Semiconductor light emitting device

1. A semiconductor light emitting device, comprising:

an n-type semiconductor layer;

a p-type semiconductor layer; and

a light emitting part provided between the n-type semiconductor layer and the p-type semiconductor layer and including a first light emitting layer,

the first light emitting layer including:

a first barrier layer including a nitride semiconductor;

a first well layer provided between the n-type semiconductor layer and the first barrier layer and including a nitride semiconductor;

a first n-side intermediate layer provided between the first well layer and the first barrier layer and including a nitride semiconductor; and

a first p-side intermediate layer provided between the first n-side intermediate layer and the first barrier layer and including a nitride semiconductor;

an In composition ratio among group III elements in the first n-side intermediate layer decreasing along a first direction from the n-type semiconductor layer toward the p-type semiconductor layer,

an In composition ratio among group III elements in the first p-side intermediate layer decreasing along the first direction,

an average change rate along the first direction of the In composition ratio in the first p-side intermediate layer being lower than an average change rate along the first direction of the In composition ratio in the first n-side intermediate layer, and

wherein a thickness of the first p-side intermediate layer is equal to or more than a thickness of the first n-side intermediate layer, and equal to or more than a thickness of the first well layer.

2. The device according to claim 1 , wherein

the light emitting part further includes a second light emitting layer stacked with the first light emitting layer along the first direction, wherein

the second light emitting layer includes:

a second barrier layer including a nitride semiconductor;

a second well layer provided between the n-type semiconductor layer and the second barrier layer and including a nitride semiconductor;

a second n-side intermediate layer provided between the second well layer and the second barrier layer and including a nitride semiconductor; and

a second p-side intermediate layer provided between the second n-side intermediate layer and the second barrier layer and including a nitride semiconductor,

wherein

an In composition ratio among group III elements in the second n-side intermediate layer decreases along a first direction from the n-type semiconductor layer toward the p-type semiconductor layer, wherein

an In composition ratio among group III elements in the second p-side intermediate layer decreases along the first direction, and

an average change rate along the first direction of the In composition ratio in the second p-side intermediate layer is lower than an average change rate along the first direction of the In composition ratio in the second n-side intermediate layer.

3. The device according to claim 2 , wherein the second light emitting layer is provided between the first light emitting layer and the p-type semiconductor layer, and the first barrier layer is in contact with the second well layer.

4. The device according to claim 1 , wherein

the first well layer contains In,

the In composition ratio in a portion of the first n-side intermediate layer in contact with the first well layer is equal to or less than an In composition ratio among group III elements contained in the first well layer, and

the In composition ratio in a portion of the first p-side intermediate layer in contact with the first n-side intermediate layer is equal to or less than the In composition ratio in a portion of the first n-side intermediate layer in contact with the first p-side intermediate layer.

5. The device according to claim 1 , wherein an In composition ratio among group III elements in the first well layer is 0.18 or more.

6. The device according to claim 1 , wherein the In composition ratio in a portion of the first n-side intermediate layer in contact with the first p-side intermediate layer is ¼ or less of an In composition ratio among group III elements in the first well layer.

7. The device according to claim 1 , wherein

a thickness of the first n-side intermediate layer is ½ or more and two times or less of a thickness of the first well layer.

8. The device according to claim 1 , wherein the first barrier layer includes GaN.

9. The device according to claim 1 , wherein the first well layer has a portion in which the In composition ratio among group III elements is constant along the first direction.

10. The device according to claim 1 , wherein a peak wavelength of light emitted from the light emitting part is 500 nanometers or more.

11. The device according to claim 1 , wherein

the first barrier layer contains In,

the In composition ratio in a portion of the first p-side intermediate layer in contact with the first barrier layer is equal to or more than an In composition ratio among group III elements in the first barrier layer.

12. The device according to claim 1 , wherein the In composition ratio in a portion of the first n-side intermediate layer in contact with the first p-side intermediate layer is 0.03 or less.

13. The device according to claim 1 , wherein the first light emitting layer further includes an n-side barrier layer provided between the n-type semiconductor layer and the first well layer and the n-side barrier layer is in contract with the first well layer.

14. The device according to claim 1 , wherein a thickness of the first well layer is 1 nanometer or more and less than 3.5 nanometers.

15. A semiconductor light emitting device, comprising:

an n-type semiconductor layer;

a p-type semiconductor layer; and

a light emitting part provided between the n-type semiconductor layer and the p-type semiconductor layer and including a first light emitting layer,

the first light emitting layer including:

a first barrier layer including a nitride semiconductor containing p-type impurity;

a first well layer provided between the n-type semiconductor layer and the first barrier layer and including a nitride semiconductor;

a first n-side intermediate layer provided between the first well layer and the first barrier layer and including a nitride semiconductor; and

a first p-side intermediate layer provided between the first n-side intermediate layer and the first barrier layer and including a nitride semiconductor;

an In composition ratio among group III elements in the first n-side intermediate layer decreasing along a first direction from the n-type semiconductor layer toward the p-type semiconductor layer,

an In composition ratio among group III elements in the first p-side intermediate layer decreasing along the first direction,

an average change rate along the first direction of the In composition ratio in the first p-side intermediate layer being lower than an average change rate along the first direction of the In composition ratio in the first n-side intermediate layer, and

wherein a concentration of the p-type impurity contained in the first barrier layer is lower than a concentration of a p-type impurity contained in the p-type semiconductor layer.

