Frame 048734/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 039361 FRAME 0212. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042762/0145 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12681366 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded May 9, 2017
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 042985/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE PATENTS 8108266 AND 8062324 AND REPLACE THEM WITH 6108266 AND 8060324 PREVIOUSLY RECORDED ON REEL 037518 FRAME 0292. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS. Recorded Feb 1, 2017
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 041703/0536 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040652 FRAME: 0241. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME. Recorded Jan 5, 2017
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 041260/0850 →
MERGER Recorded Nov 8, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: NXP USA, INC.
Reel/Frame 040652/0241 →
RELEASE OF SECURITY INTEREST Recorded Nov 7, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 040928/0001 →
RELEASE OF SECURITY INTEREST Recorded Sep 21, 2016
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP, B.V., F/K/A FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 040925/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REMOVE APPLICATION 12092129 PREVIOUSLY RECORDED ON REEL 038017 FRAME 0058. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY AGREEMENT SUPPLEMENT. Recorded Jul 14, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039361/0212 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
SECURITY AGREEMENT SUPPLEMENT Recorded Mar 7, 2016
From: NXP B.V.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 038017/0058 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 13, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037518/0292 →
ASSIGNMENT AND ASSUMPTION OF SECURITY INTEREST IN PATENTS Recorded Jan 12, 2016
From: CITIBANK, N.A.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037486/0517 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0387 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0285 →
PATENT RELEASE Recorded Dec 21, 2015
From: CITIBANK, N.A., AS COLLATERAL AGENT
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 037357/0334 →
SECURITY AGREEMENT Recorded Nov 6, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 031591/0266 →
SECURITY AGREEMENT Recorded Jun 18, 2013
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS NOTES COLLATERAL AGENT
Reel/Frame 030633/0424 →
SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 027622/0075 →
SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 027621/0928 →
SECURITY AGREEMENT Recorded Jan 31, 2012
From: FREESCALE SEMICONDUCTOR, INC.
To: CITIBANK, N.A., AS COLLATERAL AGENT
Reel/Frame 027622/0477 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 29, 2011
From: SHI, TIEFENG
To: FREESCALE SEMICONDUCTOR, INC.
Reel/Frame 026675/0980 →
Continuity (1)
Related Publication 20130026159A1 · Jan 31, 2013