Pressure sensor device, electronic apparatus, and method of mounting pressure sensor device
A pressure sensor device includes a semiconductor pressure sensor element and a base part. The base part includes a mounting surface, a through hole having an opening on the mounting surface and configured to introduce a fluid to the semiconductor pressure sensor element, a soldered part that is to be soldered and is provided on the mounting surface, and a step-like structure formed on the mounting surface between the opening and the soldered part.
1. A pressure sensor device, comprising:
a semiconductor pressure sensor element; and
a base part including
a mounting surface,
a through hole having an opening on the mounting surface and configured to introduce a fluid to the semiconductor pressure sensor element,
a soldered part that is to be soldered and is provided on the mounting surface, and
a step-like structure formed on the mounting surface between the opening and the soldered part,
wherein a gap exists between the soldered part and the step-like structure said gap existing between the mounting surface and another surface that is to be soldered to said soldered part.
2. The pressure sensor device as claimed in claim 1 , wherein the step-like structure is a recess formed in a resist film on the mounting surface.
3. The pressure sensor device as claimed in claim 1 , wherein the step-like structure is a silk-screen print printed on the mounting surface.
4. An electronic apparatus, comprising:
a pressure sensor device including
a semiconductor pressure sensor element, and
a base part that includes
a first mounting surface,
a through hole having an opening on the first mounting surface and configured to introduce a fluid to the semiconductor pressure sensor element,
a soldered part that is to be soldered and is provided on the first mounting surface, and
a step-like structure formed on the first mounting surface between the opening of the through hole and the soldered part; and
a mounting part including
a second mounting surface on which the pressure sensor device is mounted by soldering the soldered part onto the second mounting surface, and
a communicating hole having an opening on the second mounting surface and communicating with the through hole,
wherein the pressure sensor device is mounted on the second mounting surface such that the opening of the through hole and the step-like structure are located within a projection of the opening of the communicating hole, and
wherein a gap exists between the soldered part and the step-like structure, said gap existing between the first mounting surface and the second mounting surface.
5. A method of mounting a pressure sensor device on a mounting part,
wherein the pressure sensor device includes
a semiconductor pressure sensor element, and
a base part including
a first mounting surface,
a through hole having an opening on the first mounting surface and configured to introduce a fluid to the semiconductor pressure sensor element,
a soldered part that is to be soldered and is provided on the first mounting surface, and
a step-like structure formed on the first mounting surface between the opening of the through hole and the soldered part;
wherein the mounting part includes
a second mounting surface on which the pressure sensor device is mounted by soldering the soldered part onto the second mounting surface, and
a communicating hole having an opening on the second mounting surface and communicating with the through hole,
wherein a gap exists between the soldered part and the step-like structure, said gap existing between the first mounting surface and the second mounting surface,
the method comprising:
mounting the pressure sensor device on the second mounting surface such that the opening of the through hole and the step-like structure are located within a projection of the opening of the communicating hole.