Interconnection systems
Interconnection systems are shown that include communication contacts, and a guide. Configurations are shown with a guide that locates a male portion with respect to a female portion and guides their engagement before any communication contacts are engaged. Configurations are also shown with a guide that includes one or more power contacts.
1. An interconnection system, comprising:
a female portion and a male portion;
a plurality of first communication contacts located within the female portion;
a plurality of corresponding second communication contacts located on the male portion, to interface with the first communication contacts;
a guide on one of the portions, separate from the communication contacts, to engage with a guide hole on the other portion, the guide including:
a leading taper section;
a tolerance fit section; and
wherein the tolerance fit section is configured to engage with the guide hole before the first communication contacts interface with the second communication contacts, and wherein the guide further includes a power contact surface and a ground contact surface.
2. The interconnection system of claim 1 , wherein the first and second communication contacts include electrical communication contacts.
3. The interconnection system of claim 1 , wherein the first and second communication contacts include optical communication contacts.
4. The interconnection system of claim 1 , wherein at least a portion of the first and second communication contacts are configured in a USB standard configuration.
5. The interconnection system of claim 4 , wherein at least a portion of the first and second communication contacts are configured in a mini USB standard configuration.
6. The interconnection system of claim 4 , wherein at least a portion of the first and second communication contacts are configured in a micro USB standard configuration.
7. The interconnection system of claim 4 , wherein at least a portion of the first and second communication contacts are configured in a USB 2.0 standard configuration.
8. The interconnection system of claim 4 , wherein at least a portion of the first and second communication contacts are configured in a USB 3.0 standard configuration.
9. The interconnection system of claim 1 , further including a port for transmission of media.
10. The interconnection system of claim 1 , further including a heat pipe.
11. The interconnection system of claim 1 , wherein the leading taper section is non-conductive.
12. The interconnection system of claim 1 , wherein the leading taper section is conductive.
13. The interconnection system of claim 1 , wherein the guide is within the female portion, and the guide hole is on the male portion.
14. The interconnection system of claim 1 , wherein the power contact surface is configured to engage with the guide hole before the first communication contacts interface with the second communication contacts.
15. The interconnection system of claim 1 , wherein the power contact surface is located in a recess below a surface of the tolerance fit section.
16. The interconnection system of claim 1 , wherein the ground contact is coupled to the leading taper section such that the ground contact engages with the guide hole before the power contact engages with the guide hole.
17. The interconnection system of claim wherein the power contact is on an opposite surface of the guide from the ground contact.
18. The interconnection system of claim 1 , wherein the guide includes two different power contacts, each assigned to operate at different voltages.
19. The interconnection system of claim 18 , wherein the guide includes a system peripheral interface (SPI) contact.
20. A portion of an interconnection system, comprising:
a plurality of communication contacts;
a guide hole, separate from the communication contacts, to engage with a corresponding guide in another portion of the interconnection system before the communication contacts interface with communication contacts of the other portion of the interconnection system;
wherein the guide hole includes power contact surfaces having a supply contact and a ground contact.
21. The portion of an interconnection system of claim 20 , wherein the power contact surface is configured to engage with the guide before the communication contacts interface with the corresponding communication contacts of the other portion of the interconnection system.
22. The portion of an interconnection system of claim 20 , wherein the supply contact is on an opposite surface from the ground contact.
23. The portion of an interconnection system of claim 22 , wherein the guide hole includes two different supply contacts, each assigned to operate at different voltages.
24. The portion of an interconnection system of claim 23 , wherein the guide hole includes a system peripheral interface (SPI) contact.
25. The portion of an interconnection system of claim 20 , wherein the portion of the interconnection system is integrated with a peripheral electronic device.
26. A portion of an interconnection system, comprising:
a plurality of communication contacts;
a guide, separate from the communication contacts, to engage with a guide hole of another portion of the interconnection system, the guide including:
a leading taper section; and
a tolerance fit section, wherein the tolerance fit section is configured to engage with the guide hole of the other portion before the communication contacts interface with communication contacts of the other portion, wherein the guide hole includes a power contact and a ground contact surface configured to engage with the guide before the communication contacts interface with the corresponding communication contacts of the other portion of the interconnection system.
27. The portion of the interconnection system of claim 26 , wherein the guide is further configured to provide a heat exchange capability between the portion and the other portion.
28. The portion of the interconnection system of claim 26 , wherein the guide is further configured to provide a conduit for exchanging materials.
29. The portion of the interconnection system of claim 26 , wherein the portion is arranged as a socket of a host device.