SEMICONDUCTOR DEVICE WITH NESTED ROWS OF CONTACTS
A molded surface mount semiconductor device has electrical contact elements disposed in a set of pairs of zigzag rows extending adjacent and generally parallel to opposite edges of an active face of a semiconductor die. Each of the pairs of rows includes an inner zigzag row of electrical contact elements nested inside an outer zigzag row of electrical contact elements. The electrical contact elements of the inner and outer zigzag rows are partially inter-digitated. A lead frame used in making the device also has a die pad located inside the set of pairs of zigzag rows, and an outer frame element located outside the set of pairs of zigzag rows, and which support the electrical contact elements of the inner and outer zigzag rows respectively.
1 . A semiconductor device, comprising:
a semiconductor die;
electrical contact elements individually connected with said semiconductor die; and
an electrically insulating molding material that encapsulates said semiconductor die and said electrical contact elements so that the device presents a top face, a bottom active face in which said electrical contact elements are exposed, and transversely extending edges;
wherein said electrical contact elements are disposed in a set of pairs of zigzag rows extending at or adjacent and generally parallel to opposite edges of said active face, each of said pairs comprising an inner zigzag row of electrical contact elements nested inside an outer zigzag row of electrical contact elements, said electrical contact elements of said inner zigzag row and said outer zigzag row being partially inter-digitated.
2 . The semiconductor device of claim 1 , wherein said semiconductor die is mounted on a die pad disposed between said set of pairs of zigzag rows of electrical contact elements.
3 . The semiconductor device of claim 2 , wherein said molding material leaves said die pad exposed in said active face of the semiconductor device.
4 . The semiconductor device of claim 1 , wherein said electrical contact elements are disposed in two orthogonal sets of said pairs of zigzag rows, said semiconductor device forming a quad package.
5 . The semiconductor device of claim 1 , wherein said set of pairs of zigzag rows of electrical contact elements has four corner areas, and wherein each corner area includes electrical contact elements only of said outer zigzag row.
6 . A lead frame array for semiconductor devices that each present respectively a top face, a bottom active face, and transversely extending edges, each lead frame of said array comprising:
electrical contact elements disposed in a set of pairs of zigzag rows extending at or adjacent and generally parallel to opposite edges of said active face, each pair comprising an inner zigzag row of electrical contact elements nested inside an outer zigzag row of electrical contact elements, said electrical contact elements of said inner zigzag row and said outer zigzag row being partially inter-digitated; and
an inner frame element disposed inside said set of pairs of zigzag rows, and an outer frame element disposed outside said set of pairs of zigzag rows, said inner and outer frame elements connecting with and supporting said electrical contact elements of said inner and outer zigzag rows respectively, and said outer frame element of adjacent lead frames of said array being common to said adjacent lead frames.
7 . The lead frame array of claim 6 , wherein said inner frame element comprises a die pad disposed between said set of pairs of zigzag rows of electrical contact elements for mounting said semiconductor die.
8 . The lead frame array of claim 6 , wherein said electrical contact elements are disposed in two orthogonal sets of said pairs of zigzag rows, whereby to form a quad package for said semiconductor device.
9 . The lead frame array of claim 6 , wherein each lead frame has four corner areas, and wherein each corner area includes electrical contact elements only of said outer zigzag row.
10 . A method of making a semiconductor device, comprising:
providing a semiconductor die;
providing electrical contact elements;
connecting said electrical contact elements electrically with said semiconductor die; and
encapsulating with a molding material said semiconductor die and said electrical contact elements so that the device presents a top face, a bottom active face in which said electrical contact elements are exposed, and transversely extending edges;
wherein said electrical contact elements are disposed in a set of pairs of zigzag rows extending at or adjacent and generally parallel to opposite edges of said active face, each of said pairs comprising an inner zigzag row of electrical contact elements nested inside an outer zigzag row of electrical contact elements, said electrical contact elements of said inner zigzag row and said outer zigzag row being partially inter-digitated.
11 . The method of making a semiconductor device of claim 10 , further comprising:
providing a lead frame comprising said electrical contact elements, an inner frame element disposed inside said set of pairs of zigzag rows, and an outer frame element disposed outside said set of pairs of zigzag rows, said inner and outer frame elements connecting with and supporting said electrical contact elements of said inner and outer zigzag rows respectively; and
separating said electrical contact elements of said inner and outer zigzag rows from said inner and outer frame elements.
12 . The method of making a semiconductor device of claim 11 , wherein said lead frame is provided as part of an array of lead frames comprising respective sets of pairs of said inner and outer zigzag rows of electrical contact elements, and respective inner frame elements disposed inside said set of pairs of zigzag rows, and outer frame elements disposed outside said set of pairs of zigzag rows, said outer frame elements being common to adjacent lead frames of said array; and separating said electrical contact elements of said inner and outer zigzag rows from said inner and outer frame elements includes singulating said plurality of semiconductor devices.
13 . The method of making a semiconductor device of claim 12 , wherein separating said electrical contact elements of said inner zigzag rows from said inner frame elements includes cutting connections between said inner frame elements of said lead frame and said electrical contact elements of said inner zigzag rows after applying said molding material.
14 . The method of making a semiconductor device of claim 10 , wherein said electrical contact elements are disposed in two orthogonal sets of said pairs of zigzag rows, said semiconductor device forming a quad package.