Photosensitive resin composition
View Patent ↗Disclosed is a photosensitive resin composition which has excellent transparency, heat resistance, thermal discoloration resistance, adhesion to a substrate and electrical characteristics, while exhibiting good developability and storage stability. Specifically disclosed is a photosensitive resin composition which contains the following components (A), (B) and (C). (A) a copolymer which contains (a1) hydroxyphenyl (meth)acrylate and (a2) an unsaturated epoxy compound as copolymerization components (B) a novolac resin which contains one or more phenols selected from among dimethylphenol, trimethylphenol, methylpropylphenol, dipropylphenol, butylphenol, methylbutylphenol, dibutylphenol, and 4,4′-dihydroxy-2,2′-diphenylpropane (C) a quinonediazide group-containing compound.
1. A photosensitive resin composition comprising copolymer [A] comprising hydroxyphenyl (meth)acrylate (a1) and unsaturated epoxy compound (a2) as copolymerization components, novolac resin [B] obtained by polycondensation of a phenol with formaldehyde, and quinonediazide group-containing compound [C], wherein the phenol is one or more phenols selected from dimethylphenol, trimethylphenol, methylpropylphenol, dipropylphenol, butylphenol, methylbutylphenol, dibutylphenol, or 4,4′-dihydroxy-2,2′-diphenylpropane.
2. The photosensitive resin composition according to claim 1 , wherein copolymer [A] comprises 20 to 45 mol % of hydroxyphenyl (meth)acrylate (a1) and 45 to 80 mol % of unsaturated epoxy compound (a2).
3. The photosensitive resin composition according to claim 1 , wherein novolac resin [B] is a novolac resin obtained by polycondensation of phenols comprising tert-butylphenol with formaldehyde.
4. The photosensitive resin composition according to claim 1 , wherein novolac resin [B] is a novolac resin having a carboxyl group.
5. The photosensitive resin composition according to claim 4 , wherein the total of phenolic hydroxy groups and carboxyl groups of copolymer [A] and novolac resin [B] per 1.0 equivalent of epoxy groups of copolymer [A] is 0.8 to 1.1 equivalents.
6. The photosensitive resin composition according to claim 2 , wherein novolac resin [B] is a novolac resin obtained by polycondensation of phenols comprising tert-butylphenol with formaldehyde.
7. The photosensitive resin composition according to claim 2 , wherein novolac resin [B] is a novolac resin having a carboxyl group.
8. The photosensitive resin composition according to claim 3 , wherein novolac resin [B] is a novolac resin having a carboxyl group.
9. The photosensitive resin composition according to claim 7 , wherein the total of phenolic hydroxy groups and carboxyl groups of copolymer [A] and novolac resin [B] per 1.0 equivalent of epoxy groups of copolymer [A] is 0.8 to 1.1 equivalents.
10. The photosensitive resin composition according to claim 8 , wherein the total of phenolic hydroxy groups and carboxyl groups of copolymer [A] and novolac resin [B] per 1.0 equivalent of epoxy groups of copolymer [A] is 0.8 to 1.1 equivalents.
11. The photosensitive resin composition according to claim 4 , wherein the total of phenolic hydroxy groups and carboxyl groups of copolymer [A] and novolac resin [B] per 1.0 equivalent of epoxy groups of copolymer [A] is 0.8 to 1.1 equivalents.