IP Library Granted Patent US 8,587,777
Granted Patent B2
US 8,587,777 · App. 13/202,708 · Granted Nov 19, 2013

Examination method and examination device

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Quick Facts
Patent No.
US 8,587,777
App. No.
13/202,708
Granted
Nov 19, 2013
Kind
B2
Abstract

A change in surface state can be dealt with by setting threshold values different for respective regions of an object to be examined in accordance with a magnitude of noises, thereby improving a detection sensitivity. A function for setting an examination threshold value every region is installed. A function for setting examination threshold values every plurality of detectors spatially independent of each other is installed. The magnitude of noises from the object to be examined differs depending on a spatial direction even in the same region. Therefore, the detection sensitivity is maximized by maximizing an S/N ratio of a detection signal by an optimum signal arithmetic operating process according to the magnitude of noises from the object to be examined every detector and every region of the object to be examined and by setting the optimum threshold values.

Claims (47)

1. An inspection apparatus comprising:

an illumination system which supplies a sample with light;

a plurality of detectors which are spatially independent of each other, and output signals;

a processing unit which is configured to perform the following:

detect noise signals of the signals,

acquire a minimum value of the noise signals,

acquire a plurality of gain values for the signals on the basis of the minimum value,

acquire processed signals on the basis of the signals and the gain value, and

detect a defect on the basis of at least one of the processed signals.

2. The inspection apparatus according to claim 1 , wherein the processing unit is further configured to acquire a threshold value as a function of intensity of the signal.

3. The inspection apparatus according to claim 2 , wherein the processing unit is further configured to:

integrate the processed signals,

acquire an integrated signal, and

detect the defect on the basis of the integrated signal.

4. The inspection apparatus according to claim 3 , further comprising:

a rotating unit which rotates the sample,

wherein a pattern is formed on the surface of the sample.

5. The inspection apparatus according to claim 1 , wherein the processing unit is further configured to:

integrate the processed signals,

acquire an integrated signal, and

detect the defect on the basis of the integrated signal.

6. The inspection apparatus according claim 1 , further comprising:

a rotating unit which rotates the sample,

wherein a pattern is formed on the surface of the sample.

7. An inspection method comprising steps of:

supplying a sample with light by way of an illumination system;

outputting signals by way of a plurality of detectors which are spatially independent of each other;

a processing unit which is configured to perform the following steps:

detecting noise signals of the signals,

acquiring a minimum value of the noise signals,

acquiring a plurality of gain values for the signals on the basis of the minimum value,

acquiring processed signals on the basis of the signals and the gain value, and

detecting a defect on the basis of at least one of the proceed signals.

8. The inspection method according to claim 7 , wherein the processing unit is further configured to perform the step of acquiring a threshold value as a function of intensity of the signal.

9. The inspection method according to claim 8 , wherein the processing unit is further configured to perform the steps of:

integrating the processed signals,

acquiring an integrated signal, and

detecting the defect on the basis of the integrated signal.

10. The inspection method according to claim 9 , further comprising the steps of:

rotating the sample by way of a rotating unit, and

forming a pattern on the surface of the sample.

11. The inspection method according to claim 7 , wherein the processing unit is further configured to perform the steps of:

acquiring an integrated signal, and

detecting the defect on the basis of the integrated signal.

12. The inspection method according claim 7 , further comprising the steps of:

rotating the sample by way of a rotating unit, and

forming a pattern on the surface of the sample.

Assignments (2)
CHANGE OF NAME AND ADDRESS Recorded Mar 30, 2020
From: HITACHI HIGH-TECHNOLOGIES CORPORATION
To: HITACHI HIGH-TECH CORPORATION
Reel/Frame 052259/0227 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 22, 2011
From: JINGU, TAKAHIRO; TAKAHASHI, KAZUO
To: HITACHI HIGH-TECHNOLOGIES CORPORATION
Reel/Frame 026785/0937 →