Semiconductor light emitting device

1. A semiconductor light emitting device, comprising:

a light emitting layer including an active layer;

a light transmitting layer transmittable with respect to light emitted from the light emitting layer, the light transmitting layer being amorphous and including silicon oxide; and

a first semiconductor layer of a first conductivity type, the first semiconductor layer including silicon, the first semiconductor layer being provided between the light emitting layer and the light transmitting layer, the first semiconductor layer directly contacting the light transmitting layer, the first semiconductor layer having a thermal expansion coefficient larger than a thermal expansion coefficient of the light transmitting layer, having a lattice constant smaller than a lattice constant of the active layer, and having a tensile stress in an in-plane direction,

wherein the light emitted from the light emitting layer passes through the light transmitting layer and is output to an outside of the semiconductor light emitting device.

2. The device according to claim 1 , wherein the light transmitting layer includes silicon dioxide.

3. The device according to claim 1 , wherein a wavelength of the light emitted from the light emitting layer is 410 nanometers or more and 550 nanometers or less.

4. The device according to claim 1 , wherein

the active layer includes InGaN, and

the first semiconductor layer includes GaN.

5. The device according to claim 1 , further comprising:

a reflecting layer configured to reflect the light,

the light transmitting layer being disposed between the first semiconductor layer and the reflecting layer.

6. The device according to claim 5 , further comprising:

a second semiconductor layer having a second conductivity type different from the first conductivity type; and

an electrode electrically connected to the second semiconductor layer and being transmittable with respect to the light emitted from the light emitting layer,

the light emitting layer being disposed between the first semiconductor layer and the second semiconductor layer, and

the second semiconductor layer being disposed between the electrode and the light emitting layer.

7. The device according to claim 1 , further comprising:

a second semiconductor layer having a second conductivity type different from the first conductivity type,

the light emitting layer being disposed between the first semiconductor layer and the second semiconductor layer.

8. The device according to claim 1 , wherein

the light emitting layer further includes a plurality of barrier layers having a bandgap energy larger than a bandgap energy of the active layer, and

the active layer is provided between the barrier layers.

9. The device according to claim 1 , wherein

the light emitting layer includes a plurality of the active layers,

the light emitting layer further includes a plurality of barrier layers having a bandgap energy larger than a bandgap energy of the active layers, and

each of the active layers is disposed between each of the barrier layers.

10. The device according to claim 1 , wherein

the first semiconductor layer includes a first portion near the light transmitting layer and a second portion provided between the first portion and the light emitting layer, and

a concentration of silicon in the first portion is higher than a concentration of silicon in the second portion.

11. The device according to claim 1 , wherein

the first semiconductor is formed on a silicon layer provided on a light transmitting film serving as the light transmitting layer, and

the first semiconductor layer is made to contact the light transmitting film by eliminating the silicon layer after formation of the first semiconductor layer.

12. The device according to claim 11 , wherein a thickness of the silicon layer is 2 nanometers or more and 20 nanometers or less.

13. The device according to claim 11 , wherein the first semiconductor layer contains silicon atoms introduced from the silicon layer.

14. The device according to claim 11 , wherein the elimination of the silicon layer includes an incorporation of silicon atoms in the silicon layer into the first semiconductor layer by increasing a temperature of the silicon layer.

15. The device according to claim 1 , wherein the tensile stress in the in-plane has a component in a direction intersecting a direction from the first semiconductor layer toward the light transmitting layer.

16. The device according to claim 1 , wherein the tensile stress in the in-plane has an in-plane components in a direction perpendicular to a direction from the first semiconductor layer toward the light transmitting layer.

17. The device according to claim 1 , wherein the tensile stress in the in-plane is a stress parallel to a (0001) plane of the first semiconductor layer.

18. The device according to claim 1 , wherein the first semiconductor layer is made of a GaN layer, and the GaN layer has a Raman shift smaller than 568 cm −1 .

19. The device according to claim 18 , wherein the first semiconductor layer is epitaxially grown on the light transmitting layer continuously.

20. The device according to claim 1 , wherein the first semiconductor layer is made of a first nitride semiconductor layer having the tensile stress in the in-plane direction, the first nitride semiconductor layer having a first Raman shift,

a second nitride semiconductor has a second Raman shift, the second nitride semiconductor has no stress and a same chemical composition as the first nitride semiconductor layer, and

the first Raman shift is smaller than the second Raman shift.

21. The device according to claim 20 , wherein the first semiconductor layer is epitaxially grown on the light transmitting layer continuously.

22. The device according to claim 8 , wherein each of the plurality of barrier layers is thicker than the active layer.