Semiconductor light emitting device, nitride semiconductor wafer, and method for manufacturing nitride semiconductor layer
View Patent ↗According to one embodiment, a semiconductor light emitting device includes: first and second semiconductor layers, a light emitting part, and an In-containing layer. The first semiconductor layer is formed on a silicon substrate via a foundation layer. The light emitting part is provided on the first semiconductor layer, and includes barrier layers and a well layer provided between the barrier layers including Ga 1−z1 In z1 N (0<z 1 ≦1). The second semiconductor layer is provided on the light emitting part. The In-containing layer is provided at at least one of first and second positions. The first position is between the first semiconductor layer and the light emitting part. The second position is between the second semiconductor layer and the light emitting part. The In-containing layer includes In with a composition ratio different from the In composition ratio z 1 and has a thickness 10 nm to 1000 nm.
1. A method for manufacturing a nitride semiconductor layer comprising:
forming a first semiconductor layer of a first conductivity type including a nitride semiconductor on a foundation layer provided on a silicon substrate, the foundation layer including a plurality of GaN layers and a plurality of AlN layers, the GaN layers and the AlN layers being alternately stacked;
forming, on the first semiconductor layer, a light emitting part including a plurality of barrier layers and a well layer provided between the barrier layers, the well layer including Ga 1−z1 In z1 N (0<z1≦1);
forming, on the light emitting part, a second semiconductor layer of a second conductivity type different from the first conductivity type, the second semiconductor layer including a nitride semiconductor; and
forming an In-containing layer at a position of at least one of first and second positions, the first position being between the first semiconductor layer and the light emitting part, the second position being between the second semiconductor layer and the light emitting part,
the In-containing layer including a nitride semiconductor containing In with an In composition ratio different from the In composition ratio z1 included in the well layer and having a thickness not less than 10 nanometers and not more than 1000 nanometers, wherein
the silicon substrate has an upward protrusion during the forming of the In-containing layer and the upward protrusion of the silicon substrate decreases towards flat when a temperature of the silicon substrate returns to room temperature after the forming of the In-containing layer.
2. The method according to claim 1 , wherein:
forming the In-containing layer includes forming a plurality of first layers including Ga 1−x2 In x2 N (0<x2≦1), and
forming a plurality of second layers including Ga 1−x3 In x3 N (0≦x3≦1, x3<x2) so that the first layers and the second layers are alternately stacked.
3. The method according to claim 1 , wherein forming the In-containing layer includes forming the In-containing layer between the first semiconductor layer and the light emitting part.
4. The method according to claim 1 , wherein the forming the first semiconductor layer includes forming the first semiconductor layer on the foundation layer that has a thickness not less than 2 nanometers and not more than 100 nanometers and that includes an Al-containing layer including a nitride semiconductor containing Al.
5. The method according to claim 4 , wherein:
the Al-containing layer has an uneven part provided on a face of the Al-containing layer, and
a surface roughness Ra of the uneven part is not less than 1 nanometer and not more than 10 nanometers.
6. The method according to claim 5 , wherein the Al-containing layer has a dotted configuration.
7. The method according to claim 1 , wherein a peak wavelength of light emitted from the light emitting part is not less than 380 nanometers and not more than 650 nanometers.