IP Library Granted Patent US 8,455,917
Granted Patent B2
US 8,455,917 · App. 13/221,456 · Granted Jun 4, 2013

Nitride semiconductor light emitting device

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,455,917
App. No.
13/221,456
Granted
Jun 4, 2013
Kind
B2
Abstract

According to one embodiment, in a nitride semiconductor light emitting device, a first clad layer includes an n-type nitride semiconductor. An active layer is formed on the first clad layer, and includes an In-containing nitride semiconductor. A GaN layer is formed on the active layer. A first AlGaN layer is formed on the GaN layer, and has a first Al composition ratio. A p-type second AlGaN layer is formed on the first AlGaN layer, has a second Al composition ratio higher than the first Al composition ratio, and contains a larger amount of Mg than the GaN layer and the first AlGaN layer. A second clad layer is formed on the second AlGaN layer, and includes a p-type nitride semiconductor.

Claims (16)

1. A nitride semiconductor light emitting device, comprising:

a first layer including an n-type nitride semiconductor;

an active layer formed on the first layer, and including an In-containing nitride semiconductor;

a GaN layer formed on the active layer;

a first AlGaN layer formed on the GaN layer, and having a first Al composition ratio;

a p-type second AlGaN layer formed on the first AlGaN layer, having a second Al composition ratio higher than the first Al composition ratio, and containing a larger amount of Mg than the GaN layer and the first AlGaN layer; and

a second layer formed on the second AlGaN layer, and including a p-type nitride semiconductor.

2. The nitride semiconductor light emitting device according to claim 1 , wherein the first Al composition ratio is greater than 0 and not greater than 0.01.

3. The nitride semiconductor light emitting device according to claim 1 , wherein a concentration of Mg in each of the GaN layer and the first AlGaN layer is not greater than 1E18 cm −3 .

4. The nitride semiconductor light emitting device according to claim 1 , wherein the first AlGaN layer has a smaller thickness than the GaN layer.

5. The nitride semiconductor light emitting device according to claim 1 , wherein

the active layer has a quantum well structure in which a barrier layer and a well layer are stacked, and

a layer in contact with the GaN layer is the well layer.

6. The nitride semiconductor light emitting device according to claim 1 , wherein a concentration of Mg in the GaN layer is not greater than 1E18 cm −3 .

7. The nitride semiconductor light emitting device according to claim 1 , wherein a concentration of Mg in the first AlGaN layer is not greater than 1E18 cm −3 .

8. The nitride semiconductor light emitting device according to claim 1 , wherein a concentration of Mg in the GaN layer is not greater than 1E18 cm −3 , the first AlGaN layer is formed on the GaN layer, the first Al composition ratio is greater than 0 and not greater than 0.01, a concentration of Mg in the first AlGaN layer is not greater than 1E18 cm −3 and the first AlGaN layer has a smaller thickness than the GaN layer.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 30, 2018
From: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 046986/0159 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 14, 2018
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
Reel/Frame 046364/0164 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 22, 2011
From: NAGO, HAJIME; TACHIBANA, KOICHI; OKA, TOSHIYUKI; KIMURA, SHIGEYA; NUNOUE, SHINYA
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 027269/0629 →