Schottky and MOSFET+Schottky structures, devices, and methods
View Patent ↗Power devices which include trench Schottky barrier diodes and also (preferably) trench-gate transistors. Isolation trenches flank both the gate regions and the diode mesas, and have an additional diffusion below the bottom of the isolation trenches. The additional diffusion helps to reduce the electric field (and leakage), when the device is in the OFF state, at both the Schottky barrier and at the body diode.
1. A semiconductor device, comprising:
trench transistors, each including at least an n-type semiconductor source region and a p-type semiconductor body region defining a junction therebetween;
trench diodes, each including a Schottky barrier where a metallic material touches an n-type semiconductor anode region without making ohmic contact;
one or more semiconductor drift regions, lying at least partially below said body regions and/or said anode regions;
isolation trenches;
shield diffusions lying at least partly beneath said isolation trenches;
wherein at least some ones of said isolation trenches adjoin both a trench transistor and a trench diode;
whereby said shield diffusions reduce electric field at said Schottky barrier, and also at said junction between said source region and said body region.
2. The semiconductor device of claim 1 , wherein said isolation trenches each include a respective field plate.
3. The semiconductor device of claim 1 , wherein said Schottky barrier is provided by a contact between silicon and a metal silicide.
4. The semiconductor device of claim 1 , wherein said Schottky barrier is provided by a contact between a metallic substance and a semiconductor which is doped to less than 10 17 cm −3 .
5. The semiconductor device of claim 1 , wherein said Schottky barrier is provided by a contact between platinum or titanium silicide and silicon, and is laterally surrounded by a p-type guard ring.
6. The semiconductor device of claim 1 , wherein said shield diffusions have a minimum net doping concentration of less than 10 16 cm −3 .
7. The semiconductor device of claim 1 , wherein said shield diffusions have a maximum net doping concentration of more than 10 17 cm −3 p-type.
8. The semiconductor device of claim 1 , wherein said source, body, drift, and drain regions all consist essentially of silicon.
9. The semiconductor device of claim 1 , further comprising a frontside metallization which is electrically connected to said source, to said body, and to a metallic portion of said Schottky barrier.
10. The semiconductor device of claim 1 , further comprising a back side metallization which is electrically connected to said drain and to a metallic portion of said Schottky barrier.
11. A semiconductor device, comprising:
trench transistors, each including at least an n-type semiconductor source region and a p-type semiconductor body region defining a junction therebetween;
trench diodes, each including a Schottky barrier where a metallic material touches an n-type semiconductor anode region without making ohmic contact, and a p-type guard ring which laterally abuts said Schottky barrier;
one or more semiconductor drift regions, lying at least partially below said body regions and/or said anode regions;
isolation trenches;
shield diffusions lying at least partly beneath said isolation trenches;
wherein at least some ones of said isolation trenches adjoin both a trench transistor and a trench diode;
and wherein said p-type guard ring corresponds to a lateral edge of the same population of dopants as those which form said p-type semiconductor body region;
whereby said shield diffusions reduce electric field at said Schottky barrier, and also at said junction between said source region and said body region.
12. The semiconductor device of claim 11 , wherein said shield diffusions have a maximum net doping concentration of more than 10 17 cm −3 p-type.
13. The semiconductor device of claim 11 , wherein said source, body, drift, and drain regions all consist essentially of silicon.
14. The semiconductor device of claim 11 , further comprising a frontside metallization which is electrically connected to said source, to said body, and to a metallic portion of said Schottky barrier.
15. The semiconductor device of claim 11 , further comprising a back side metallization which is electrically connected to said drain and to a metallic portion of said Schottky barrier.
16. A semiconductor device, comprising:
trench transistors, each including at least a semiconductor source region and a semiconductor body region defining a junction therebetween;
trench diodes, each including a Schottky barrier;
isolation trenches;
deep shield diffusions lying at least partly beneath said isolation trenches;
wherein at least some ones of said isolation trenches adjoin both a trench transistor and a trench diode;
whereby said shield diffusions reduce electric field at said Schottky barrier, and also at said junction between said source region and said body region.
17. The device of claim 16 , wherein said source regions are n-type semiconductor regions.
18. The semiconductor device of claim 16 , wherein said isolation trenches each include a respective field plate.
19. The semiconductor device of claim 16 , wherein said Schottky barrier is provided by a contact between silicon and a metal silicide.
20. The semiconductor device of claim 16 , wherein said Schottky barrier is provided by a contact between a metallic substance and a semiconductor which is doped to less than 10 17 cm −3 .