IP Library Granted Patent US 8,860,445
Granted Patent B2
US 8,860,445 · App. 13/198,879 · Granted Oct 14, 2014

Device and method for testing semiconductor device

Inventors: Koichi Morino (Kanagawa, JP); Kouichi Ikeda (Tokyo, JP)
Assignee: Ricoh Company, Ltd.
G01R31/2875
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Quick Facts
Patent No.
US 8,860,445
App. No.
13/198,879
Granted
Oct 14, 2014
Kind
B2
Abstract

A testing method for testing a semiconductor device includes heating the semiconductor device until the temperature of the semiconductor device reaches a predetermined temperature; conducting other functional tests other than testing of the overheat protection function in a second step after the temperature of the semiconductor device has reached the predetermined temperature; allowing the semiconductor device to generate heat by itself such that the overheat protection function of the semiconductor device is activated, detecting a first diode forward voltage of a desired diode contained in the semiconductor device when the overheat protection function of the semiconductor device is activated and computing a first computational temperature of the semiconductor device based on the detected first diode forward voltage of the desired diode contained in the semiconductor device; and determining whether the computed first computational temperature of the semiconductor device resides in the overheat protection function activating temperature range.

Claims (27)

1. A testing method for testing a semiconductor device, the semiconductor device including an overheat protection function activated when a temperature of the semiconductor device resides in an overheat protection function activating temperature range and deactivated when the temperature of the semiconductor device resides in an overheat protection function deactivating temperature range, the testing method comprising:

heating the semiconductor device until the temperature of the semiconductor device reaches a predetermined temperature in a first step;

conducting other functional tests other than testing of the overheat protection function in a second step after the temperature of the semiconductor device has reached the predetermined temperature in the first step;

supplying to the semiconductor device a current via a testing device external to the semiconductor device, to initiate causing the semiconductor device to generate heat such that the overheat protection function of the semiconductor device is activated, detecting a first diode forward voltage of a desired diode contained in the semiconductor device when the overheat protection function of the semiconductor device is activated and computing a first computational temperature of the semiconductor device based on the detected first diode forward voltage of the desired diode contained in the semiconductor device in a third step,

wherein the desired diode is a parasitic diode of an output driver element contained in the semiconductor device; and

determining whether the computed first computational temperature of the semiconductor device resides in the overheat protection function activating temperature range in a fourth step.

2. The testing method as claimed in claim 1 , further comprising:

detecting a second diode forward voltage of the desired diode contained in the semiconductor device when the overheat protection function of the semiconductor device is deactivated and computing a second computational temperature of the semiconductor device based on the detected second diode forward voltage of the desired diode contained in the semiconductor device in a fifth step; and

determining whether the computed second computational temperature of the semiconductor device resides in the overheat protection function deactivating temperature range in a sixth step.

3. The testing method as claimed in claim 1 , wherein

a period in which processing of the second step is conducted is shorter than a period in which processing of the third step is conducted.

4. The testing method as claimed in claim 1 , wherein

the predetermined temperature indicates a desired temperature in a range from a maximum operable temperature of the semiconductor device to a lower threshold of the overheat protection function deactivating temperature range of the semiconductor device.

5. The testing method as claimed in claim 1 , wherein

the desired diode is arranged closest to a temperature detector element in the semiconductor device configured to detect the temperature of the semiconductor device.

6. A testing device for testing a semiconductor device, the semiconductor device including an overheat protection function activated when a temperature of the semiconductor device resides in an overheat protection function activating temperature range and deactivated when the temperature of the semiconductor device resides in an overheat protection function deactivating temperature range, the testing device comprising:

a heating unit configured to heat the semiconductor device until the temperature of the semiconductor device reaches a predetermined temperature;

a test unit configured to conduct other functional tests other than testing of the overheat protection function after the temperature of the semiconductor device has reached the predetermined temperature;

a self-heat generating unit configured to supply a current from the testing device to the semiconductor device, to cause the semiconductor device to generate heat such that the overheat protection function of the semiconductor device is activated;

a computing unit configured to detect a diode forward voltage of a desired diode contained in the semiconductor device when the overheat protection function of the semiconductor device is activated and compute a computational temperature of the semiconductor device based on the detected diode forward voltage of the desired diode contained in the semiconductor device,

wherein the desired diode is a parasitic diode of an output driver element contained in the semiconductor device; and

a determining unit configured to determine whether the computed computational temperature of the semiconductor device resides in the overheat protection function activating temperature range.

7. A testing method for testing a semiconductor device, the semiconductor device including an overheat protection function activated when a temperature of the semiconductor device resides in an overheat protection function activating temperature range and deactivated when the temperature of the semiconductor device resides in an overheat protection function deactivating temperature range, the testing method comprising:

heating the semiconductor device until the temperature of the semiconductor device reaches a predetermined temperature in a first step;

conducting other functional tests other than testing of the overheat protection function in a second step after the temperature of the semiconductor device has reached the predetermined temperature in the first step;

supplying to the semiconductor device a current via a testing device external to the semiconductor device, to initiate causing the semiconductor device to generate heat such that the overheat protection function of the semiconductor device is activated, detecting a first diode forward voltage of a desired diode arranged closest to an element monitoring the temperature in the semiconductor device when the overheat protection function of the semiconductor device is activated and computing a first computational temperature of the semiconductor device based on the detected first diode forward voltage of the desired diode contained in the semiconductor device in a third step; and

determining whether the computed first computational temperature of the semiconductor device resides in the overheat protection function activating temperature range in a fourth step.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 18, 2015
From: RICOH COMPANY, LTD.
To: RICOH ELECTRONIC DEVICES CO., LTD.
Reel/Frame 035011/0219 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 8, 2011
From: MORINO, KOICHI; IKEDA, KOUICHI
To: RICOH COMPANY, LTD.
Reel/Frame 026876/0544 →
Priority Claims (1)
JP 2010-178442 · Aug 9, 2010 · national
Continuity (1)
Related Publication 20120032696A1 · Feb 9, 2012