Interconnection elements with encased interconnects
An interconnection element is disclosed that includes a plurality of drawn metal conductors, a dielectric layer, and opposed surfaces having a plurality of wettable contacts thereon. The conductors may include grains having lengths oriented in a direction between the first and second ends of the conductors. A dielectric layer for insulating the conductors may have first and second opposed surfaces and a thickness less than 1 millimeter between the first and second surface. One or more conductors may be configured to carry a signal to or from a microelectronic element. First and second wettable contacts may be used to bond the interconnection element to at least one of a microelectronic element and a circuit panel. The wettable contacts may match a spatial distribution of element contacts at a face of a microelectronic element or of circuit contacts exposed at a face of component other than the microelectronic element.
1. An interconnection element, comprising:
a plurality of drawn metal conductors each having a structure in which grains therein have lengths oriented in a direction between first and second ends thereof; and
a dielectric layer surrounding and insulating the conductors, the dielectric layer being comprised of a plurality of treated dielectric rods having outer circumferences directly bonded to each other, the dielectric layer having first and second opposed surfaces and a thickness less than 1 millimeter between the first and second surfaces, wherein the first and second ends of each conductor are not covered by the dielectric layer at the first and second surfaces, at least one of the conductors being configured for carrying a signal to or from a microelectronic element;
the interconnection element having first and second pluralities of wettable contacts adjacent the first and second opposed surfaces, respectively, the first and second wettable contacts being usable to bond the interconnection element to at least one of a microelectronic element and a circuit panel, at least one of the first wettable contacts or the second wettable contacts matching a spatial distribution of element contacts at a face of the microelectronic element and at least one of the first wettable contacts or the second wettable contacts matching a spatial distribution of circuit contacts exposed at a face of a component other than the microelectronic element.
2. The interconnection element of claim 1 , wherein a tolerance for a cross-sectional width of the metal conductors is 1 micron for a 50 micron width or diameter.
3. The interconnection element of claim 1 , wherein a surface roughness of the metal conductors is less than 1 micron.
4. The interconnection element of claim 1 , wherein the metal conductors are comprised of a metal alloy.
5. The interconnection element of claim 1 , wherein a thickness of the metal conductors is less than 0.5 millimeters.
6. The interconnection element of claim 1 , wherein a thickness of the conductors is less than 100 microns.
7. The interconnection element of claim 1 , wherein the conductors have annular shape.
8. The interconnection element of claim 7 , wherein each conductor surrounds a dielectric core.
9. The interconnection element of claim 7 , wherein the conductors are hollow.
10. The interconnection element of claim 9 , wherein air or gas is inside of the conductors.
11. The interconnection element of claim 1 , wherein the first wettable contacts define a first pitch and wherein the second wettable contacts define a second pitch that is different from the first pitch.
12. An interconnection element, comprising:
a plurality of drawn metal conductors each having a structure in which grains therein have lengths oriented in a direction between first and second ends thereof;
a common metal region comprised of a plurality of annular components, the plurality of annular components having outer circumferences directly bonded to each other and each of the plurality of annular components surrounding an individual one of the plurality of drawn metal conductors, the common metal region being extruded along an entire length of the plurality of drawn metal conductors, the common metal region forming an outer boundary of the interconnection element and configured to carry a common electric potential; and
a dielectric layer separating the individual ones of the conductors from the common metal region, the dielectric having first and second opposed surfaces and a thickness less than 0.5 millimeters between the first and second surfaces, wherein the first and second ends of each conductor are not covered by the dielectric layer at the first and second surfaces;
wherein the interconnection element has first and second pluralities of wettable contacts adjacent the first and second opposed surfaces, respectively, the first and second wettable contacts being usable to bond the interconnection element to at least one of a microelectronic element and a circuit panel, at least one of the first wettable contacts or the second wettable contacts matching a spatial distribution of element contacts at a face of a microelectronic element or matching a spatial distribution of circuit contacts at a face of a circuit panel.
13. The interconnection element of claim 12 , wherein a tolerance for a cross-sectional width of the metal conductors is 1 micron for a 50 micron width or diameter.
14. The interconnection element of claim 12 , wherein a surface roughness of the metal conductors is less than 1 micron.
15. The interconnection element of claim 12 , wherein the metal conductors are comprised of a metal alloy.
16. The interconnection element of claim 12 , wherein a thickness of the metal conductors is less than 0.5 millimeters.
17. The interconnection element of claim 12 , wherein a thickness of the conductors is less than 100 microns.
18. The interconnection element of claim 12 , wherein the first wettable contacts define a first pitch and wherein the second wettable contacts define a second pitch that is different from the first pitch.
19. A system comprising:
a microelectronic package comprising the interconnection element of claims 1 or 12 , and wherein the second wettable contacts are bonded to a microelectronic element; and
one or more other electronic components electrically connected with the package.
20. A system as claimed in claim 19 further comprising a housing, the package and the one or more other electronic components being mounted to the housing.
21. The interconnection element of claim 1 , wherein the plurality of drawn metal conductors are substantially comprised of at least one material selected from a group consisting of: gold, copper, copper alloy, and nickel.
22. The interconnection element of claim 12 , wherein the plurality of drawn metal conductors are substantially comprised of at least one material selected from a group consisting of: gold, copper, copper alloy, and nickel.
23. The interconnection element of claim 1 , wherein the dielectric rods are extruded along a length substantially similar to an entire length of the plurality of drawn metal conductors.