16. A semiconductor light emitting device, comprising:

an n-type semiconductor layer;

a p-type semiconductor layer; and

a light emitting part provided between the n-type semiconductor layer and the p-type semiconductor layer and including a first light emitting layer,

the first light emitting layer including:

a first barrier layer including a nitride semiconductor;

a first well layer provided between the n-type semiconductor layer and the first barrier layer and including a nitride semiconductor;

a first n-side intermediate layer provided between the first well layer and the first barrier layer and including a nitride semiconductor; and

a first p-side intermediate layer provided between the first n-side intermediate layer and the first barrier layer and including a nitride semiconductor;

an In composition ratio among group III elements in the first n-side intermediate layer decreasing along a first direction from the n-type semiconductor layer toward the p-type semiconductor layer,

an In composition ratio among group III elements in the first p-side intermediate layer decreasing along the first direction,

an average change rate along the first direction of the In composition ratio in the first p-side intermediate layer being lower than an average change rate along the first direction of the In composition ratio in the first n-side intermediate layer, and

wherein a thickness of the first n-side intermediate layer is 1 nanometer or more and less than 5 nanometers.

17. A semiconductor light emitting device, comprising:

an n-type semiconductor layer;

a p-type semiconductor layer; and

a light emitting part provided between the n-type semiconductor layer and the p-type semiconductor layer and including a first light emitting layer,

the first light emitting layer including:

a first barrier layer including a nitride semiconductor;

a first well layer provided between the n-type semiconductor layer and the first barrier layer and including a nitride semiconductor;

a first n-side intermediate layer provided between the first well layer and the first barrier layer and including a nitride semiconductor; and

a first p-side intermediate layer provided between the first n-side intermediate layer and the first barrier layer and including a nitride semiconductor;

an In composition ratio among group III elements in the first n-side intermediate layer decreasing along a first direction from the n-type semiconductor layer toward the p-type semiconductor layer,

an In composition ratio among group III elements in the first p-side intermediate layer decreasing along the first direction,

an average change rate along the first direction of the In composition ratio in the first-side intermediate layer being lower than an average change rate along the first direction of the In composition ratio in the first n-side intermediate layer, and

wherein a thickness of the first p-side intermediate layer is 3 nanometers or more and less than 8 nanometers.

18. A semiconductor light emitting device, comprising:

an n-type semiconductor layer;

a p-type semiconductor layer; and

a light emitting part provided between the n-type semiconductor layer and the p-type semiconductor layer and including a first light emitting layer,

the first light emitting layer including:

a first barrier layer including a nitride semiconductor;

a first well layer provided between the n-type semiconductor layer and the first barrier layer and including a nitride semiconductor;

a first n-side intermediate layer provided between the first well layer and the first barrier layer and including a nitride semiconductor; and

a first p-side intermediate layer provided between the first n-side intermediate layer and the first barrier layer and including a nitride semiconductor;

an In composition ratio among group III elements in the first n-side intermediate layer decreasing along a first direction from the n-type semiconductor layer toward the p-type semiconductor layer,

an In composition ratio among group III elements in the first p-side intermediate layer decreasing along the first direction,

an average change rate along the first direction of the In composition ratio in the first p-side intermediate layer being lower than an average change rate along the first direction of the In composition ratio in the first n-side intermediate layer, and

wherein a change rate along the first direction of the In composition ratio in a center portion along the first direction of the first p-side intermediate layer is lower than a change rate along the first direction of the In composition ratio in a center portion along the first direction of the first n-side intermediate layer.

19. A semiconductor light emitting device, comprising:

an n-type semiconductor layer;

a p-type semiconductor layer; and

a light emitting part provided between the n-type semiconductor layer and the p-type semiconductor layer and including a first light emitting layer,

the first light emitting layer including:

a first barrier layer including a nitride semiconductor;

a first well layer provided between the n-type semiconductor layer and the first barrier layer and including a nitride semiconductor;

a first n-side intermediate layer provided between the first well layer and the first barrier layer and including a nitride semiconductor; and

a first p-side intermediate layer provided between the first n-side intermediate layer and the first barrier layer and including a nitride semiconductor;

an In composition ratio among group III elements in the first n-side intermediate layer decreasing along a first direction from the n-type semiconductor layer toward the p-type semiconductor layer,

an In composition ratio among group III elements in the first p-side intermediate layer decreasing along the first direction,

an average change rate along the first direction of the In composition ratio in the first p-side intermediate layer being lower than an average change rate along the first direction of the In composition ratio in the first n-side intermediate layer, and

wherein a band gap energy of the first well layer is smaller than a band gap energy of the first barrier layer.