Etched surface mount islands in a leadframe package
A method of fabricating a leadframe-based semiconductor package, and a semiconductor package formed thereby, are disclosed. The semiconductor package includes a leadframe and one or more semiconductor die affixed to a die paddle of the leadframe. The leadframe is formed with a plurality of electrical terminals that get surface mounted to a host PCB. The leadframe further includes one or more extended leads, at least one of which includes an electrically conductive island which gets surface mounted to the host PCB with the electrical terminals. The islands effectively increase the number terminals within the package without adding footprint to the package.
1. A leadframe package, comprising:
a leadframe including electrical terminals, electrical leads and electrically conductive islands, an top surface and a bottom surface, the lower surface being half-etched to define the electrical leads at a first elevation on the bottom surface of the leadframe and the electrical terminals and the electrically conductive islands at a second elevation on the bottom surface of the leadframe, one island of the electrically conductive islands connected to at least one other electrical terminal of the electrical terminals or another island of the electrically conductive islands by the electrical leads at the first elevation;
one or more semiconductor die affixed to the top surface of the leadframe and electrically coupled to the electrical terminals and the electrical leads; and
a molding compound for encapsulating the one or more semiconductor die, the electrical leads, and a portion of the electrical terminals and electrically conductive islands, a surface of the electrical terminals and the electrically conductive islands being exposed at a bottom surface of the molding compound.
2. The leadframe package as recited in claim 1 , wherein one of the electrical leads includes a first end extending toward a center of the leadframe from a corner of the leadframe.
3. The leadframe package as recited in claim 2 , wherein the electrical lead includes a second end coupled to one of the electrical terminals.
4. The leadframe package as recited in claim 2 , wherein the electrical lead includes a free floating second end.
5. The leadframe package as recited in claim 1 , wherein one of the electrical leads includes a first end coupled to a first electrical terminal of the electrical terminals.
6. The leadframe package as recited in claim 5 , wherein the electrical lead includes a second end coupled to a second electrical terminal of the electrical terminals.
7. The leadframe package as recited in claim 5 , wherein the electrical lead includes a free floating second end.
8. The leadframe package as recited in claim 1 , further comprising a plurality of wires connected between the one or more semiconductor die and the electrical terminals and at least one wire connected between the one or more semiconductor die and the electrical leads.
9. The leadframe package as recited in claim 8 , wherein the at least one wire connected between the one or more semiconductor die and the electrical leads is only one wire.
10. The leadframe package as recited in claim 8 , wherein the at least one wire connected between the one or more semiconductor die and the electrical leads is a plurality of wires.
11. A leadframe package, comprising:
a leadframe including electrical terminals, electrical leads and electrically conductive islands, an top surface and a bottom surface, the lower surface being half-etched to define the electrical leads residing in a first plane of the electrical terminals and electrically conductive islands in a second plane different than the first plane, one island of the electrically conductive islands connected to at least one other electrical terminal of the electrical terminals or another island of the electrically conductive islands by the electrical leads in the first plane;
one or more semiconductor die affixed to the top surface of the leadframe and electrically coupled to the electrical terminals and the electrical leads; and
a molding compound for encapsulating the one or more semiconductor die, the electrical leads, and a portion of the electrical terminals and electrically conductive islands, a surface of the electrical terminals and the electrically conductive islands being exposed at a bottom surface of the molding compound.
12. The leadframe package as recited in claim 11 , wherein one of the electrical leads includes a first end extending toward a center of the leadframe from a corner of the leadframe.
13. The leadframe package as recited in claim 12 , wherein the electrical lead includes a second end coupled to one of the electrical terminals.
14. The leadframe package as recited in claim 12 , wherein the electrical lead includes a free floating second end.
15. The leadframe package as recited in claim 12 , further comprising a plurality of wires connected between the one or more semiconductor die and the electrical terminals and at least one wire connected between the one or more semiconductor die and the electrical leads.
16. The leadframe package as recited in claim 15 , wherein the at least one wire connected between the one or more semiconductor die and the electrical leads is only one wire.