Fixing semiconductor die in dry and pressure supported assembly processes
Semiconductor die are assembled on a substrate by providing the semiconductor die, substrate, and an elastically deformable foil fixture preformed with one or more sunken regions having sidewalls and a bottom, and placing the semiconductor die in the one or more sunken regions so that the foil fixture is populated with a first side of the semiconductor die facing the bottom of the one or more sunken regions and a second opposing side of the semiconductor die facing away from the bottom of the one or more sunken regions. The substrate is placed adjacent the second side of the semiconductor die with a joining material interposed between the substrate and the semiconductor die. The substrate and the populated foil fixture are pressed together at an elevated temperature and pressure via first and second pressing tool members so that the substrate is attached to the second side of the semiconductor die via the joining material.
1. A method of assembling semiconductor die on a substrate, comprising:
providing a plurality of semiconductor die, a substrate, and an elastically deformable foil fixture preformed with one or more sunken regions having sidewalls and a bottom;
placing the plurality of semiconductor die in the one or more sunken regions to populate the foil fixture, with a first side of the plurality of semiconductor die facing the bottom of the one or more sunken regions and a second opposing side of the plurality of semiconductor die facing away from the bottom of the one or more sunken regions;
placing the substrate adjacent the second side of the plurality of semiconductor die with a joining material interposed between the substrate and the plurality of semiconductor die; and
pressing together the substrate and the populated foil fixture at an elevated temperature and pressure via first and second pressing tool members so that the substrate is attached to the second side of the plurality of semiconductor die via the joining material,
wherein end regions of the populated foil fixture form a seal between the first and second pressing tool members while the substrate and the populated foil fixture are pressed together at an elevated temperature and pressure.
2. The method of claim 1 , wherein prior to pressing together the substrate and the populated foil fixture at an elevated temperature and pressure the method further comprises:
clamping the populated foil fixture to the substrate so that the substrate is positioned above the populated foil fixture; and
flipping the clamped arrangement so that the substrate is positioned below the populated foil fixture.
3. The method of claim 1 , wherein the foil fixture is preformed to fit edge and corner regions of the substrate which are devoid of semiconductor die.
4. The method of claim 1 , wherein the joining material is a sintering material and the first and second pressing tool members are part of a sintering tool.
5. The method of claim 1 , wherein the joining material is a soldering material and the first and second pressing tool members are part of a diffusion soldering tool.
6. The method of claim 1 , wherein the first or second pressing tool member includes a silicone pad which exerts hydrostatic pressure for pressing together the substrate and the populated foil fixture.
7. The method of claim 1 , wherein the pressing tool member adjacent the populated foil fixture includes a plurality of plungers for pressing the bottom of the one or more sunken regions of the foil fixture against the first side of the plurality of semiconductor die.
8. The method of claim 1 , wherein the one or more sunken regions of the foil fixture have a shape and spacing corresponding to the plurality of semiconductor die, one or more support substrates disposed between the first side of the plurality of semiconductor die and the bottom of the one or more sunken regions or a base plate disposed between the one or more support substrates and the bottom of the one or more sunken regions.
9. The method of claim 1 , wherein prior to pressing together the substrate and the populated foil fixture at an elevated temperature and pressure the method further comprises:
heating a tool die having a base and a plurality of spaced apart protrusions extending from the base which correspond to the shape and spacing of the plurality of semiconductor die, one or more support substrates disposed between the first side of the plurality of semiconductor die and the bottom of the one or more sunken regions or a base plate disposed between the one or more support substrates and the bottom of the one or more sunken regions; and
pressing the foil fixture against the tool die while the tool die is heated to preform the foil fixture.
10. A method of assembling semiconductor die on a substrate, comprising:
providing a plurality of semiconductor die, a substrate, and an elastically deformable foil fixture preformed with one or more sunken regions having sidewalls and a bottom;
placing the plurality of semiconductor die in the one or more sunken regions to populate the foil fixture, with a first side of the plurality of semiconductor die facing the bottom of the one or more sunken regions and a second opposing side of the plurality of semiconductor die facing away from the bottom of the one or more sunken regions;
placing the substrate adjacent the second side of the plurality of semiconductor die with a joining material interposed between the substrate and the plurality of semiconductor die; and
pressing together the substrate and the populated foil fixture at an elevated temperature and pressure via first and second pressing tool members so that the substrate is attached to the second side of the plurality of semiconductor die via the joining material,
wherein the pressing tool member adjacent the populated foil fixture includes a plurality of plungers for pressing the bottom of the one or more sunken regions of the foil fixture against the first side of the plurality of semiconductor die.
11. A method of assembling semiconductor die on a substrate, comprising:
providing a plurality of semiconductor die, a substrate, and an elastically deformable foil fixture preformed with one or more sunken regions having sidewalls and a bottom;
placing the plurality of semiconductor die in the one or more sunken regions to populate the foil fixture, with a first side of the plurality of semiconductor die facing the bottom of the one or more sunken regions and a second opposing side of the plurality of semiconductor die facing away from the bottom of the one or more sunken regions;
placing the substrate adjacent the second side of the plurality of semiconductor die with a joining material interposed between the substrate and the plurality of semiconductor die; and
pressing together the substrate and the populated foil fixture at an elevated temperature and pressure via first and second pressing tool members so that the substrate is attached to the second side of the plurality of semiconductor die via the joining material,
wherein prior to pressing together the substrate and the populated foil fixture at an elevated temperature and pressure, the method further comprises:
heating a tool die having a base and a plurality of spaced apart protrusions extending from the base which correspond to the shape and spacing of the plurality of semiconductor die, one or more support substrates disposed between the first side of the plurality of semiconductor die and the bottom of the one or more sunken regions or a base plate disposed between the one or more support substrates and the bottom of the one or more sunken regions; and
pressing the foil fixture against the tool die while the tool die is heated to preform the foil fixture.