Embedded isolation filter
The present disclosure relates to reducing unwanted RF noise in a printed circuit board (PCB) containing an RF device. An isolation filter is embedded in a PCB containing an RDF device. By placing the isolation filter as close as possible to the RF device in order to dramatically reduce unwanted RF noise due to unavoidable coupling between Vias and planes in the PCB structure.
1. A method for reducing unwanted RF noise in a printed circuit board (PCB) containing an RF device, the steps comprising:
Embedding an isolation filter in a PCB containing an RDF device by placing the isolation filter as close as possible to the RF device in order to dramatically reduce unwanted RF noise due to unavoidable coupling between Vias and planes in the PCB structure by embedding said isolation filter inside of at least one PCB between vias of said at PCB, said isolation filter having terminals in an electrical contact with a pad of said at least PCB, said pad having a defined conductive elastomer thereon so that electricity conducts through said isolation filter to place said isolation filter close to said RF device to dramatically reduce unwanted RF noise due to unavoidable coupling between vias and planes in the PCB structure.
2. The method according to claim 1 further comprising building said isolation filter as at least a three component filter.
3. The method according to claim 2 wherein said at least a three component filter is formed of two buried inductors located vertically in said PCB and one capacitor located horizontally across an RF supply pin and an RF ground return pin to form a simple LC “pi” (π) filter.
4. An improved printed circuit board (PCB) containing an RF device with reduced unwanted RF noise comprising:
an isolation filter embedded in a PCB containing an RDF device wherein the isolation filter is placed as close as possible to the RF device in order to dramatically reduce unwanted RF noise due to unavoidable coupling between vias and planes in the PCB structure, said isolation filter being embedded inside of at least PCB between vias of said at least one PCB, said isolation filter having terminals in an electrical contact with a pad of said at least one adaptor board, said pad having a defined isotropic conductive elastomer thereon so that electricity conducts through said isolation filter to place said isolation filter close to said RF device to dramatically reduce unwanted RF noise due to unavoidable coupling between vias and planes in the PCB structure.
5. The improved PCB according to claim 4 further comprising said isolation filter is formed as at least a three component filter.
6. The Improved PCB according to claim 5 wherein said at least a three component filter is formed of two buried inductors located vertically in said PCB and one capacitor located horizontally across an RF supply pin and an RF ground return pin to form a simple LC “pi” (π) filter.
7. The method according to claim 1 wherein said pad defined conductive elastomer is an isotropic elastomer.
8. The method according to claim 1 wherein said pad defined conductive elastomer is an anisotropic elastomer.
9. The improved PCB according to claim 4 wherein said pad defined conductive elastomer is an isotropic elastomer.
10. The improved PCB according to claim 4 wherein said pad defined conductive elastomer is an anisotropic elastomer.