IP Library Granted Patent US 8,753,749
Granted Patent B2
US 8,753,749 · App. 13/205,272 · Granted Jun 17, 2014

Thermal expansion suppressing member and anti-thermally-expansive member

Inventors: Makoto Kubota (Yokohama, JP); Kaoru Miura (Matsudo, JP); Hisato Yabuta (Machida, JP); Yoshihiko Matsumura (Tokyo, JP); Yuichi Shimakawa (Uji, JP); Masaki Azuma (Uji, JP)
Assignees: Canon Kabushiki Kaisha; Kyoto University
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Quick Facts
Patent No.
US 8,753,749
App. No.
13/205,272
Granted
Jun 17, 2014
Kind
B2
Abstract

Provided are a thermal expansion suppressing member having negative thermal expansion properties and a metal-based anti-thermally-expansive member having small thermal expansion. More specifically, provided are a thermal expansion suppressing member, including at least an oxide represented by the following general formula (1), and an anti-thermally-expansive member, including a metal having a positive linear expansion coefficient at 20° C., and a solid body including at least an oxide represented by the following general formula (1), the metal and solid being joined to each other: (Bi 1-x M x )NiO 3 (1) where M represents at least one metal selected from the group consisting of La, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Y, and In; and x represents a numerical value of 0.02≦x≦0.15.

Claims (10)

1. A member, comprising:

a metal having a positive linear expansion coefficient at 20° C.; and

a solid body including at least an oxide represented by general formula (1):

(Bi 1-x M x )NiO 3   (1),

where M represents at least one metal selected from the group consisting of La, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Y, and In; and x represents a numerical value of 0.02≦x≦0.15,

wherein the metal having a positive linear expansion coefficient at 20° C. and the solid body are joined to each other, and

wherein a linear expansion coefficient at 20° C. of the member is less than that of the metal.

2. A member according to claim 1 , wherein a linear expansion coefficient α at 20° C. of the metal having a positive linear expansion coefficient is 10×10 −6 /K or more and 30×10 −6 /K or less.

3. A member according to claim 1 , wherein a thermal conductivity κ at 0° C. of the metal having a positive linear expansion coefficient is 100 W/mK or more and 410 W/mK or less.

4. A member according to claim 3 , wherein the metal having a positive linear expansion coefficient comprises at least one of aluminum and copper as a component.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 10, 2011
From: KUBOTA, MAKOTO; MIURA, KAORU; YABUTA, HISATO; MATSUMURA, YOSHIHIKO; SHIMAKAWA, YUICHI; AZUMA, MASAKI
To: CANON KABUSHIKI KAISHA; KYOTO UNIVERSITY
Reel/Frame 026727/0028 →
Priority Claims (2)
JP 2010-180885 · Aug 12, 2010 · national
JP 2011-097851 · Apr 26, 2011 · national
Continuity (1)
Related Publication 20120040196A1 · Feb 16, 2012