Test apparatus, test method and manufacturing method for testing a device under test packaged in a test package
View Patent ↗Provided is a test apparatus for testing a device under test, including a dicing section that dices a wafer on which a plurality of devices under test are formed to separate each of the devices under test, a test packaging section that packages each of the devices under test resulting from the dicing by the dicing section in an individual test package, a testing section that tests the devices under test packaged in the test packages, a removing section that removes the devices under test that have been tested from the test packages, and a commercial packaging section that packages the devices under test removed from the test packages in commercial packages.
1. A test apparatus for testing a device under test, comprising:
a test package including a first substrate and a second substrate, the second substrate being a flexible substrate allowing for contact between the first substrate and the second substrate while the device under test is between the first substrate and the second substrate;
a test packaging section that packages the device under test in the test package, the test packaging section operable to seal the device under test between the first substrate and the second substrate by deforming the second substrate to come into contact with the first substrate; and
a testing section that tests the device under test packaged in the test package.
2. The test apparatus according to claim 1 , further comprising a dicing section that dices a wafer on which a plurality o f the devices under test are formed to separate each of the devices under test, wherein
the test packaging section packages each of the devices under test resulting from the dicing by the dicing section in an individual test package.
3. The test apparatus according to claim 2 , further comprising:
a removing section that removes the devices under test that have been tested from the test packages; and
a commercial packaging section that packages the devices under test removed from the test packages in commercial packages.
4. The test apparatus according to claim 3 , wherein
the test packaging section packages each device under test in a test package created for the device under test, and
the removing section disposes of the test packages from which the devices under test have been removed.
5. The test apparatus according to claim 3 , wherein
the commercial packaging section packages the devices under test that have been determined, based on test results of the testing by the testing section, to be suitable for commercial use in commercial packages.
6. The test apparatus according to claim 3 , wherein
the commercial packaging section packages two or more of the devices under test that were tested individually in a single commercial package.
7. The test apparatus according to claim 6 , wherein
the commercial packaging section packages two or more of the devices under test, which resulted from the dicing of one or more wafers, in the commercial package by implementing the two or more devices three-dimensionally or in a multi-chip module.
8. The test apparatus according to claim 1 , wherein the test packaging section includes:
a detecting section that detects a position of a device terminal of the device under test that is not packaged;
a generating section that generates a substrate-side terminal, which connects to the device terminal, on one of the first substrate and the second substrate at a position corresponding to the device terminal; and
a mounting section that mounts the device under test on the one of the first substrate and the second substrate and connects the device terminal to the substrate-side terminal.
9. The test apparatus according to claim 1 , wherein
the test packaging section is operable to suction out gas between the first substrate and the second substrate using vacuum suction.
10. The test apparatus according to claim 1 , wherein
the test packaging section is operable to suction out gas between the first substrate and the second substrate using decompression suction.
11. The test apparatus according to claim 1 , wherein
the test packaging section is operable to sandwich the device under test between the first substrate and the second substrate by using a tensile force to press the second substrate against the first substrate.
12. The test apparatus according to claim 8 , wherein
the generating section includes a printing apparatus operable to print a designated pattern on the first substrate or the second substrate by applying a semiconductor material on the first substrate or the second substrate.
13. The test apparatus according to claim 8 , wherein
the mounting section mounts the device under test on the one of the first substrate and the second substrate using an amount of force that would not result in damage to the device under test if the device under test were to be subsequently removed from the one of the first substrate and the second substrate.
14. The test apparatus according to claim 8 , wherein
the generating section is operable to arrange a conductive terminal ball that serves as the substrate-side terminal on the one of the first substrate and the second substrate at the position corresponding to the device terminal.
15. A test method for testing a device under test, comprising:
packaging the device under test in a test package, the packaging including sealing the device under test between a first substrate and a second substrate by deforming the second substrate to come into contact with the first substrate, the second substrate being a flexible substrate allowing for contact between the first substrate and the second substrate while the device under test is between the first substrate and the second substrate; and
testing the device under test packaged in the test package.
16. The test method according to claim 15 , wherein
the packaging includes suctioning out gas between the first substrate and the second substrate using vacuum suction or decompression suction.
17. The test method according to claim 15 , wherein
the packaging includes sandwiching the device under test between the first substrate and the second substrate by using a tensile force to press the second substrate against the first substrate.
18. The test method according to claim 15 , further comprising:
detecting a position of a device terminal of the device under test that is not packaged;
generating a substrate-side terminal, which connects to the device terminal, on one of the first substrate and the second substrate at a position corresponding to the device terminal, the generating including printing a designated pattern on the one of the first substrate and the second substrate by applying a semiconductor material on the one of the first substrate and the second substrate;
mounting the device under test on the one of the first substrate and the second substrate; and
connecting the device terminal to the substrate-side terminal.
19. A manufacturing method for manufacturing a device, comprising:
dicing a wafer on which a plurality of the devices are formed to separate each of the devices;
packaging each of the devices resulting from the dicing in an individual test package, the packaging including sealing the device between a first substrate and a second substrate by deforming the second substrate to come into contact with the first substrate, the second substrate being a flexible substrate allowing for contact between the first substrate and the second substrate while the device is between the first substrate and the second substrate;
testing the devices packaged in the test packages;
removing the devices that have been tested from the test packages; and
packaging the devices removed from the test packages in commercial packages.
20. The manufacturing method according to claim 19 , wherein
said packaging each of the devices resulting from the dicing includes suctioning out gas between the first substrate and the second substrate using vacuum suction or decompression suction.
21. The manufacturing method according to claim 19 , wherein
said packaging each of the devices resulting from the dicing includes sandwiching the device under test between the first substrate and the second substrate by using a tensile force to press the second substrate against the first substrate.
22. The manufacturing method according to claim 19 , wherein
said packaging each of the devices includes:
detecting a position of a device terminal of the device that is not packaged;
generating a substrate-side terminal, which connects to the device terminal, on one of the first substrate and the second substrate at a position corresponding to the device terminal, the generating including printing a designated pattern on the one of the first substrate and the second substrate by applying a semiconductor material on the one of the first substrate and the second substrate;
mounting the device on the one of the first substrate and the second substrate; and
connecting the device terminal to the substrate-side terminal.